Part Details for XC3S250E-4FTG256I by AMD Xilinx
Results Overview of XC3S250E-4FTG256I by AMD Xilinx
- Distributor Offerings: (5 listings)
- Number of FFF Equivalents: (4 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (5 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
XC3S250E-4FTG256I Information
XC3S250E-4FTG256I by AMD Xilinx is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for XC3S250E-4FTG256I
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
|
Bristol Electronics | 6 |
|
RFQ | ||
|
Quest Components | IC,FPGA,612-CELL,CMOS,BGA,256PIN,PLASTIC | 4 |
|
$122.8365 / $136.4850 | Buy Now |
|
Component Electronics, Inc | IN STOCK SHIP TODAY | 12 |
|
$100.0000 / $153.8500 | Buy Now |
|
LCSC | 5508 612 FTBGA-256(17x17) Programmable Logic Device (CPLDs/FPGAs) ROHS | 13 |
|
$43.3748 / $45.4568 | Buy Now |
|
Vyrian | Programmable ICs | 49 |
|
RFQ |
Part Details for XC3S250E-4FTG256I
XC3S250E-4FTG256I CAD Models
XC3S250E-4FTG256I Part Data Attributes
|
XC3S250E-4FTG256I
AMD Xilinx
Buy Now
Datasheet
|
Compare Parts:
XC3S250E-4FTG256I
AMD Xilinx
Field Programmable Gate Array, 612 CLBs, 250000 Gates, 572MHz, 5508-Cell, CMOS, PBGA256, 17 X 17 MM, 1.55 MM HEIGHT, 1 MM PITCH, LEAD FREE, FTBGA-256
|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | FTBGA-256 | |
Pin Count | 256 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.39.00.01 | |
Factory Lead Time | 52 Weeks | |
Clock Frequency-Max | 572 MHz | |
Combinatorial Delay of a CLB-Max | 0.76 ns | |
JESD-30 Code | S-PBGA-B256 | |
JESD-609 Code | e1 | |
Length | 17 mm | |
Moisture Sensitivity Level | 3 | |
Number of CLBs | 612 | |
Number of Equivalent Gates | 250000 | |
Number of Inputs | 172 | |
Number of Logic Cells | 5508 | |
Number of Outputs | 132 | |
Number of Terminals | 256 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 612 CLBS, 250000 GATES | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA256,16X16,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE | |
Peak Reflow Temperature (Cel) | 260 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.55 mm | |
Supply Voltage-Max | 1.26 V | |
Supply Voltage-Min | 1.14 V | |
Supply Voltage-Nom | 1.2 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 17 mm |
Alternate Parts for XC3S250E-4FTG256I
This table gives cross-reference parts and alternative options found for XC3S250E-4FTG256I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XC3S250E-4FTG256I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Manufacturer | Composite Price | Description | Compare |
---|---|---|---|---|
XC3S250E-4FTG256CS1 | AMD Xilinx | Check for Price | Field Programmable Gate Array, 572MHz, 5508-Cell, CMOS, PBGA256, | XC3S250E-4FTG256I vs XC3S250E-4FTG256CS1 |
XC3S250E-4FT256CS1 | AMD Xilinx | Check for Price | Field Programmable Gate Array, 572MHz, 5508-Cell, CMOS, PBGA256, | XC3S250E-4FTG256I vs XC3S250E-4FT256CS1 |
XC3S250E-4FT256IS1 | AMD Xilinx | Check for Price | Field Programmable Gate Array, 572MHz, 5508-Cell, CMOS, PBGA256, | XC3S250E-4FTG256I vs XC3S250E-4FT256IS1 |
XC3S250E-4FTG256IS1 | AMD Xilinx | Check for Price | Field Programmable Gate Array, 572MHz, 5508-Cell, CMOS, PBGA256, | XC3S250E-4FTG256I vs XC3S250E-4FTG256IS1 |
XC3S250E-4FTG256I Frequently Asked Questions (FAQ)
-
The maximum operating frequency of the XC3S250E-4FTG256I is 350 MHz.
-
The typical power consumption of the XC3S250E-4FTG256I is around 1.5W, but it can vary depending on the application and operating conditions.
-
The XC3S250E-4FTG256I has a total of 232 user I/Os available.
-
Yes, the XC3S250E-4FTG256I supports partial reconfiguration, which allows for dynamic reconfiguration of specific regions of the FPGA.
-
The minimum operating voltage of the XC3S250E-4FTG256I is 1.14V.