Part Details for XC3S700A-4FGG400I by AMD
Results Overview of XC3S700A-4FGG400I by AMD
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
XC3S700A-4FGG400I Information
XC3S700A-4FGG400I by AMD is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for XC3S700A-4FGG400I
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
XC3S700A-4FGG400I
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Avnet Asia | FPGA Spartan-3A Family 700K Gates 13248 Cells 667MHz 90nm Technology 1.2V 400-Pin F-BGA (Alt: XC3S700A-4FGG400I) RoHS: Compliant Min Qty: 1 Package Multiple: 1 | 5 |
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RFQ | |
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DISTI #
XC3S700A-4FGG400I
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Avnet Silica | (Alt: XC3S700A-4FGG400I) RoHS: Compliant Min Qty: 6 Package Multiple: 60 Lead time: 143 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
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DISTI #
XC3S700A-4FGG400I
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EBV Elektronik | (Alt: XC3S700A-4FGG400I) RoHS: Compliant Min Qty: 6 Package Multiple: 1 Lead time: 143 Weeks, 0 Days | EBV - 0 |
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Buy Now |
Part Details for XC3S700A-4FGG400I
XC3S700A-4FGG400I CAD Models
XC3S700A-4FGG400I Part Data Attributes
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XC3S700A-4FGG400I
AMD
Buy Now
Datasheet
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Compare Parts:
XC3S700A-4FGG400I
AMD
Field Programmable Gate Array, 1472 CLBs, 700000 Gates, 667MHz, 13248-Cell, CMOS, PBGA400, FBGA-400
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Package Description | FBGA-400 | |
| Reach Compliance Code | compliant | |
| Samacsys Manufacturer | AMD | |
| Clock Frequency-Max | 667 MHz | |
| Combinatorial Delay of a CLB-Max | 0.71 ns | |
| JESD-30 Code | S-PBGA-B400 | |
| JESD-609 Code | e1 | |
| Length | 21 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of CLBs | 1472 | |
| Number of Equivalent Gates | 700000 | |
| Number of Inputs | 311 | |
| Number of Logic Cells | 13248 | |
| Number of Outputs | 248 | |
| Number of Terminals | 400 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 1472 CLBS, 700000 GATES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA400,20X20,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 250 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.43 mm | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 21 mm |
Alternate Parts for XC3S700A-4FGG400I
This table gives cross-reference parts and alternative options found for XC3S700A-4FGG400I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XC3S700A-4FGG400I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| XC3S700A-4FGG400C | AMD | Check for Price | Field Programmable Gate Array, 1472 CLBs, 700000 Gates, 667MHz, 13248-Cell, CMOS, PBGA400, FBGA-400 | XC3S700A-4FGG400I vs XC3S700A-4FGG400C |
| XC3S700AN-4FGG400C | AMD Xilinx | Check for Price | Field Programmable Gate Array, 1472 CLBs, 700000 Gates, 667MHz, CMOS, PBGA400, ROHS COMPLIANT, FBGA-400 | XC3S700A-4FGG400I vs XC3S700AN-4FGG400C |
| XC3S700A-4FG400I | AMD | Check for Price | Field Programmable Gate Array, 1472 CLBs, 700000 Gates, 667MHz, 13248-Cell, CMOS, PBGA400, FBGA-400 | XC3S700A-4FGG400I vs XC3S700A-4FG400I |
| XC3S700A-4FG400I | AMD Xilinx | Check for Price | Field Programmable Gate Array, 1472 CLBs, 700000 Gates, 250MHz, 13248-Cell, CMOS, PBGA400, FPBGA-400 | XC3S700A-4FGG400I vs XC3S700A-4FG400I |
| XC3S700AN-5FGG400C | AMD Xilinx | Check for Price | Field Programmable Gate Array, 1472 CLBs, 700000 Gates, 770MHz, CMOS, PBGA400, ROHS COMPLIANT, FBGA-400 | XC3S700A-4FGG400I vs XC3S700AN-5FGG400C |
| XC3S700A-5FG400C | AMD Xilinx | Check for Price | Field Programmable Gate Array, 1472 CLBs, 700000 Gates, 280MHz, 13248-Cell, CMOS, PBGA400, FPBGA-400 | XC3S700A-4FGG400I vs XC3S700A-5FG400C |
| XC3S700A-5FGG400C | AMD | Check for Price | Field Programmable Gate Array, 1472 CLBs, 700000 Gates, 770MHz, 13248-Cell, CMOS, PBGA400, FBGA-400 | XC3S700A-4FGG400I vs XC3S700A-5FGG400C |
| XC3S700AN-4FG400I | AMD Xilinx | Check for Price | Field Programmable Gate Array, 1472 CLBs, 700000 Gates, 667MHz, CMOS, PBGA400, FBGA-400 | XC3S700A-4FGG400I vs XC3S700AN-4FG400I |
| XC3S700A-5FGG400C | AMD Xilinx | Check for Price | Field Programmable Gate Array, 1472 CLBs, 700000 Gates, 280MHz, 13248-Cell, CMOS, PBGA400, LEAD FREE, FPBGA-400 | XC3S700A-4FGG400I vs XC3S700A-5FGG400C |
| XC3S700AN-5FG400C | AMD Xilinx | Check for Price | Field Programmable Gate Array, 1472 CLBs, 700000 Gates, 770MHz, CMOS, PBGA400, FBGA-400 | XC3S700A-4FGG400I vs XC3S700AN-5FG400C |
XC3S700A-4FGG400I Frequently Asked Questions (FAQ)
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The maximum operating frequency of the XC3S700A-4FGG400I is 340 MHz.
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You can implement a DDR2 interface on the XC3S700A-4FGG400I using the FPGA's DDR2 memory interface module. You'll need to use the Xilinx MIG (Memory Interface Generator) tool to generate the necessary IP core.
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Yes, the XC3S700A-4FGG400I is suitable for high-reliability applications. It has a number of features that support high reliability, including error correction, single-event upset (SEU) mitigation, and built-in self-test (BIST) capabilities.
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To optimize power consumption on the XC3S700A-4FGG400I, you can use Xilinx's Power Analyzer tool to identify areas of high power consumption in your design. You can then use various power-saving techniques, such as clock gating, voltage scaling, and dynamic voltage and frequency scaling.
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Yes, the XC3S700A-4FGG400I has built-in support for cryptographic applications, including AES encryption and decryption. You can use Xilinx's Cryptographic IP cores to implement cryptographic algorithms in your design.