Part Details for XC3S500E-5FTG256C by AMD
Results Overview of XC3S500E-5FTG256C by AMD
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (1 option)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
XC3S500E-5FTG256C Information
XC3S500E-5FTG256C by AMD is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for XC3S500E-5FTG256C
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
XC3S500E-5FTG256C
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Avnet Americas | - Trays (Alt: XC3S500E-5FTG256C) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 111 Weeks, 0 Days Container: Tray | 553 |
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$117.6135 | Buy Now |
Part Details for XC3S500E-5FTG256C
XC3S500E-5FTG256C CAD Models
XC3S500E-5FTG256C Part Data Attributes
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XC3S500E-5FTG256C
AMD
Buy Now
Datasheet
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XC3S500E-5FTG256C
AMD
Field Programmable Gate Array, 1164 CLBs, 500000 Gates, 657MHz, 10476-Cell, CMOS, PBGA256, 17 X 17 MM, 1.55 MM HEIGHT, 1 MM PITCH, LEAD FREE, FTBGA-256
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Package Description | 17 X 17 MM, 1.55 MM HEIGHT, 1 MM PITCH, LEAD FREE, FTBGA-256 | |
| Reach Compliance Code | compliant | |
| Factory Lead Time | 111 Weeks | |
| Samacsys Manufacturer | AMD | |
| Clock Frequency-Max | 657 MHz | |
| Combinatorial Delay of a CLB-Max | 0.66 ns | |
| JESD-30 Code | S-PBGA-B256 | |
| JESD-609 Code | e1 | |
| Length | 17 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of CLBs | 1164 | |
| Number of Equivalent Gates | 500000 | |
| Number of Inputs | 190 | |
| Number of Logic Cells | 10476 | |
| Number of Outputs | 149 | |
| Number of Terminals | 256 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Organization | 1164 CLBS, 500000 GATES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.55 mm | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm |
Alternate Parts for XC3S500E-5FTG256C
This table gives cross-reference parts and alternative options found for XC3S500E-5FTG256C. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XC3S500E-5FTG256C, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| XC3S500E-5FT256C | AMD | Check for Price | Field Programmable Gate Array, 1164 CLBs, 500000 Gates, 657MHz, 10476-Cell, CMOS, PBGA256, 17 X 17 MM, 1.55 MM HEIGHT, 1 MM PITCH, FTBGA-256 | XC3S500E-5FTG256C vs XC3S500E-5FT256C |
XC3S500E-5FTG256C Frequently Asked Questions (FAQ)
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The XC3S500E-5FTG256C has a commercial temperature range of 0°C to 85°C, and an industrial temperature range of -40°C to 100°C.
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Xilinx provides a Clock Domain Crossing (CDC) user guide that outlines the recommended design practices and techniques for implementing CDCs in Spartan-3E FPGAs, including the XC3S500E-5FTG256C.
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The maximum frequency achievable with the XC3S500E-5FTG256C depends on the specific design, clocking scheme, and implementation. However, Xilinx provides a Spartan-3E FPGA Clocking Resources user guide that outlines the clocking architecture and provides guidance on achieving high-frequency designs.
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Xilinx provides a Power Estimation and Optimization guide that outlines various techniques for reducing power consumption in Spartan-3E FPGAs, including the XC3S500E-5FTG256C. These techniques include clock gating, voltage scaling, and dynamic voltage and frequency scaling.
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Xilinx provides a Spartan-3E FPGA PCB Design and Layout Guidelines document that outlines the recommended PCB layout guidelines for the XC3S500E-5FTG256C, including pinout, signal integrity, and thermal management considerations.