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Part Details for XC3S700A-4FTG256C by AMD
Results Overview of XC3S700A-4FTG256C by AMD
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (5 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
XC3S700A-4FTG256C Information
XC3S700A-4FTG256C by AMD is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for XC3S700A-4FTG256C
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
XC3S700A-4FTG256C
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Avnet Silica | (Alt: XC3S700A-4FTG256C) RoHS: Compliant Min Qty: 8 Package Multiple: 90 Lead time: 143 Weeks, 0 Days | Silica - 270 |
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Buy Now | |
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DISTI #
XC3S700A-4FTG256C
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EBV Elektronik | (Alt: XC3S700A-4FTG256C) RoHS: Compliant Min Qty: 8 Package Multiple: 1 Lead time: 143 Weeks, 0 Days | EBV - 0 |
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Buy Now |
Part Details for XC3S700A-4FTG256C
XC3S700A-4FTG256C CAD Models
XC3S700A-4FTG256C Part Data Attributes
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XC3S700A-4FTG256C
AMD
Buy Now
Datasheet
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Compare Parts:
XC3S700A-4FTG256C
AMD
Field Programmable Gate Array, 1472 CLBs, 700000 Gates, 667MHz, 13248-Cell, CMOS, PBGA256, FTBGA-256
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Package Description | FTBGA-256 | |
| Reach Compliance Code | compliant | |
| Factory Lead Time | 111 Weeks | |
| Samacsys Manufacturer | AMD | |
| Clock Frequency-Max | 667 MHz | |
| Combinatorial Delay of a CLB-Max | 0.71 ns | |
| JESD-30 Code | S-PBGA-B256 | |
| JESD-609 Code | e1 | |
| Length | 17 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of CLBs | 1472 | |
| Number of Equivalent Gates | 700000 | |
| Number of Inputs | 161 | |
| Number of Logic Cells | 13248 | |
| Number of Outputs | 148 | |
| Number of Terminals | 256 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Organization | 1472 CLBS, 700000 GATES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.55 mm | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 17 mm |
Alternate Parts for XC3S700A-4FTG256C
This table gives cross-reference parts and alternative options found for XC3S700A-4FTG256C. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XC3S700A-4FTG256C, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| XC3S700A-4FT256I | AMD Xilinx | $36.3900 | Field Programmable Gate Array, 1472 CLBs, 700000 Gates, 667MHz, 13248-Cell, CMOS, PBGA256, 17 X 17 MM, 1.55 MM HEIGHT, 1 MM PITCH, FBGA-256 | XC3S700A-4FTG256C vs XC3S700A-4FT256I |
| XC3S700A-4FTG256I | AMD | $7.0330 | Field Programmable Gate Array, 1472 CLBs, 700000 Gates, 667MHz, 13248-Cell, CMOS, PBGA256, FTBGA-256 | XC3S700A-4FTG256C vs XC3S700A-4FTG256I |
| XC3S700A-4FT256I | AMD | Check for Price | Field Programmable Gate Array, 1472 CLBs, 700000 Gates, 667MHz, 13248-Cell, CMOS, PBGA256, FTBGA-256 | XC3S700A-4FTG256C vs XC3S700A-4FT256I |
| XC3S700A-4FTG256I | AMD Xilinx | Check for Price | Field Programmable Gate Array, 1472 CLBs, 700000 Gates, 667MHz, 13248-Cell, CMOS, PBGA256, 17 X 17 MM, 1.55 MM HEIGHT, 1 MM PITCH, LEAD FREE, FBGA-256 | XC3S700A-4FTG256C vs XC3S700A-4FTG256I |
| XC3S700A-5FTG256C | AMD | Check for Price | Field Programmable Gate Array, 1472 CLBs, 700000 Gates, 770MHz, 13248-Cell, CMOS, PBGA256, FTBGA-256 | XC3S700A-4FTG256C vs XC3S700A-5FTG256C |
XC3S700A-4FTG256C Frequently Asked Questions (FAQ)
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The maximum operating temperature range for XC3S700A-4FTG256C is -40°C to 100°C.
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To implement a CDC in XC3S700A-4FTG256C, use a synchronizer circuit or a FIFO-based CDC, and ensure that the clock domains are properly isolated.
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The maximum frequency achievable with XC3S700A-4FTG256C depends on the design complexity and the clocking architecture. However, the FPGA can support clock frequencies up to 500 MHz.
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To optimize power consumption in XC3S700A-4FTG256C, use power-saving features like clock gating, voltage scaling, and dynamic voltage and frequency scaling (DVFS).
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Yes, XC3S700A-4FTG256C is suitable for high-reliability applications, such as aerospace, defense, and industrial control systems, due to its robust design and manufacturing process.