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Field Programmable Gate Array, 1879 CLBs, 667MHz, 24051-Cell, CMOS, PBGA324, 15 X 15 MM, 0.80 MM PITCH, LEAD FREE, BGA-324
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
XC6SLX25-2CSG324C by AMD is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
122-1768-ND
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DigiKey | IC FPGA 226 I/O 324CSBGA Min Qty: 1 Lead time: 12 Weeks Container: Tray |
115 In Stock |
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$80.4300 | Buy Now |
DISTI #
217-C6SLX25-2CSG324C
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Mouser Electronics | FPGA - Field Programmable Gate Array XC6SLX25-2CSG324C RoHS: Compliant | 152 |
|
$80.4200 | Buy Now |
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XC6SLX25-2CSG324C
AMD
Buy Now
Datasheet
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Compare Parts:
XC6SLX25-2CSG324C
AMD
Field Programmable Gate Array, 1879 CLBs, 667MHz, 24051-Cell, CMOS, PBGA324, 15 X 15 MM, 0.80 MM PITCH, LEAD FREE, BGA-324
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
Package Description | 15 X 15 MM, 0.80 MM PITCH, LEAD FREE, BGA-324 | |
Reach Compliance Code | compliant | |
Factory Lead Time | 12 Weeks | |
Samacsys Manufacturer | AMD | |
Clock Frequency-Max | 667 MHz | |
Combinatorial Delay of a CLB-Max | 0.26 ns | |
JESD-30 Code | S-PBGA-B324 | |
JESD-609 Code | e1 | |
Length | 15 mm | |
Moisture Sensitivity Level | 3 | |
Number of CLBs | 1879 | |
Number of Inputs | 226 | |
Number of Logic Cells | 24051 | |
Number of Outputs | 226 | |
Number of Terminals | 324 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | ||
Organization | 1879 CLBS | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFBGA | |
Package Equivalence Code | BGA324,18X18,32 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.5 mm | |
Supply Voltage-Max | 1.26 V | |
Supply Voltage-Min | 1.14 V | |
Supply Voltage-Nom | 1.2 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | OTHER | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 15 mm |
This table gives cross-reference parts and alternative options found for XC6SLX25-2CSG324C. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XC6SLX25-2CSG324C, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Manufacturer | Composite Price | Description | Compare |
---|---|---|---|---|
XC6SLX25-2CSG324I | AMD | $101.5371 | Field Programmable Gate Array, 1879 CLBs, 667MHz, 24051-Cell, CMOS, PBGA324, 15 X 15 MM, 0.80 MM PITCH, LEAD FREE, BGA-324 | XC6SLX25-2CSG324C vs XC6SLX25-2CSG324I |
XC6SLX25-3CSG324I | AMD | Check for Price | Field Programmable Gate Array, 1879 CLBs, 862MHz, 24051-Cell, CMOS, PBGA324, 15 X 15 MM, 0.80 MM PITCH, LEAD FREE, BGA-324 | XC6SLX25-2CSG324C vs XC6SLX25-3CSG324I |
XA6SLX25-3CSG324I | AMD | Check for Price | Field Programmable Gate Array, 62.5MHz, 24051-Cell, PBGA324, | XC6SLX25-2CSG324C vs XA6SLX25-3CSG324I |
XA6SLX25-2CSG324Q | AMD | Check for Price | Field Programmable Gate Array, 62.5MHz, 24051-Cell, PBGA324, | XC6SLX25-2CSG324C vs XA6SLX25-2CSG324Q |
The maximum operating frequency of the XC6SLX25 is 350 MHz.
You can implement a DDR3 interface on the XC6SLX25 using the MIG (Memory Interface Generator) tool, which generates a customized DDR3 controller IP core.
The power consumption of the XC6SLX25 depends on the specific application and usage. However, the typical static power consumption is around 1.2W, and the dynamic power consumption is around 2.5W at 350 MHz.
Yes, the XC6SLX25 is suitable for high-reliability applications, such as aerospace, defense, and industrial control systems, due to its radiation-hardened design and error correction capabilities.
You can use the Xilinx ChipScope Pro tool to debug and verify your design on the XC6SLX25. This tool provides real-time visibility into the FPGA's internal signals and allows you to set breakpoints and triggers.