Datasheets
XC7A200T-2SBG484C by:

Field Programmable Gate Array, 16825 CLBs, 1286MHz, 215360-Cell, CMOS, PBGA484, FBGA-484

Part Details for XC7A200T-2SBG484C by AMD Xilinx

Results Overview of XC7A200T-2SBG484C by AMD Xilinx

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Applications Computing and Data Storage

XC7A200T-2SBG484C Information

XC7A200T-2SBG484C by AMD Xilinx is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.

Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.

Price & Stock for XC7A200T-2SBG484C

Part # Distributor Description Stock Price Buy
MacroQuest Electronics FPGA Artix-7 Family 215360 Cells 28nm Technology 1V 484-Pin FCBGA 300
  • 1 $286.3500
  • 84 $259.2300
  • 420 $232.1100
$232.1100 / $286.3500 Buy Now
Vyrian Programmable ICs 24
RFQ
Win Source Electronics IC FPGA ARTIX7 285 I/O 484FCBGA / FPGA Artix-7 Family 215360 Cells 28nm Technology 1V 484-Pin Lidless FCBGA Tray 2600
  • 1 $83.2087
  • 2 $77.8405
  • 3 $75.1563
  • 4 $69.7880
  • 5 $67.1039
  • 6 $64.4198
$64.4198 / $83.2087 Buy Now

Part Details for XC7A200T-2SBG484C

XC7A200T-2SBG484C CAD Models

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XC7A200T-2SBG484C Part Data Attributes

XC7A200T-2SBG484C AMD Xilinx
Buy Now Datasheet
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XC7A200T-2SBG484C AMD Xilinx Field Programmable Gate Array, 16825 CLBs, 1286MHz, 215360-Cell, CMOS, PBGA484, FBGA-484
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer XILINX INC
Part Package Code BGA
Pin Count 484
Reach Compliance Code compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01
Factory Lead Time 65 Weeks
Clock Frequency-Max 1286 MHz
Combinatorial Delay of a CLB-Max 1.05 ns
JESD-30 Code S-PBGA-B484
JESD-609 Code e1
Length 19 mm
Moisture Sensitivity Level 4
Number of CLBs 16825
Number of Inputs 285
Number of Logic Cells 215360
Number of Outputs 285
Number of Terminals 484
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 16825 CLBS
Package Body Material PLASTIC/EPOXY
Package Code FBGA
Package Equivalence Code BGA484,22X22,32
Package Shape SQUARE
Package Style GRID ARRAY, FINE PITCH
Peak Reflow Temperature (Cel) 250
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified
Seated Height-Max 2.44 mm
Supply Voltage-Max 1.05 V
Supply Voltage-Min 0.95 V
Supply Voltage-Nom 1 V
Surface Mount YES
Technology CMOS
Temperature Grade OTHER
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 19 mm

XC7A200T-2SBG484C Related Parts

XC7A200T-2SBG484C Frequently Asked Questions (FAQ)

  • The maximum power consumption of XC7A200T-2SBG484C is approximately 2.5W, but it can vary depending on the design and operating conditions.

  • To optimize power consumption, use the Xilinx Power Estimator (XPE) tool, enable power-saving features like clock gating and dynamic voltage and frequency scaling, and optimize the design for low power consumption.

  • The maximum operating frequency of XC7A200T-2SBG484C is 500 MHz, but it can vary depending on the design and operating conditions.

  • To implement a DDR3 memory interface, use the Xilinx MIG (Memory Interface Generator) tool to generate a DDR3 controller, and follow the Xilinx guidelines for DDR3 interface implementation.

  • The maximum bandwidth of the PCIe interface in XC7A200T-2SBG484C is 8 GT/s (gigatransfers per second), which translates to a bandwidth of 2.5 GB/s per lane.

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