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Field Programmable Gate Array, 1879 CLBs, 862MHz, 24051-Cell, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, LEAD FREE, FBGA-256
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
XC6SLX25-3FTG256I by AMD is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
XC6SLX25-3FTG256I-ND
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DigiKey | IC FPGA 186 I/O 256FTBGA Min Qty: 1 Lead time: 12 Weeks Container: Tray |
1 In Stock |
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$74.6200 | Buy Now |
DISTI #
XC6SLX25-3FTG256I
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Avnet Americas | - Trays (Alt: XC6SLX25-3FTG256I) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 12 Weeks, 0 Days Container: Tray | 0 |
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$69.1028 | Buy Now |
DISTI #
217-C6SLX25-3FTG256I
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Mouser Electronics | FPGA - Field Programmable Gate Array XC6SLX25-3FTG256I RoHS: Compliant | 89 |
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$83.5700 | Buy Now |
DISTI #
XC6SLX25-3FTG256I
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Avnet Asia | FPGA Spartan-6 LX Family 24051 Cells 45nm (CMOS) Technology 1.2V 256-Pin FTBGA (Alt: XC6SLX25-3FTG256I) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 12 Weeks, 0 Days | 5 |
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$70.2353 / $99.5000 | Buy Now |
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XC6SLX25-3FTG256I
AMD
Buy Now
Datasheet
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Compare Parts:
XC6SLX25-3FTG256I
AMD
Field Programmable Gate Array, 1879 CLBs, 862MHz, 24051-Cell, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, LEAD FREE, FBGA-256
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
Package Description | 17 X 17 MM, 1 MM PITCH, LEAD FREE, FBGA-256 | |
Reach Compliance Code | compliant | |
Factory Lead Time | 12 Weeks | |
Samacsys Manufacturer | AMD | |
Clock Frequency-Max | 862 MHz | |
Combinatorial Delay of a CLB-Max | 0.21 ns | |
JESD-30 Code | S-PBGA-B256 | |
JESD-609 Code | e1 | |
Length | 17 mm | |
Moisture Sensitivity Level | 3 | |
Number of CLBs | 1879 | |
Number of Inputs | 186 | |
Number of Logic Cells | 24051 | |
Number of Outputs | 186 | |
Number of Terminals | 256 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 1879 CLBS | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA256,16X16,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE | |
Peak Reflow Temperature (Cel) | 260 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.55 mm | |
Supply Voltage-Max | 1.26 V | |
Supply Voltage-Min | 1.14 V | |
Supply Voltage-Nom | 1.2 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 17 mm |
This table gives cross-reference parts and alternative options found for XC6SLX25-3FTG256I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XC6SLX25-3FTG256I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Manufacturer | Composite Price | Description | Compare |
---|---|---|---|---|
XC6SLX25-3FTG256C | AMD Xilinx | $1.7274 | Field Programmable Gate Array, 1879 CLBs, 862MHz, 24051-Cell, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, LEAD FREE, FBGA-256 | XC6SLX25-3FTG256I vs XC6SLX25-3FTG256C |
XC6SLX25-3FTG256I | AMD Xilinx | Check for Price | Field Programmable Gate Array, 1879 CLBs, 862MHz, 24051-Cell, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, LEAD FREE, FBGA-256 | XC6SLX25-3FTG256I vs XC6SLX25-3FTG256I |
The maximum operating frequency of the XC6SLX25-3FTG256I is dependent on the specific design and implementation, but Xilinx recommends a maximum clock frequency of 350 MHz for most applications.
The XC6SLX25-3FTG256I has a built-in DDR3 memory controller that can be implemented using the Xilinx MIG (Memory Interface Generator) tool. The MIG tool provides a GUI-based interface to generate the necessary IP cores and constraints for the DDR3 memory interface.
The power consumption of the XC6SLX25-3FTG256I depends on the specific design and implementation. However, according to the Xilinx datasheet, the typical power consumption of the device is around 1.2W for a typical design. It's recommended to use the Xilinx Power Estimator (XPE) tool to get a more accurate estimate of power consumption for a specific design.
The XC6SLX25-3FTG256I has a built-in PCIe endpoint block that can be used to implement a PCIe interface. Xilinx provides a PCIe IP core that can be used to implement a PCIe interface, and the Xilinx PCIe solution is compliant with the PCIe 2.0 specification.
The XC6SLX25-3FTG256I has a total of 256 user I/Os, which can be used for a variety of interfaces such as PCIe, DDR3, and other peripherals.