Part Details for XC6SLX75-3FGG676I by AMD Xilinx
Results Overview of XC6SLX75-3FGG676I by AMD Xilinx
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (1 replacement)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
XC6SLX75-3FGG676I Information
XC6SLX75-3FGG676I by AMD Xilinx is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for XC6SLX75-3FGG676I
Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | 21 |
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RFQ | ||
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Quest Components | FIELD PROGRAMMABLE GATE ARRAY, 5831 CLBS, 862MHZ, 74637-CELL, CMOS, PBGA676 | 15 |
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$74.8221 / $88.0260 | Buy Now |
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Vyrian | Programmable ICs | 60 |
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RFQ | |
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Win Source Electronics | IC FPGA 408 I/O 676FBGA | 627 |
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$70.9043 / $87.2672 | Buy Now |
Part Details for XC6SLX75-3FGG676I
XC6SLX75-3FGG676I CAD Models
XC6SLX75-3FGG676I Part Data Attributes
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XC6SLX75-3FGG676I
AMD Xilinx
Buy Now
Datasheet
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XC6SLX75-3FGG676I
AMD Xilinx
Field Programmable Gate Array, 5831 CLBs, 862MHz, 74637-Cell, CMOS, PBGA676, 27 X 27 MM, 1 MM PITCH, LEAD FREE, FBGA-676
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | 27 X 27 MM, 1 MM PITCH, LEAD FREE, FBGA-676 | |
Pin Count | 676 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.D | |
HTS Code | 8542.39.00.01 | |
Clock Frequency-Max | 862 MHz | |
Combinatorial Delay of a CLB-Max | 0.21 ns | |
JESD-30 Code | S-PBGA-B676 | |
JESD-609 Code | e1 | |
Length | 27 mm | |
Moisture Sensitivity Level | 3 | |
Number of CLBs | 5831 | |
Number of Inputs | 408 | |
Number of Logic Cells | 74637 | |
Number of Outputs | 408 | |
Number of Terminals | 676 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 5831 CLBS | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA676,26X26,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | 250 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Qualification Status | Not Qualified | |
Seated Height-Max | 2.44 mm | |
Supply Voltage-Max | 1.26 V | |
Supply Voltage-Min | 1.14 V | |
Supply Voltage-Nom | 1.2 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 27 mm |
Alternate Parts for XC6SLX75-3FGG676I
This table gives cross-reference parts and alternative options found for XC6SLX75-3FGG676I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XC6SLX75-3FGG676I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Manufacturer | Composite Price | Description | Compare |
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XC6SLX75-3FG676I | AMD | Check for Price | Field Programmable Gate Array, 5831 CLBs, 862MHz, 74637-Cell, CMOS, PBGA676, 27 X 27 MM, 1 MM PITCH, FBGA-676 | XC6SLX75-3FGG676I vs XC6SLX75-3FG676I |
XC6SLX75-3FGG676I Frequently Asked Questions (FAQ)
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The maximum power consumption of the XC6SLX75-3FGG676I is approximately 1.5W, but this can vary depending on the specific application and operating conditions.
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To implement a CDC in the XC6SLX75-3FGG676I, you can use the Xilinx-provided IP cores, such as the Clock Domain Crossing (CDC) IP, or implement a custom CDC using asynchronous FIFOs and synchronization logic.
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The maximum frequency of the XC6SLX75-3FGG676I depends on the specific application and operating conditions, but it can operate at frequencies up to 400 MHz.
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To optimize power consumption, use the Xilinx Power Estimator (XPE) tool to estimate power consumption, and then apply power-saving techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling (DVFS).
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The XC6SLX75-3FGG676I has a total of 676 I/O pins, but the number of available I/O pins depends on the specific package and configuration.