Part Details for XC6SLX150-2CSG484I by AMD Xilinx
Results Overview of XC6SLX150-2CSG484I by AMD Xilinx
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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XC6SLX150-2CSG484I Information
XC6SLX150-2CSG484I by AMD Xilinx is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for XC6SLX150-2CSG484I
| Part # | Distributor | Description | Stock | Price | Buy | |
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Quest Components | FIELD PROGRAMMABLE GATE ARRAY, 11519 CLBS, 667MHZ, 147443-CELL, CMOS, PBGA484 | 56 |
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$176.5350 / $205.9575 | Buy Now |
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Win Source Electronics | IC FPGA 338 I/O 484CSBGA | 1260 |
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$86.6250 / $101.0625 | Buy Now |
Part Details for XC6SLX150-2CSG484I
XC6SLX150-2CSG484I CAD Models
XC6SLX150-2CSG484I Part Data Attributes
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XC6SLX150-2CSG484I
AMD Xilinx
Buy Now
Datasheet
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XC6SLX150-2CSG484I
AMD Xilinx
Field Programmable Gate Array, 11519 CLBs, 667MHz, 147443-Cell, CMOS, PBGA484, 19 X 19 MM, 0.80 MM PITCH, LEAD FREE, BGA-484
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 19 X 19 MM, 0.80 MM PITCH, LEAD FREE, BGA-484 | |
| Pin Count | 484 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 | |
| Clock Frequency-Max | 667 MHz | |
| Combinatorial Delay of a CLB-Max | 0.26 ns | |
| JESD-30 Code | S-PBGA-B484 | |
| JESD-609 Code | e1 | |
| Length | 19 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of CLBs | 11519 | |
| Number of Inputs | 330 | |
| Number of Logic Cells | 147443 | |
| Number of Outputs | 330 | |
| Number of Terminals | 484 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 11519 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FBGA | |
| Package Equivalence Code | BGA484,22X22,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.8 mm | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 19 mm |
XC6SLX150-2CSG484I Frequently Asked Questions (FAQ)
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The maximum power consumption of XC6SLX150-2CSG484I is approximately 2.5W, but it can vary depending on the design and operating conditions.
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To optimize power consumption, use the Xilinx Power Estimator (XPE) tool to estimate power consumption, and then apply power-saving techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling.
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The maximum operating frequency of XC6SLX150-2CSG484I is 350 MHz, but it can vary depending on the design and operating conditions.
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To implement a DDR3 memory interface with XC6SLX150-2CSG484I, use the Xilinx MIG (Memory Interface Generator) tool to generate a DDR3 controller, and then integrate it into your design.
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The XC6SLX150-2CSG484I has 484 user I/Os, but the maximum number of I/Os that can be used depends on the specific design and pinout requirements.