Part Details for XC7A200T-L2FBG484E by AMD
Results Overview of XC7A200T-L2FBG484E by AMD
- Distributor Offerings: (8 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (1 option)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
XC7A200T-L2FBG484E Information
XC7A200T-L2FBG484E by AMD is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for XC7A200T-L2FBG484E
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
47AC6439
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Newark | Fpga, 215360 Logic Cells, Fcbga-484, Fpga Type:Sram Based Fpga, No. Of Logic Cells:215360Logic Cells, Ic Case/Package:Fcbga, No. Of Pins:484Pins, Speed Grade:2L, No.of User I/Os:285I/O S, Process Technology:28Nm (Hkmg) Rohs Compliant: Yes |Amd XC7A200T-L2FBG484E RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 1 Container: Bulk | 0 |
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$321.9700 | Buy Now |
DISTI #
XC7A200T-L2FBG484E-ND
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DigiKey | IC FPGA 285 I/O 484FCBGA Min Qty: 1 Lead time: 16 Weeks Container: Tray | Temporarily Out of Stock |
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$331.5000 | Buy Now |
DISTI #
XC7A200T-L2FBG484E
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Avnet Americas | FPGA, Artix-7, MMCM, PLL, 285 I/O's, 394 MHz, 215360 Cells, 950 mV to 1.05 V, FCBGA-484, NCNR - Trays (Alt: XC7A200T-L2FBG484E) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 16 Weeks, 0 Days Container: Tray | 0 |
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$293.2500 | Buy Now |
DISTI #
217-7A200T-L2FBG484E
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Mouser Electronics | FPGA - Field Programmable Gate Array XC7A200T-L2FBG484E RoHS: Compliant | 2 |
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$321.9700 | Buy Now |
DISTI #
XC7A200T-L2FBG484E
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Avnet Asia | FPGA, Artix-7, MMCM, PLL, 285 I/O's, 394 MHz, 215360 Cells, 950 mV to 1.05 V, FCBGA-484, NCNR (Alt: XC7A200T-L2FBG484E) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 16 Weeks, 0 Days | 0 |
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$300.0000 / $364.2857 | Buy Now |
DISTI #
XC7A200T-L2FBG484E
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Avnet Silica | FPGA Artix7 MMCM PLL 285 IOs 394 MHz 215360 Cells 950 mV to 105 V FCBGA484 NCNR (Alt: XC7A200T-L2FBG484E) RoHS: Compliant Min Qty: 1 Package Multiple: 60 Lead time: 17 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
DISTI #
XC7A200T-L2FBG484E
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EBV Elektronik | FPGA Artix7 MMCM PLL 285 IOs 394 MHz 215360 Cells 950 mV to 105 V FCBGA484 NCNR (Alt: XC7A200T-L2FBG484E) RoHS: Compliant Min Qty: 2 Package Multiple: 60 Lead time: 18 Weeks, 0 Days | EBV - 0 |
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Buy Now | |
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Win Source Electronics | IC FPGA 285 I/O 484FCBGA / Artix-7 Field Programmable Gate Array (FPGA) IC 285 13455360 215360 484-BBGA, FCBGA | 2100 |
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$80.5162 / $99.0967 | Buy Now |
Part Details for XC7A200T-L2FBG484E
XC7A200T-L2FBG484E CAD Models
XC7A200T-L2FBG484E Part Data Attributes
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XC7A200T-L2FBG484E
AMD
Buy Now
Datasheet
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Compare Parts:
XC7A200T-L2FBG484E
AMD
Field Programmable Gate Array, 16825 CLBs, 1286MHz, 215360-Cell, CMOS, PBGA484,
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
Package Description | BGA-484 | |
Reach Compliance Code | compliant | |
Factory Lead Time | 16 Weeks | |
Samacsys Manufacturer | AMD | |
Additional Feature | ALSO OPERATES AT 1V SUPPLY | |
Clock Frequency-Max | 1286 MHz | |
Combinatorial Delay of a CLB-Max | 1.51 ns | |
JESD-30 Code | S-PBGA-B484 | |
JESD-609 Code | e1 | |
Length | 23 mm | |
Moisture Sensitivity Level | 4 | |
Number of CLBs | 16825 | |
Number of Inputs | 285 | |
Number of Logic Cells | 215360 | |
Number of Outputs | 285 | |
Number of Terminals | 484 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | ||
Organization | 16825 CLBS | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA484,22X22,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | 250 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Qualification Status | Not Qualified | |
Seated Height-Max | 2.54 mm | |
Supply Voltage-Max | 0.93 V | |
Supply Voltage-Min | 0.87 V | |
Supply Voltage-Nom | 0.9 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 23 mm |
Alternate Parts for XC7A200T-L2FBG484E
This table gives cross-reference parts and alternative options found for XC7A200T-L2FBG484E. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XC7A200T-L2FBG484E, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Manufacturer | Composite Price | Description | Compare |
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XC7A200T-2LFBG484C | AMD | Check for Price | Field Programmable Gate Array, | XC7A200T-L2FBG484E vs XC7A200T-2LFBG484C |
XC7A200T-L2FBG484E Frequently Asked Questions (FAQ)
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The maximum operating frequency of the XC7A200T-L2FBG484E is 500 MHz, but it depends on the specific application, clock domain, and design implementation.
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To optimize power consumption, use the Xilinx Power Estimator (XPE) tool, enable power gating, reduce clock frequency, use low-power modes, and optimize the design for minimal resource utilization.
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The main difference is the package type and pin count. The XC7A200T-L2FBG484E has a BGA484 package with 484 pins, while the XC7A200T-L2FBG676E has a BGA676 package with 676 pins. This affects the number of available I/Os and the overall design complexity.
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Yes, the XC7A200T-L2FBG484E is suitable for high-reliability applications, such as aerospace, defense, and industrial control systems, due to its ruggedized design, error correction capabilities, and compliance with various industry standards.
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To ensure signal integrity, use the Xilinx Signal Integrity (SI) tool, follow PCB design guidelines, use differential signaling, add termination resistors, and optimize the design for minimal signal degradation.