Part Details for XC2VP70-6FF1704I by AMD Xilinx
Results Overview of XC2VP70-6FF1704I by AMD Xilinx
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (7 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
XC2VP70-6FF1704I Information
XC2VP70-6FF1704I by AMD Xilinx is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for XC2VP70-6FF1704I
Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | 1 |
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RFQ | ||
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Vyrian | Peripheral ICs | 476 |
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RFQ |
Part Details for XC2VP70-6FF1704I
XC2VP70-6FF1704I CAD Models
XC2VP70-6FF1704I Part Data Attributes
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XC2VP70-6FF1704I
AMD Xilinx
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Datasheet
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XC2VP70-6FF1704I
AMD Xilinx
Field Programmable Gate Array, 8272 CLBs, 1200MHz, 74448-Cell, CMOS, PBGA1704, 42.50 X 42.50 MM, 1 MM PITCH, MS-034AAV-1, FCBGA-1704
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Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | 42.50 X 42.50 MM, 1 MM PITCH, MS-034AAV-1, FCBGA-1704 | |
Pin Count | 1704 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A001.A.7.A | |
HTS Code | 8542.39.00.01 | |
Clock Frequency-Max | 1200 MHz | |
Combinatorial Delay of a CLB-Max | 0.32 ns | |
JESD-30 Code | S-PBGA-B1704 | |
JESD-609 Code | e0 | |
Length | 42.5 mm | |
Moisture Sensitivity Level | 4 | |
Number of CLBs | 8272 | |
Number of Inputs | 996 | |
Number of Logic Cells | 74448 | |
Number of Outputs | 996 | |
Number of Terminals | 1704 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 8272 CLBS | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1704,42X42,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | 225 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Qualification Status | Not Qualified | |
Seated Height-Max | 3.45 mm | |
Supply Voltage-Max | 1.575 V | |
Supply Voltage-Min | 1.425 V | |
Supply Voltage-Nom | 1.5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Finish | Tin/Lead (Sn63Pb37) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 42.5 mm |
Alternate Parts for XC2VP70-6FF1704I
This table gives cross-reference parts and alternative options found for XC2VP70-6FF1704I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XC2VP70-6FF1704I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Manufacturer | Composite Price | Description | Compare |
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XC2VP70-6FF1704C | AMD Xilinx | Check for Price | Field Programmable Gate Array, 8272 CLBs, 1200MHz, 74448-Cell, CMOS, PBGA1704, 42.50 X 42.50 MM, 1 MM PITCH, MS-034AAV-1, FCBGA-1704 | XC2VP70-6FF1704I vs XC2VP70-6FF1704C |
XC2VP70-6FFG1704I | AMD Xilinx | Check for Price | Field Programmable Gate Array, 8272 CLBs, 1200MHz, 74448-Cell, CMOS, PBGA1704, 42.50 X 42.50 MM, 1 MM PITCH, MS-034AAV-1, FCBGA-1704 | XC2VP70-6FF1704I vs XC2VP70-6FFG1704I |
XC2VP70-7FFG1704I | AMD Xilinx | Check for Price | Field Programmable Gate Array, 8272 CLBs, 1350MHz, CMOS, PBGA1704, 1 MM PITCH, FLIP CHIP, FBGA-1704 | XC2VP70-6FF1704I vs XC2VP70-7FFG1704I |
XC2VP70-5FFG1704I | AMD Xilinx | Check for Price | Field Programmable Gate Array, 8272 CLBs, 1050MHz, 74448-Cell, CMOS, PBGA1704, 42.50 X 42.50 MM, 1 MM PITCH, MS-034AAV-1, FCBGA-1704 | XC2VP70-6FF1704I vs XC2VP70-5FFG1704I |
XC2VP70-5FF1704C | AMD Xilinx | Check for Price | Field Programmable Gate Array, 8272 CLBs, 1050MHz, 74448-Cell, CMOS, PBGA1704, 42.50 X 42.50 MM, 1 MM PITCH, MS-034AAV-1, FCBGA-1704 | XC2VP70-6FF1704I vs XC2VP70-5FF1704C |
XC2VP70-7FFG1704C | AMD Xilinx | Check for Price | Field Programmable Gate Array, 8272 CLBs, 1350MHz, 74448-Cell, CMOS, PBGA1704, 42.50 X 42.50 MM, 1 MM PITCH, MS-034AAV-1, FCBGA-1704 | XC2VP70-6FF1704I vs XC2VP70-7FFG1704C |
XC2VP70-5FFG1704C | AMD Xilinx | Check for Price | Field Programmable Gate Array, 8272 CLBs, 1050MHz, 74448-Cell, CMOS, PBGA1704, 42.50 X 42.50 MM, 1 MM PITCH, MS-034AAV-1, FCBGA-1704 | XC2VP70-6FF1704I vs XC2VP70-5FFG1704C |
XC2VP70-6FF1704I Frequently Asked Questions (FAQ)
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The maximum power consumption of XC2VP70-6FF1704I is approximately 12W, but it can vary depending on the usage and configuration of the device.
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To implement DDR3 memory interface with XC2VP70-6FF1704I, you need to use the Memory Interface Generator (MIG) tool provided by Xilinx, which generates the necessary IP cores and configuration files for the DDR3 interface.
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Yes, XC2VP70-6FF1704I is suitable for high-reliability applications, such as aerospace, defense, and medical devices, due to its radiation-hardened design and compliance with various industry standards for reliability and fault tolerance.
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To optimize the performance of XC2VP70-6FF1704I, you can use Xilinx's Vivado Design Suite, which provides tools for design optimization, synthesis, and implementation. You can also use the Xilinx Power Estimator (XPE) tool to estimate power consumption and optimize your design accordingly.
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Yes, XC2VP70-6FF1704I is compatible with other Xilinx FPGAs, including the Virtex-6 and Virtex-7 families, allowing for easy migration and reuse of designs across different devices.