Part Details for XC3S1000-5FTG256C by AMD
Results Overview of XC3S1000-5FTG256C by AMD
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (1 option)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
XC3S1000-5FTG256C Information
XC3S1000-5FTG256C by AMD is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for XC3S1000-5FTG256C
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
XC3S1000-5FTG256C
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Avnet Americas | - Trays (Alt: XC3S1000-5FTG256C) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 111 Weeks, 0 Days Container: Tray | 0 |
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RFQ | |
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DISTI #
XC3S1000-5FTG256C
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Avnet Asia | FPGA Spartan-3 Family 1M Gates 17280 Cells 725MHz 90nm Technology 1.2V 256-Pin FTBGA (Alt: XC3S1000-5FTG256C) RoHS: Compliant Min Qty: 1 Package Multiple: 1 | 5 |
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RFQ |
Part Details for XC3S1000-5FTG256C
XC3S1000-5FTG256C CAD Models
XC3S1000-5FTG256C Part Data Attributes
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XC3S1000-5FTG256C
AMD
Buy Now
Datasheet
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XC3S1000-5FTG256C
AMD
Field Programmable Gate Array, 1920 CLBs, 1000000 Gates, 725MHz, 17280-Cell, CMOS, PBGA256, 17 X 17 MM, LEAD FREE, FTBGA-256
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Package Description | 17 X 17 MM, LEAD FREE, FTBGA-256 | |
| Reach Compliance Code | compliant | |
| Factory Lead Time | 111 Weeks | |
| Samacsys Manufacturer | AMD | |
| Clock Frequency-Max | 725 MHz | |
| Combinatorial Delay of a CLB-Max | 0.53 ns | |
| JESD-30 Code | S-PBGA-B256 | |
| JESD-609 Code | e1 | |
| Length | 17 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of CLBs | 1920 | |
| Number of Equivalent Gates | 1000000 | |
| Number of Inputs | 173 | |
| Number of Logic Cells | 17280 | |
| Number of Outputs | 173 | |
| Number of Terminals | 256 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Organization | 1920 CLBS, 1000000 GATES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.55 mm | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 17 mm |
Alternate Parts for XC3S1000-5FTG256C
This table gives cross-reference parts and alternative options found for XC3S1000-5FTG256C. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XC3S1000-5FTG256C, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| XC3S1000-5FT256C | AMD | Check for Price | Field Programmable Gate Array, 1920 CLBs, 1000000 Gates, 725MHz, 17280-Cell, CMOS, PBGA256, 17 X 17 MM, FTBGA-256 | XC3S1000-5FTG256C vs XC3S1000-5FT256C |
XC3S1000-5FTG256C Frequently Asked Questions (FAQ)
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The maximum operating temperature range for XC3S1000-5FTG256C is -40°C to 100°C (industrial grade) and -40°C to 85°C (commercial grade).
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Xilinx provides a Clock Domain Crossing (CDC) user guide that explains how to implement CDC in their FPGAs, including the XC3S1000. It involves using synchronizers, FIFOs, and other techniques to ensure reliable data transfer between clock domains.
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The power consumption of XC3S1000-5FTG256C depends on the specific application and usage. However, Xilinx provides power estimation tools and guidelines to help estimate the power consumption. Typically, the static power consumption is around 1-2 watts, and the dynamic power consumption depends on the clock frequency and activity.
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Yes, the XC3S1000-5FTG256C has built-in support for high-speed serial interfaces like PCIe and SATA. It has dedicated transceivers and PHYs that can operate at speeds up to 3.2 Gbps.
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Xilinx provides a range of debugging and testing tools, including ChipScope, SignalTap, and Vivado Logic Analyzer. These tools allow you to monitor and analyze the internal signals and behavior of your design, and identify and fix errors.