Part Details for XC3S4000-4FG676I by AMD Xilinx
Results Overview of XC3S4000-4FG676I by AMD Xilinx
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (1 replacement)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
XC3S4000-4FG676I Information
XC3S4000-4FG676I by AMD Xilinx is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for XC3S4000-4FG676I
Part # | Distributor | Description | Stock | Price | Buy | |
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Quest Components | IC,FPGA,6912-CELL,CMOS,BGA,676PIN,PLASTIC | 1 |
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$414.5794 | Buy Now |
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Vyrian | Peripheral ICs | 1597 |
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RFQ |
Part Details for XC3S4000-4FG676I
XC3S4000-4FG676I CAD Models
XC3S4000-4FG676I Part Data Attributes
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XC3S4000-4FG676I
AMD Xilinx
Buy Now
Datasheet
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Compare Parts:
XC3S4000-4FG676I
AMD Xilinx
Field Programmable Gate Array, 6912 CLBs, 4000000 Gates, 630MHz, 62208-Cell, CMOS, PBGA676, 27 X 27 MM, FBGA-676
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Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | 27 X 27 MM, FBGA-676 | |
Pin Count | 676 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A991.D | |
HTS Code | 8542.39.00.01 | |
Factory Lead Time | 30 Weeks | |
Clock Frequency-Max | 630 MHz | |
Combinatorial Delay of a CLB-Max | 0.61 ns | |
JESD-30 Code | S-PBGA-B676 | |
JESD-609 Code | e0 | |
Length | 27 mm | |
Moisture Sensitivity Level | 3 | |
Number of CLBs | 6912 | |
Number of Equivalent Gates | 4000000 | |
Number of Inputs | 489 | |
Number of Logic Cells | 62208 | |
Number of Outputs | 489 | |
Number of Terminals | 676 | |
Organization | 6912 CLBS, 4000000 GATES | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA676,26X26,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Qualification Status | Not Qualified | |
Seated Height-Max | 2.6 mm | |
Supply Voltage-Max | 1.26 V | |
Supply Voltage-Min | 1.14 V | |
Supply Voltage-Nom | 1.2 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 27 mm |
Alternate Parts for XC3S4000-4FG676I
This table gives cross-reference parts and alternative options found for XC3S4000-4FG676I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XC3S4000-4FG676I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Manufacturer | Composite Price | Description | Compare |
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XC3S4000-4FG676C | AMD Xilinx | $149.9900 | Field Programmable Gate Array, 6912 CLBs, 4000000 Gates, 630MHz, 62208-Cell, CMOS, PBGA676, 27 X 27 MM, FBGA-676 | XC3S4000-4FG676I vs XC3S4000-4FG676C |
XC3S4000-4FG676I Frequently Asked Questions (FAQ)
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The maximum power consumption of XC3S4000-4FG676I is approximately 1.5W, but it can vary depending on the specific application and usage.
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To implement a DDR3 memory interface with XC3S4000-4FG676I, you need to use the MIG (Memory Interface Generator) tool provided by Xilinx, which generates the necessary IP cores and interface logic.
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Yes, XC3S4000-4FG676I is capable of supporting high-speed serial interfaces like PCIe and SATA, but it requires careful design and implementation to ensure signal integrity and compliance with the relevant standards.
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To optimize power consumption, use the Xilinx Power Estimator (XPE) tool to estimate power consumption, and then apply power-saving techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling.
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The maximum operating frequency of XC3S4000-4FG676I is 350 MHz, but it can vary depending on the specific application and usage.