Datasheets
XC6SLX25-2CSG324C by:

Field Programmable Gate Array, 1879 CLBs, 667MHz, 24051-Cell, CMOS, PBGA324, 15 X 15 MM, 0.80 MM PITCH, LEAD FREE, BGA-324

Part Details for XC6SLX25-2CSG324C by AMD

Results Overview of XC6SLX25-2CSG324C by AMD

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XC6SLX25-2CSG324C Information

XC6SLX25-2CSG324C by AMD is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.

Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.

Price & Stock for XC6SLX25-2CSG324C

Part # Distributor Description Stock Price Buy
DISTI # 122-1768-ND
DigiKey IC FPGA 226 I/O 324CSBGA Min Qty: 1 Lead time: 12 Weeks Container: Tray 115
In Stock
  • 1 $80.4300
$80.4300 Buy Now
DISTI # 217-C6SLX25-2CSG324C
Mouser Electronics FPGA - Field Programmable Gate Array XC6SLX25-2CSG324C RoHS: Compliant 152
  • 1 $80.4200
$80.4200 Buy Now

Part Details for XC6SLX25-2CSG324C

XC6SLX25-2CSG324C CAD Models

XC6SLX25-2CSG324C Part Data Attributes

XC6SLX25-2CSG324C AMD
Buy Now Datasheet
Compare Parts:
XC6SLX25-2CSG324C AMD Field Programmable Gate Array, 1879 CLBs, 667MHz, 24051-Cell, CMOS, PBGA324, 15 X 15 MM, 0.80 MM PITCH, LEAD FREE, BGA-324
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer ADVANCED MICRO DEVICES INC
Package Description 15 X 15 MM, 0.80 MM PITCH, LEAD FREE, BGA-324
Reach Compliance Code compliant
Factory Lead Time 12 Weeks
Samacsys Manufacturer AMD
Clock Frequency-Max 667 MHz
Combinatorial Delay of a CLB-Max 0.26 ns
JESD-30 Code S-PBGA-B324
JESD-609 Code e1
Length 15 mm
Moisture Sensitivity Level 3
Number of CLBs 1879
Number of Inputs 226
Number of Logic Cells 24051
Number of Outputs 226
Number of Terminals 324
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 1879 CLBS
Package Body Material PLASTIC/EPOXY
Package Code LFBGA
Package Equivalence Code BGA324,18X18,32
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified
Seated Height-Max 1.5 mm
Supply Voltage-Max 1.26 V
Supply Voltage-Min 1.14 V
Supply Voltage-Nom 1.2 V
Surface Mount YES
Technology CMOS
Temperature Grade OTHER
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 15 mm

Alternate Parts for XC6SLX25-2CSG324C

This table gives cross-reference parts and alternative options found for XC6SLX25-2CSG324C. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XC6SLX25-2CSG324C, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
XC6SLX25-2CSG324I AMD $101.5371 Field Programmable Gate Array, 1879 CLBs, 667MHz, 24051-Cell, CMOS, PBGA324, 15 X 15 MM, 0.80 MM PITCH, LEAD FREE, BGA-324 XC6SLX25-2CSG324C vs XC6SLX25-2CSG324I
XC6SLX25-3CSG324I AMD Check for Price Field Programmable Gate Array, 1879 CLBs, 862MHz, 24051-Cell, CMOS, PBGA324, 15 X 15 MM, 0.80 MM PITCH, LEAD FREE, BGA-324 XC6SLX25-2CSG324C vs XC6SLX25-3CSG324I
XA6SLX25-3CSG324I AMD Check for Price Field Programmable Gate Array, 62.5MHz, 24051-Cell, PBGA324, XC6SLX25-2CSG324C vs XA6SLX25-3CSG324I
XA6SLX25-2CSG324Q AMD Check for Price Field Programmable Gate Array, 62.5MHz, 24051-Cell, PBGA324, XC6SLX25-2CSG324C vs XA6SLX25-2CSG324Q

XC6SLX25-2CSG324C Related Parts

XC6SLX25-2CSG324C Frequently Asked Questions (FAQ)

  • The maximum operating frequency of the XC6SLX25 is 350 MHz.

  • You can implement a DDR3 interface on the XC6SLX25 using the MIG (Memory Interface Generator) tool, which generates a customized DDR3 controller IP core.

  • The power consumption of the XC6SLX25 depends on the specific application and usage. However, the typical static power consumption is around 1.2W, and the dynamic power consumption is around 2.5W at 350 MHz.

  • Yes, the XC6SLX25 is suitable for high-reliability applications, such as aerospace, defense, and industrial control systems, due to its radiation-hardened design and error correction capabilities.

  • You can use the Xilinx ChipScope Pro tool to debug and verify your design on the XC6SLX25. This tool provides real-time visibility into the FPGA's internal signals and allows you to set breakpoints and triggers.

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