Part Details for XC6SLX75T-3FGG484C by AMD Xilinx
Results Overview of XC6SLX75T-3FGG484C by AMD Xilinx
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (5 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Computing and Data Storage
XC6SLX75T-3FGG484C Information
XC6SLX75T-3FGG484C by AMD Xilinx is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for XC6SLX75T-3FGG484C
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
SMC-XC6SLX75T-3FGG484C
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Sensible Micro Corporation | OEM Excess 5-7 Days Leadtime, We are an AS6081 Certified Vendor, 1 Yr Warranty RoHS: Not Compliant Min Qty: 25 Lead time: 2 Weeks, 0 Days Date Code: 2205 Container: Trays | 1135 |
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RFQ | |
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Vyrian | Programmable ICs | 5 |
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RFQ |
Part Details for XC6SLX75T-3FGG484C
XC6SLX75T-3FGG484C CAD Models
XC6SLX75T-3FGG484C Part Data Attributes
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XC6SLX75T-3FGG484C
AMD Xilinx
Buy Now
Datasheet
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Compare Parts:
XC6SLX75T-3FGG484C
AMD Xilinx
Field Programmable Gate Array, 5831 CLBs, 862MHz, 74637-Cell, CMOS, PBGA484, 23 X 23 MM, 1 MM PITCH, LEAD FREE, FBGA-484
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 23 X 23 MM, 1 MM PITCH, LEAD FREE, FBGA-484 | |
| Pin Count | 484 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 | |
| Clock Frequency-Max | 862 MHz | |
| Combinatorial Delay of a CLB-Max | 0.21 ns | |
| JESD-30 Code | S-PBGA-B484 | |
| JESD-609 Code | e1 | |
| Length | 23 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of CLBs | 5831 | |
| Number of Inputs | 268 | |
| Number of Logic Cells | 74637 | |
| Number of Outputs | 268 | |
| Number of Terminals | 484 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Organization | 5831 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA484,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 250 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.6 mm | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 23 mm |
Alternate Parts for XC6SLX75T-3FGG484C
This table gives cross-reference parts and alternative options found for XC6SLX75T-3FGG484C. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XC6SLX75T-3FGG484C, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| XC6SLX75T-3FGG484I | AMD Xilinx | $117.2900 | Field Programmable Gate Array, 5831 CLBs, 862MHz, 74637-Cell, CMOS, PBGA484, 23 X 23 MM, 1 MM PITCH, LEAD FREE, FBGA-484 | XC6SLX75T-3FGG484C vs XC6SLX75T-3FGG484I |
| XC6SLX75T-3FGG484I | AMD | Check for Price | Field Programmable Gate Array, 5831 CLBs, 862MHz, 74637-Cell, CMOS, PBGA484, 23 X 23 MM, 1 MM PITCH, LEAD FREE, FBGA-484 | XC6SLX75T-3FGG484C vs XC6SLX75T-3FGG484I |
| XC6SLX75T-3FG484C | AMD | Check for Price | Field Programmable Gate Array, 5831 CLBs, 862MHz, 74637-Cell, CMOS, PBGA484, 23 X 23 MM, 1 MM PITCH, FBGA-484 | XC6SLX75T-3FGG484C vs XC6SLX75T-3FG484C |
| XC6SLX75T-3FG484I | AMD | Check for Price | Field Programmable Gate Array, 5831 CLBs, 862MHz, 74637-Cell, CMOS, PBGA484, 23 X 23 MM, 1 MM PITCH, FBGA-484 | XC6SLX75T-3FGG484C vs XC6SLX75T-3FG484I |
| XC6SLX75T-3FG484C | AMD Xilinx | Check for Price | Field Programmable Gate Array, 5831 CLBs, 862MHz, 74637-Cell, CMOS, PBGA484, 23 X 23 MM, 1 MM PITCH, FBGA-484 | XC6SLX75T-3FGG484C vs XC6SLX75T-3FG484C |
XC6SLX75T-3FGG484C Frequently Asked Questions (FAQ)
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The maximum power consumption of XC6SLX75T-3FGG484C is approximately 1.5W, but it can vary depending on the design and operating conditions.
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You can implement DDR3 memory interface with XC6SLX75T-3FGG484C using the MIG (Memory Interface Generator) tool provided by Xilinx. The tool generates a customized DDR3 memory controller IP core that can be integrated into your design.
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The maximum clock frequency supported by XC6SLX75T-3FGG484C is 450 MHz, but it can vary depending on the design and operating conditions.
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You can optimize the power consumption of XC6SLX75T-3FGG484C by using power-saving features such as clock gating, voltage scaling, and dynamic voltage and frequency scaling. Additionally, you can use the Xilinx Power Estimator (XPE) tool to estimate and optimize power consumption.
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The XC6SLX75T-3FGG484C has a total of 360 user I/Os, which can be configured as inputs, outputs, or bidirectional signals.