Datasheets
XC3S500E-4FG320I by:

Field Programmable Gate Array, 1164 CLBs, 500000 Gates, 572MHz, 10476-Cell, CMOS, PBGA320, FBGA-320

Part Details for XC3S500E-4FG320I by AMD

Results Overview of XC3S500E-4FG320I by AMD

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XC3S500E-4FG320I Information

XC3S500E-4FG320I by AMD is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.

Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.

Price & Stock for XC3S500E-4FG320I

Part # Distributor Description Stock Price Buy
DISTI # XC3S500E-4FG320I
Avnet Americas - Trays (Alt: XC3S500E-4FG320I) RoHS: Not Compliant Min Qty: 1 Package Multiple: 1 Lead time: 111 Weeks, 0 Days Container: Tray 0
RFQ
DISTI # XC3S500E-4FG320I
Avnet Silica (Alt: XC3S500E-4FG320I) RoHS: Not Compliant Min Qty: 1 Package Multiple: 84 Lead time: 143 Weeks, 0 Days Silica - 0
Buy Now
DISTI # XC3S500E-4FG320I
EBV Elektronik (Alt: XC3S500E-4FG320I) RoHS: Not Compliant Min Qty: 5 Package Multiple: 1 Lead time: 143 Weeks, 0 Days EBV - 0
Buy Now

Part Details for XC3S500E-4FG320I

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XC3S500E-4FG320I Part Data Attributes

XC3S500E-4FG320I AMD
Buy Now Datasheet
Compare Parts:
XC3S500E-4FG320I AMD Field Programmable Gate Array, 1164 CLBs, 500000 Gates, 572MHz, 10476-Cell, CMOS, PBGA320, FBGA-320
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC
Package Description FBGA-320
Reach Compliance Code not_compliant
Factory Lead Time 111 Weeks
Samacsys Manufacturer AMD
Clock Frequency-Max 572 MHz
Combinatorial Delay of a CLB-Max 0.76 ns
JESD-30 Code S-PBGA-B320
JESD-609 Code e0
Length 19 mm
Moisture Sensitivity Level 3
Number of CLBs 1164
Number of Equivalent Gates 500000
Number of Inputs 232
Number of Logic Cells 10476
Number of Outputs 176
Number of Terminals 320
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Organization 1164 CLBS, 500000 GATES
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA320,18X18,40
Package Shape SQUARE
Package Style GRID ARRAY
Peak Reflow Temperature (Cel) 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified
Seated Height-Max 2 mm
Supply Voltage-Max 1.26 V
Supply Voltage-Min 1.14 V
Supply Voltage-Nom 1.2 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 19 mm

Alternate Parts for XC3S500E-4FG320I

This table gives cross-reference parts and alternative options found for XC3S500E-4FG320I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XC3S500E-4FG320I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
XC3S500E-4FGG320C AMD Check for Price Field Programmable Gate Array, 1164 CLBs, 500000 Gates, 572MHz, 10476-Cell, CMOS, PBGA320, FBGA-320 XC3S500E-4FG320I vs XC3S500E-4FGG320C
Part Number Manufacturer Composite Price Description Compare
XC3S500E-4FG320C AMD Check for Price Field Programmable Gate Array, 1164 CLBs, 500000 Gates, 572MHz, 10476-Cell, CMOS, PBGA320, FBGA-320 XC3S500E-4FG320I vs XC3S500E-4FG320C
XC3S500E-4FGG320I AMD Check for Price Field Programmable Gate Array, 1164 CLBs, 500000 Gates, 572MHz, 10476-Cell, CMOS, PBGA320, FBGA-320 XC3S500E-4FG320I vs XC3S500E-4FGG320I

XC3S500E-4FG320I Related Parts

XC3S500E-4FG320I Frequently Asked Questions (FAQ)

  • The maximum operating temperature range for XC3S500E-4FG320I is -40°C to 100°C (industrial grade) and -40°C to 85°C (commercial grade).

  • Xilinx provides a Clock Domain Crossing (CDC) user guide that explains how to implement CDC in their FPGAs, including the XC3S500E. It involves using synchronizers, FIFOs, and other techniques to ensure reliable data transfer between clock domains.

  • The power consumption of XC3S500E-4FG320I depends on the operating frequency, voltage, and usage. According to the datasheet, the typical power consumption is around 1.2W at 50MHz and 1.2V. However, this can vary depending on the specific design and usage.

  • Yes, the XC3S500E-4FG320I has built-in support for high-speed serial interfaces like PCIe and SATA. It has dedicated transceivers that can operate at speeds up to 3.2 Gbps, making it suitable for high-speed applications.

  • Xilinx provides a range of tools and techniques for debugging and testing FPGA designs, including ChipScope, SignalTap, and the Vivado Design Suite. These tools allow you to monitor and analyze the behavior of your design, identify errors, and optimize performance.

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