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Programmable Logic / Field Programmable Gate Arrays / XC3S400A-4FT256I
Datasheets
XC3S400A-4FT256I by:

Field Programmable Gate Array, 896 CLBs, 400000 Gates, 667MHz, 8064-Cell, CMOS, PBGA256, FTBGA-256

Part Details for XC3S400A-4FT256I by AMD

Results Overview of XC3S400A-4FT256I by AMD

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XC3S400A-4FT256I Information

XC3S400A-4FT256I by AMD is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.

Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.

Price & Stock for XC3S400A-4FT256I

Part # Distributor Description Stock Price Buy
DISTI # XC3S400A-4FT256I
Avnet Americas - Trays (Alt: XC3S400A-4FT256I) RoHS: Not Compliant Min Qty: 1 Package Multiple: 1 Lead time: 111 Weeks, 0 Days Container: Tray 0
  • 1 $81.9022
$81.9022 Buy Now

Part Details for XC3S400A-4FT256I

XC3S400A-4FT256I CAD Models

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XC3S400A-4FT256I Part Data Attributes

Parametric Data
XC3S400A-4FT256I AMD
Buy Now Datasheet
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XC3S400A-4FT256I AMD Field Programmable Gate Array, 896 CLBs, 400000 Gates, 667MHz, 8064-Cell, CMOS, PBGA256, FTBGA-256
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC
Package Description FTBGA-256
Reach Compliance Code not_compliant
Factory Lead Time 111 Weeks
Samacsys Manufacturer AMD
Clock Frequency-Max 667 MHz
Combinatorial Delay of a CLB-Max 0.71 ns
JESD-30 Code S-PBGA-B256
JESD-609 Code e0
Length 17 mm
Moisture Sensitivity Level 3
Number of CLBs 896
Number of Equivalent Gates 400000
Number of Inputs 195
Number of Logic Cells 8064
Number of Outputs 160
Number of Terminals 256
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Organization 896 CLBS, 400000 GATES
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA256,16X16,40
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified
Seated Height-Max 1.55 mm
Supply Voltage-Max 1.26 V
Supply Voltage-Min 1.14 V
Supply Voltage-Nom 1.2 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 17 mm

Alternate Parts for XC3S400A-4FT256I

This table gives cross-reference parts and alternative options found for XC3S400A-4FT256I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XC3S400A-4FT256I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
XC3S400A-4FT256C AMD Xilinx $22.2900 Field Programmable Gate Array, 896 CLBs, 400000 Gates, 250MHz, 8064-Cell, CMOS, PBGA256, FPTBGA-256 XC3S400A-4FT256I vs XC3S400A-4FT256C
XC3S400A-4FTG256I AMD Xilinx $9.3620 Field Programmable Gate Array, 896 CLBs, 400000 Gates, 250MHz, 8064-Cell, CMOS, PBGA256, LEAD FREE, FPTBGA-256 XC3S400A-4FT256I vs XC3S400A-4FTG256I
XC3S400AN-4FT256I AMD Xilinx Check for Price Field Programmable Gate Array, 896 CLBs, 400000 Gates, 667MHz, 8064-Cell, CMOS, PBGA256, FTBGA-256 XC3S400A-4FT256I vs XC3S400AN-4FT256I
XC3S400A-4FT256C AMD Check for Price Field Programmable Gate Array, 896 CLBs, 400000 Gates, 667MHz, 8064-Cell, CMOS, PBGA256, FTBGA-256 XC3S400A-4FT256I vs XC3S400A-4FT256C
Part Number Manufacturer Composite Price Description Compare
XC3S400AN-4FT256C AMD Xilinx Check for Price Field Programmable Gate Array, 896 CLBs, 400000 Gates, 667MHz, 8064-Cell, CMOS, PBGA256, FTBGA-256 XC3S400A-4FT256I vs XC3S400AN-4FT256C
XC3S400AN-4FT256I AMD Check for Price Field Programmable Gate Array, 896 CLBs, 400000 Gates, 667MHz, 8064-Cell, CMOS, PBGA256, FTBGA-256 XC3S400A-4FT256I vs XC3S400AN-4FT256I
XC3S400AN-4FTG256I AMD Check for Price Field Programmable Gate Array, 896 CLBs, 400000 Gates, 667MHz, 8064-Cell, CMOS, PBGA256, FTBGA-256 XC3S400A-4FT256I vs XC3S400AN-4FTG256I
XC3S400AN-4FTG256C AMD Xilinx Check for Price Field Programmable Gate Array, 896 CLBs, 400000 Gates, 667MHz, 8064-Cell, CMOS, PBGA256, ROHS COMPLIANT, FTBGA-256 XC3S400A-4FT256I vs XC3S400AN-4FTG256C
XC3S400A-4FTG256C AMD Xilinx Check for Price Field Programmable Gate Array, 896 CLBs, 400000 Gates, 250MHz, 8064-Cell, CMOS, PBGA256, LEAD FREE, FPTBGA-256 XC3S400A-4FT256I vs XC3S400A-4FTG256C
XC3S400AN-4FTG256I AMD Xilinx Check for Price Field Programmable Gate Array, 896 CLBs, 400000 Gates, 667MHz, 8064-Cell, CMOS, PBGA256, ROHS COMPLIANT, FTBGA-256 XC3S400A-4FT256I vs XC3S400AN-4FTG256I
XC3S400AN-5FTG256C AMD Check for Price Field Programmable Gate Array, 896 CLBs, 400000 Gates, 770MHz, 8064-Cell, CMOS, PBGA256, FTBGA-256 XC3S400A-4FT256I vs XC3S400AN-5FTG256C
XC3S400A-5FT256C AMD Check for Price Field Programmable Gate Array, 896 CLBs, 400000 Gates, 770MHz, 8064-Cell, CMOS, PBGA256, FTBGA-256 XC3S400A-4FT256I vs XC3S400A-5FT256C
XC3S400A-5FT256C AMD Xilinx Check for Price Field Programmable Gate Array, 896 CLBs, 400000 Gates, 280MHz, 8064-Cell, CMOS, PBGA256, FPTBGA-256 XC3S400A-4FT256I vs XC3S400A-5FT256C
XC3S400A-4FTG256I AMD Check for Price Field Programmable Gate Array, 896 CLBs, 400000 Gates, 667MHz, 8064-Cell, CMOS, PBGA256, FTBGA-256 XC3S400A-4FT256I vs XC3S400A-4FTG256I

XC3S400A-4FT256I Related Parts

XC3S400A-4FT256I Frequently Asked Questions (FAQ)

  • The maximum operating frequency of XC3S400A-4FT256I is 350 MHz.

  • To implement a CDC in XC3S400A-4FT256I, use a synchronizer circuit or a FIFO-based CDC. The Xilinx Clock Domain Crossing User Guide provides more information.

  • The power consumption of XC3S400A-4FT256I depends on the operating frequency, voltage, and design complexity. The Xilinx Power Estimator tool can provide an estimate of power consumption.

  • No, XC3S400A-4FT256I is not a radiation-hardened device. For radiation-hardened applications, consider using Xilinx's QPro or RT ProASIC3 devices.

  • Use Xilinx's ChipScope Pro or Vivado Logic Analyzer to debug and test XC3S400A-4FT256I. These tools provide visibility into the device's internal signals and allow for real-time debugging.

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