Datasheets
XC6SLX100-3FGG676I by:

Field Programmable Gate Array, 7911 CLBs, 862MHz, 101261-Cell, CMOS, PBGA676, 27 X 27 MM, 1 MM PITCH, LEAD FREE, FBGA-676

Part Details for XC6SLX100-3FGG676I by AMD Xilinx

Results Overview of XC6SLX100-3FGG676I by AMD Xilinx

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Applications Computing and Data Storage

XC6SLX100-3FGG676I Information

XC6SLX100-3FGG676I by AMD Xilinx is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.

Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.

Price & Stock for XC6SLX100-3FGG676I

Part # Distributor Description Stock Price Buy
LCSC FBGA-676 Programmable Logic Device (CPLDs/FPGAs) ROHS 3
  • 1 $67.3117
  • 30 $64.1902
$64.1902 / $67.3117 Buy Now
Vyrian Programmable ICs 19
RFQ
Win Source Electronics IC FPGA 480 I/O 676FBGA / FPGA Spartan®-6 LX Family 101261 Cells 45nm Technology 1.2V 676-Pin FBGA 171
  • 1 $87.1200
  • 2 $84.3975
  • 3 $81.6751
  • 4 $78.9525
  • 5 $70.7850
$70.7850 / $87.1200 Buy Now

Part Details for XC6SLX100-3FGG676I

XC6SLX100-3FGG676I CAD Models

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XC6SLX100-3FGG676I Part Data Attributes

XC6SLX100-3FGG676I AMD Xilinx
Buy Now Datasheet
Compare Parts:
XC6SLX100-3FGG676I AMD Xilinx Field Programmable Gate Array, 7911 CLBs, 862MHz, 101261-Cell, CMOS, PBGA676, 27 X 27 MM, 1 MM PITCH, LEAD FREE, FBGA-676
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description 27 X 27 MM, 1 MM PITCH, LEAD FREE, FBGA-676
Pin Count 676
Reach Compliance Code compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01
Clock Frequency-Max 862 MHz
Combinatorial Delay of a CLB-Max 0.21 ns
JESD-30 Code S-PBGA-B676
JESD-609 Code e1
Length 27 mm
Moisture Sensitivity Level 3
Number of CLBs 7911
Number of Inputs 480
Number of Logic Cells 101261
Number of Outputs 480
Number of Terminals 676
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Organization 7911 CLBS
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA676,26X26,40
Package Shape SQUARE
Package Style GRID ARRAY
Peak Reflow Temperature (Cel) 250
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified
Seated Height-Max 2.44 mm
Supply Voltage-Max 1.26 V
Supply Voltage-Min 1.14 V
Supply Voltage-Nom 1.2 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 27 mm

Alternate Parts for XC6SLX100-3FGG676I

This table gives cross-reference parts and alternative options found for XC6SLX100-3FGG676I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XC6SLX100-3FGG676I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
XC6SLX100-3FGG676C AMD Xilinx $151.4240 Field Programmable Gate Array, 7911 CLBs, 862MHz, 101261-Cell, CMOS, PBGA676, 27 X 27 MM, 1 MM PITCH, LEAD FREE, FBGA-676 XC6SLX100-3FGG676I vs XC6SLX100-3FGG676C
XC6SLX100-3FG676I AMD Xilinx $174.9900 Field Programmable Gate Array, 7911 CLBs, 862MHz, 101261-Cell, CMOS, PBGA676, 27 X 27 MM, 1 MM PITCH, FBGA-676 XC6SLX100-3FGG676I vs XC6SLX100-3FG676I
XC6SLX100-3FG676Q AMD Xilinx Check for Price Field Programmable Gate Array, XC6SLX100-3FGG676I vs XC6SLX100-3FG676Q
XC6SLX100-3FGG676Q AMD Xilinx Check for Price Field Programmable Gate Array, XC6SLX100-3FGG676I vs XC6SLX100-3FGG676Q
XC6SLX100-3FG676I AMD Check for Price Field Programmable Gate Array, 7911 CLBs, 862MHz, 101261-Cell, CMOS, PBGA676, 27 X 27 MM, 1 MM PITCH, FBGA-676 XC6SLX100-3FGG676I vs XC6SLX100-3FG676I

XC6SLX100-3FGG676I Related Parts

XC6SLX100-3FGG676I Frequently Asked Questions (FAQ)

  • The maximum operating frequency of the XC6SLX100-3FGG676I FPGA is 350 MHz.

  • The XC6SLX100-3FGG676I FPGA has a built-in DDR3 memory controller that can be implemented using the Xilinx Memory Interface Generator (MIG) tool. The MIG tool provides a GUI-based interface to generate the necessary IP cores and constraints for the DDR3 interface.

  • No, the XC6SLX100-3FGG676I FPGA is not radiation-hardened and is not suitable for use in high-radiation environments such as space or nuclear applications.

  • To optimize power consumption on the XC6SLX100-3FGG676I FPGA, use the Xilinx Power Analyzer tool to analyze and optimize power consumption. Additionally, implement power-saving techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling.

  • Yes, the XC6SLX100-3FGG676I FPGA has built-in high-speed serial transceivers that support PCIe and SATA interfaces. The FPGA also has a built-in PCIe endpoint block that can be used to implement PCIe interfaces.

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