Part Details for XC5VFX30T-1FFG665C by AMD
Results Overview of XC5VFX30T-1FFG665C by AMD
- Distributor Offerings: (5 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (7 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
XC5VFX30T-1FFG665C Information
XC5VFX30T-1FFG665C by AMD is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for XC5VFX30T-1FFG665C
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
122-1583-ND
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DigiKey | IC FPGA 360 I/O 665FCBGA Min Qty: 1 Lead time: 12 Weeks Container: Tray | Temporarily Out of Stock |
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$816.4000 | Buy Now |
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DISTI #
XC5VFX30T-1FFG665C
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Avnet Americas | - Trays (Alt: XC5VFX30T-1FFG665C) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 12 Weeks, 0 Days Container: Tray | 0 |
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$722.2000 | Buy Now |
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DISTI #
217-5VFX30T-1FFG665C
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Mouser Electronics | FPGA - Field Programmable Gate Array XC5VFX30T-1FFG665C RoHS: Compliant | 4 |
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$802.7200 | Buy Now |
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DISTI #
XC5VFX30T-1FFG665C
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Avnet Silica | (Alt: XC5VFX30T-1FFG665C) RoHS: Compliant Min Qty: 1 Package Multiple: 40 Lead time: 13 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
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DISTI #
XC5VFX30T-1FFG665C
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EBV Elektronik | (Alt: XC5VFX30T-1FFG665C) RoHS: Compliant Min Qty: 1 Package Multiple: 40 Lead time: 14 Weeks, 0 Days | EBV - 0 |
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Buy Now |
Part Details for XC5VFX30T-1FFG665C
XC5VFX30T-1FFG665C CAD Models
XC5VFX30T-1FFG665C Part Data Attributes
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XC5VFX30T-1FFG665C
AMD
Buy Now
Datasheet
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Compare Parts:
XC5VFX30T-1FFG665C
AMD
Field Programmable Gate Array, 2560 CLBs, 32768-Cell, CMOS, PBGA665, BGA-665
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Package Description | BGA-665 | |
| Reach Compliance Code | compliant | |
| Factory Lead Time | 12 Weeks | |
| Samacsys Manufacturer | AMD | |
| Combinatorial Delay of a CLB-Max | 0.9 ns | |
| JESD-30 Code | S-PBGA-B665 | |
| JESD-609 Code | e1 | |
| Length | 27 mm | |
| Moisture Sensitivity Level | 4 | |
| Number of CLBs | 2560 | |
| Number of Inputs | 360 | |
| Number of Logic Cells | 32768 | |
| Number of Outputs | 360 | |
| Number of Terminals | 665 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Organization | 2560 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA665,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 250 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.9 mm | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 0.95 V | |
| Supply Voltage-Nom | 1 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 27 mm |
Alternate Parts for XC5VFX30T-1FFG665C
This table gives cross-reference parts and alternative options found for XC5VFX30T-1FFG665C. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XC5VFX30T-1FFG665C, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| XC5VFX30T-1FFV665C | AMD Xilinx | Check for Price | Field Programmable Gate Array, 2560 CLBs, 32768-Cell, PBGA665, BGA-665 | XC5VFX30T-1FFG665C vs XC5VFX30T-1FFV665C |
| XC5VFX30T-1FFV665I | AMD Xilinx | Check for Price | Field Programmable Gate Array, 2560 CLBs, 32768-Cell, PBGA665, BGA-665 | XC5VFX30T-1FFG665C vs XC5VFX30T-1FFV665I |
| XC5VFX30T-1FF665C | AMD | Check for Price | Field Programmable Gate Array, 2560 CLBs, 32768-Cell, CMOS, PBGA665, BGA-665 | XC5VFX30T-1FFG665C vs XC5VFX30T-1FF665C |
| XC5VFX30T-1FFG665I | AMD | Check for Price | Field Programmable Gate Array, 2560 CLBs, 32768-Cell, CMOS, PBGA665, BGA-665 | XC5VFX30T-1FFG665C vs XC5VFX30T-1FFG665I |
| XC5VFX30T-1FF665C | AMD Xilinx | Check for Price | Field Programmable Gate Array, 3040 CLBs, 1098MHz, 32768-Cell, CMOS, PBGA665, 27 X 27 MM, FBGA-665 | XC5VFX30T-1FFG665C vs XC5VFX30T-1FF665C |
| XC5VFX30T-1FF665I | AMD Xilinx | Check for Price | Field Programmable Gate Array, 3040 CLBs, 1098MHz, 32768-Cell, CMOS, PBGA665, 27 X 27 MM, FBGA-665 | XC5VFX30T-1FFG665C vs XC5VFX30T-1FF665I |
| XC5VFX30T-1FFG665I | AMD Xilinx | Check for Price | Field Programmable Gate Array, 3040 CLBs, 1098MHz, 32768-Cell, CMOS, PBGA665, 27 X 27 MM, LEAD FREE, FBGA-665 | XC5VFX30T-1FFG665C vs XC5VFX30T-1FFG665I |
XC5VFX30T-1FFG665C Frequently Asked Questions (FAQ)
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The XC5VFX30T-1FFG665C has an industrial temperature range of -40°C to 100°C, and a commercial temperature range of 0°C to 85°C.
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Xilinx recommends using an external POR circuit with a voltage supervisor IC, such as the Xilinx Power Management Controller (PMC) or a third-party device like the Texas Instruments TPS3808. The datasheet provides guidelines for implementing a POR circuit.
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Xilinx provides detailed PCB layout and routing guidelines in the 'Virtex-5 FPGA PCB Design and Pin Planning Guide' (UG440) and the 'Virtex-5 FPGA Packaging and Pinout' (UG441) documents. These guides cover topics like signal integrity, power distribution, and thermal management.
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To minimize power consumption and heat generation, use the Xilinx Power Estimator (XPE) tool to estimate power consumption, and implement power-saving techniques like clock gating, dynamic voltage and frequency scaling, and using low-power modes. Additionally, ensure proper thermal management and heat sinking.
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The BIST feature is intended for manufacturing test and debug purposes only. It is not recommended for use in production systems, as it may interfere with normal device operation. Additionally, BIST may not detect all possible faults, and its use may require additional licensing and support from Xilinx.