Part Details for XC3S4000-4FGG676I by AMD Xilinx
Results Overview of XC3S4000-4FGG676I by AMD Xilinx
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (2 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
XC3S4000-4FGG676I Information
XC3S4000-4FGG676I by AMD Xilinx is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for XC3S4000-4FGG676I
| Part # | Distributor | Description | Stock | Price | Buy | |
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Cytech Systems Limited | IC FPGA 489 I/O 676FBGA | 40 |
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RFQ | |
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Vyrian | Programmable ICs | 231 |
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RFQ | |
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Win Source Electronics | IC FPGA 489 I/O 676FBGA | 1600 |
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$99.0008 / $115.5000 | Buy Now |
Part Details for XC3S4000-4FGG676I
XC3S4000-4FGG676I CAD Models
XC3S4000-4FGG676I Part Data Attributes
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XC3S4000-4FGG676I
AMD Xilinx
Buy Now
Datasheet
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Compare Parts:
XC3S4000-4FGG676I
AMD Xilinx
Field Programmable Gate Array, 6912 CLBs, 4000000 Gates, 630MHz, 62208-Cell, CMOS, PBGA676, 27 X 27 MM, LEAD FREE, FBGA-676
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 27 X 27 MM, LEAD FREE, FBGA-676 | |
| Pin Count | 676 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 | |
| Factory Lead Time | 30 Weeks | |
| Clock Frequency-Max | 630 MHz | |
| Combinatorial Delay of a CLB-Max | 0.61 ns | |
| JESD-30 Code | S-PBGA-B676 | |
| JESD-609 Code | e1 | |
| Length | 27 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of CLBs | 6912 | |
| Number of Equivalent Gates | 4000000 | |
| Number of Inputs | 489 | |
| Number of Logic Cells | 62208 | |
| Number of Outputs | 489 | |
| Number of Terminals | 676 | |
| Organization | 6912 CLBS, 4000000 GATES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA676,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 260 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.6 mm | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 27 mm |
Alternate Parts for XC3S4000-4FGG676I
This table gives cross-reference parts and alternative options found for XC3S4000-4FGG676I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XC3S4000-4FGG676I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| XC3S4000-4FGG676I | AMD | Check for Price | Field Programmable Gate Array, 6912 CLBs, 4000000 Gates, 630MHz, 62208-Cell, CMOS, PBGA676, 27 X 27 MM, LEAD FREE, FBGA-676 | XC3S4000-4FGG676I vs XC3S4000-4FGG676I |
| XC3S4000-4FGG676C | AMD | Check for Price | Field Programmable Gate Array, 6912 CLBs, 4000000 Gates, 630MHz, 62208-Cell, CMOS, PBGA676, 27 X 27 MM, LEAD FREE, FBGA-676 | XC3S4000-4FGG676I vs XC3S4000-4FGG676C |
XC3S4000-4FGG676I Frequently Asked Questions (FAQ)
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The maximum operating temperature range for XC3S4000-4FGG676I is -40°C to 100°C.
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You can implement a reliable POR circuit using an external resistor-capacitor (RC) network or a dedicated POR IC, ensuring a minimum pulse width of 10 ms to guarantee a clean reset.
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The recommended clocking scheme for XC3S4000-4FGG676I is to use a single, high-frequency clock source (e.g., 100 MHz) and then divide it down to generate lower-frequency clocks as needed.
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To optimize power consumption, use the Xilinx Power Estimator (XPE) tool to analyze and optimize your design, and consider using power-saving features like clock gating, dynamic voltage and frequency scaling, and shutdown modes.
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Follow Xilinx's guidelines for signal integrity and PCB layout, including using controlled impedance traces, minimizing signal lengths, and using decoupling capacitors to reduce noise and ensure reliable operation.