Part Details for XC6SLX16-3CSG324C by AMD Xilinx
Results Overview of XC6SLX16-3CSG324C by AMD Xilinx
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (5 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Computing and Data Storage
Telecommunications
XC6SLX16-3CSG324C Information
XC6SLX16-3CSG324C by AMD Xilinx is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for XC6SLX16-3CSG324C
| Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | 27 |
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RFQ | ||
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Quest Components | 24 |
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$40.9632 / $48.1920 | Buy Now | |
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Vyrian | Programmable ICs | 93 |
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RFQ |
Part Details for XC6SLX16-3CSG324C
XC6SLX16-3CSG324C CAD Models
XC6SLX16-3CSG324C Part Data Attributes
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XC6SLX16-3CSG324C
AMD Xilinx
Buy Now
Datasheet
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Compare Parts:
XC6SLX16-3CSG324C
AMD Xilinx
Field Programmable Gate Array, 1139 CLBs, 862MHz, 14579-Cell, CMOS, PBGA324, 15 X 15 MM, 0.80 MM PITCH, LEAD FREE, BGA-324
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 15 X 15 MM, 0.80 MM PITCH, LEAD FREE, BGA-324 | |
| Pin Count | 324 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 | |
| Clock Frequency-Max | 862 MHz | |
| Combinatorial Delay of a CLB-Max | 0.21 ns | |
| JESD-30 Code | S-PBGA-B324 | |
| JESD-609 Code | e1 | |
| Length | 15 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of CLBs | 1139 | |
| Number of Inputs | 232 | |
| Number of Logic Cells | 14579 | |
| Number of Outputs | 232 | |
| Number of Terminals | 324 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Organization | 1139 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA324,18X18,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.5 mm | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 15 mm |
Alternate Parts for XC6SLX16-3CSG324C
This table gives cross-reference parts and alternative options found for XC6SLX16-3CSG324C. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XC6SLX16-3CSG324C, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| XC6SLX16-3CSG324Q | AMD | Check for Price | Field Programmable Gate Array, 1139 CLBs, 14579-Cell, PBGA324, CSBGA-324 | XC6SLX16-3CSG324C vs XC6SLX16-3CSG324Q |
| XC6SLX16-3CSG324Q | AMD Xilinx | Check for Price | Field Programmable Gate Array, | XC6SLX16-3CSG324C vs XC6SLX16-3CSG324Q |
| XC6SLX16-3CSG324I | AMD Xilinx | Check for Price | Field Programmable Gate Array, 1139 CLBs, 862MHz, 14579-Cell, CMOS, PBGA324, 15 X 15 MM, 0.80 MM PITCH, LEAD FREE, BGA-324 | XC6SLX16-3CSG324C vs XC6SLX16-3CSG324I |
| XC6SLX16-3CSG324C | AMD | Check for Price | Field Programmable Gate Array, 1139 CLBs, 862MHz, 14579-Cell, CMOS, PBGA324, 15 X 15 MM, 0.80 MM PITCH, LEAD FREE, BGA-324 | XC6SLX16-3CSG324C vs XC6SLX16-3CSG324C |
| XC6SLX16-3CSG324I | AMD | Check for Price | Field Programmable Gate Array, 1139 CLBs, 862MHz, 14579-Cell, CMOS, PBGA324, 15 X 15 MM, 0.80 MM PITCH, LEAD FREE, BGA-324 | XC6SLX16-3CSG324C vs XC6SLX16-3CSG324I |
XC6SLX16-3CSG324C Frequently Asked Questions (FAQ)
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The maximum operating frequency of the XC6SLX16-3CSG324C is 350 MHz.
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The typical power consumption of the XC6SLX16-3CSG324C is around 1.5W, but it can vary depending on the application and operating conditions.
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The XC6SLX16-3CSG324C has 324 I/O pins, but not all of them can be used simultaneously. The maximum number of I/O pins that can be used depends on the specific application and the number of banks used.
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Yes, the XC6SLX16-3CSG324C is suitable for high-reliability applications, such as aerospace, defense, and medical devices, due to its radiation-hardened design and compliance with various industry standards.
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The minimum operating temperature of the XC6SLX16-3CSG324C is -40°C, making it suitable for use in harsh environments.