Part Details for XC6SLX25-3CSG324I by AMD
Results Overview of XC6SLX25-3CSG324I by AMD
- Distributor Offerings: (6 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (4 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
XC6SLX25-3CSG324I Information
XC6SLX25-3CSG324I by AMD is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for XC6SLX25-3CSG324I
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
XC6SLX25-3CSG324I-ND
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DigiKey | IC FPGA 226 I/O 324CSBGA Min Qty: 126 Lead time: 12 Weeks Container: Tray | Temporarily Out of Stock |
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$101.7800 | Buy Now |
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DISTI #
XC6SLX25-3CSG324I
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Avnet Americas | - Trays (Alt: XC6SLX25-3CSG324I) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 12 Weeks, 0 Days Container: Tray | 0 |
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$99.7346 | Buy Now |
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DISTI #
217-C6SLX25-3CSG324I
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Mouser Electronics | FPGA - Field Programmable Gate Array XC6SLX25-3CSG324I RoHS: Compliant | 12 |
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$101.7700 | Buy Now |
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DISTI #
XC6SLX25-3CSG324I
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Avnet Asia | FPGA Spartan-6 LX Family 24051 Cells 45nm (CMOS) Technology 1.2V 324-Pin CS-BGA (Alt: XC6SLX25-3CSG324I) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 12 Weeks, 0 Days | 0 |
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$85.5294 / $103.8571 | Buy Now |
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DISTI #
XC6SLX25-3CSG324I
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Avnet Silica | (Alt: XC6SLX25-3CSG324I) RoHS: Compliant Min Qty: 1 Package Multiple: 126 Lead time: 13 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
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DISTI #
XC6SLX25-3CSG324I
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EBV Elektronik | (Alt: XC6SLX25-3CSG324I) RoHS: Compliant Min Qty: 7 Package Multiple: 126 Lead time: 14 Weeks, 0 Days | EBV - 0 |
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Buy Now |
Part Details for XC6SLX25-3CSG324I
XC6SLX25-3CSG324I CAD Models
XC6SLX25-3CSG324I Part Data Attributes
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XC6SLX25-3CSG324I
AMD
Buy Now
Datasheet
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Compare Parts:
XC6SLX25-3CSG324I
AMD
Field Programmable Gate Array, 1879 CLBs, 862MHz, 24051-Cell, CMOS, PBGA324, 15 X 15 MM, 0.80 MM PITCH, LEAD FREE, BGA-324
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Package Description | 15 X 15 MM, 0.80 MM PITCH, LEAD FREE, BGA-324 | |
| Reach Compliance Code | compliant | |
| Factory Lead Time | 12 Weeks | |
| Samacsys Manufacturer | AMD | |
| Clock Frequency-Max | 862 MHz | |
| Combinatorial Delay of a CLB-Max | 0.21 ns | |
| JESD-30 Code | S-PBGA-B324 | |
| JESD-609 Code | e1 | |
| Length | 15 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of CLBs | 1879 | |
| Number of Inputs | 226 | |
| Number of Logic Cells | 24051 | |
| Number of Outputs | 226 | |
| Number of Terminals | 324 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 1879 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA324,18X18,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.5 mm | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 15 mm |
Alternate Parts for XC6SLX25-3CSG324I
This table gives cross-reference parts and alternative options found for XC6SLX25-3CSG324I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XC6SLX25-3CSG324I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| XC6SLX25-2CSG324I | AMD | $101.5371 | Field Programmable Gate Array, 1879 CLBs, 667MHz, 24051-Cell, CMOS, PBGA324, 15 X 15 MM, 0.80 MM PITCH, LEAD FREE, BGA-324 | XC6SLX25-3CSG324I vs XC6SLX25-2CSG324I |
| XC6SLX25-2CSG324C | AMD | Check for Price | Field Programmable Gate Array, 1879 CLBs, 667MHz, 24051-Cell, CMOS, PBGA324, 15 X 15 MM, 0.80 MM PITCH, LEAD FREE, BGA-324 | XC6SLX25-3CSG324I vs XC6SLX25-2CSG324C |
| XA6SLX25-3CSG324I | AMD | Check for Price | Field Programmable Gate Array, 62.5MHz, 24051-Cell, PBGA324, | XC6SLX25-3CSG324I vs XA6SLX25-3CSG324I |
| XA6SLX25-2CSG324Q | AMD | Check for Price | Field Programmable Gate Array, 62.5MHz, 24051-Cell, PBGA324, | XC6SLX25-3CSG324I vs XA6SLX25-2CSG324Q |
XC6SLX25-3CSG324I Frequently Asked Questions (FAQ)
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The maximum operating frequency of the XC6SLX25-3CSG324I is 350 MHz, but it depends on the specific application, clock domain, and design implementation.
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To optimize power consumption, use the Xilinx Power Estimator (XPE) tool, enable power-saving features like clock gating and dynamic voltage scaling, and optimize your design for low power consumption using techniques like pipelining and parallel processing.
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The -3 speed grade has a higher maximum operating frequency (350 MHz) compared to the -2 speed grade (250 MHz), but it also consumes more power. Choose the appropriate speed grade based on your design requirements and power constraints.
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Yes, the XC6SLX25-3CSG324I is suitable for high-reliability applications due to its immunity to single-event upsets (SEUs) and its ability to implement triple-mode redundancy (TMR) and other fault-tolerant design techniques.
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To ensure signal integrity, use the Xilinx ISE Design Suite to analyze and optimize your design for signal integrity, and follow best practices for PCB design, such as using differential signaling, adding termination resistors, and minimizing signal routing distances.