Part Details for XC6SLX9-3CSG324C by AMD
Results Overview of XC6SLX9-3CSG324C by AMD
- Distributor Offerings: (6 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (5 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
XC6SLX9-3CSG324C Information
XC6SLX9-3CSG324C by AMD is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for XC6SLX9-3CSG324C
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
XC6SLX9-3CSG324C-ND
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DigiKey | IC FPGA 200 I/O 324CSBGA Min Qty: 126 Lead time: 12 Weeks Container: Tray | Temporarily Out of Stock |
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$46.6200 | Buy Now |
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DISTI #
XC6SLX9-3CSG324C
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Avnet Americas | - Trays (Alt: XC6SLX9-3CSG324C) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 12 Weeks, 0 Days Container: Tray | 0 |
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$45.6778 | Buy Now |
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DISTI #
217-XC6SLX9-3CSG324C
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Mouser Electronics | FPGA - Field Programmable Gate Array XC6SLX9-3CSG324C RoHS: Compliant | 2 |
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$46.6100 | Buy Now |
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DISTI #
XC6SLX9-3CSG324C
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Avnet Asia | FPGA Spartan-6 LX Family 9152 Cells 45nm (CMOS) Technology 1.2V 324-Pin CS-BGA (Alt: XC6SLX9-3CSG324C) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 12 Weeks, 0 Days | 0 |
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$39.1765 / $66.6000 | Buy Now |
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DISTI #
XC6SLX9-3CSG324C
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Avnet Silica | (Alt: XC6SLX9-3CSG324C) RoHS: Compliant Min Qty: 1 Package Multiple: 126 Lead time: 13 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
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DISTI #
XC6SLX9-3CSG324C
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EBV Elektronik | (Alt: XC6SLX9-3CSG324C) RoHS: Compliant Min Qty: 16 Package Multiple: 126 Lead time: 14 Weeks, 0 Days | EBV - 0 |
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Buy Now |
Part Details for XC6SLX9-3CSG324C
XC6SLX9-3CSG324C CAD Models
XC6SLX9-3CSG324C Part Data Attributes
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XC6SLX9-3CSG324C
AMD
Buy Now
Datasheet
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Compare Parts:
XC6SLX9-3CSG324C
AMD
Field Programmable Gate Array, 715 CLBs, 862MHz, 9152-Cell, CMOS, PBGA324, 15 X 15 MM, 0.80 MM PITCH, LEAD FREE, BGA-324
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Package Description | 15 X 15 MM, 0.80 MM PITCH, LEAD FREE, BGA-324 | |
| Reach Compliance Code | compliant | |
| Factory Lead Time | 12 Weeks | |
| Samacsys Manufacturer | AMD | |
| Clock Frequency-Max | 862 MHz | |
| Combinatorial Delay of a CLB-Max | 0.21 ns | |
| JESD-30 Code | S-PBGA-B324 | |
| JESD-609 Code | e1 | |
| Length | 15 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of CLBs | 715 | |
| Number of Inputs | 200 | |
| Number of Logic Cells | 9152 | |
| Number of Outputs | 200 | |
| Number of Terminals | 324 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Organization | 715 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA324,18X18,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.5 mm | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 15 mm |
Alternate Parts for XC6SLX9-3CSG324C
This table gives cross-reference parts and alternative options found for XC6SLX9-3CSG324C. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XC6SLX9-3CSG324C, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| XA6SLX9-3CSG324Q | AMD | Check for Price | Field Programmable Gate Array, 62.5MHz, 9152-Cell, PBGA324, | XC6SLX9-3CSG324C vs XA6SLX9-3CSG324Q |
| XA6SLX9-2CSG324Q | AMD | Check for Price | Field Programmable Gate Array, 62.5MHz, 9152-Cell, PBGA324, | XC6SLX9-3CSG324C vs XA6SLX9-2CSG324Q |
| XA6SLX9-2CSG324I | AMD | Check for Price | Field Programmable Gate Array, 62.5MHz, 9152-Cell, PBGA324, | XC6SLX9-3CSG324C vs XA6SLX9-2CSG324I |
| XA6SLX9-3CSG324I | AMD | Check for Price | Field Programmable Gate Array, 62.5MHz, 9152-Cell, PBGA324, | XC6SLX9-3CSG324C vs XA6SLX9-3CSG324I |
| XC6SLX9-3CSG324I | AMD | Check for Price | Field Programmable Gate Array, 715 CLBs, 862MHz, 9152-Cell, CMOS, PBGA324, 15 X 15 MM, 0.80 MM PITCH, LEAD FREE, BGA-324 | XC6SLX9-3CSG324C vs XC6SLX9-3CSG324I |
XC6SLX9-3CSG324C Frequently Asked Questions (FAQ)
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The maximum operating frequency of the XC6SLX9-3CSG324C is 350 MHz, but it depends on the specific application, clock domain, and design implementation.
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To optimize power consumption, use the Xilinx Power Estimator (XPE) tool, enable power-saving features like clock gating and dynamic voltage scaling, and optimize your design for low power consumption using techniques like pipelining and parallel processing.
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The XC6SLX9-3CSG324C has a total of 4.8 Mb of Block RAM, 576 Kb of distributed RAM, and 128 Kb of configuration memory.
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Yes, the XC6SLX9-3CSG324C has built-in support for high-speed serial interfaces like PCIe Gen1, SATA, and Gigabit Ethernet, making it suitable for high-speed applications.
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To ensure signal integrity and reduce noise, use the Xilinx ISE Design Suite to analyze and optimize your design for signal integrity, and follow best practices for PCB design, such as using differential pairs, shielding, and decoupling capacitors.