Datasheets
XC2V1000-4FG456I by:

Field Programmable Gate Array, 1280 CLBs, 1000000 Gates, 650MHz, 11520-Cell, CMOS, PBGA456, 23 X 23 MM, 1 MM PITCH, MO-034AAJ-1, FBGA-456

Part Details for XC2V1000-4FG456I by AMD Xilinx

Results Overview of XC2V1000-4FG456I by AMD Xilinx

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Applications Entertainment and Gaming

XC2V1000-4FG456I Information

XC2V1000-4FG456I by AMD Xilinx is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.

Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.

Price & Stock for XC2V1000-4FG456I

Part # Distributor Description Stock Price Buy
Bristol Electronics   6
RFQ
Bristol Electronics   Min Qty: 1 3
  • 1 $247.2800
$247.2800 Buy Now
Quest Components IC,FPGA,1280-CELL,CMOS,BGA,456PIN,PLASTIC 2
  • 1 $330.0000
$330.0000 Buy Now
Quest Components IC,FPGA,1280-CELL,CMOS,BGA,456PIN,PLASTIC 1
  • 1 $500.1364
$500.1364 Buy Now
Vyrian Peripheral ICs 200
RFQ

Part Details for XC2V1000-4FG456I

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XC2V1000-4FG456I Part Data Attributes

XC2V1000-4FG456I AMD Xilinx
Buy Now Datasheet
Compare Parts:
XC2V1000-4FG456I AMD Xilinx Field Programmable Gate Array, 1280 CLBs, 1000000 Gates, 650MHz, 11520-Cell, CMOS, PBGA456, 23 X 23 MM, 1 MM PITCH, MO-034AAJ-1, FBGA-456
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description 23 X 23 MM, 1 MM PITCH, MO-034AAJ-1, FBGA-456
Pin Count 456
Reach Compliance Code not_compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01
Clock Frequency-Max 650 MHz
Combinatorial Delay of a CLB-Max 0.44 ns
JESD-30 Code S-PBGA-B456
JESD-609 Code e0
Length 23 mm
Moisture Sensitivity Level 3
Number of CLBs 1280
Number of Equivalent Gates 1000000
Number of Inputs 324
Number of Logic Cells 11520
Number of Outputs 324
Number of Terminals 456
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Organization 1280 CLBS, 1000000 GATES
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA456,22X22,40
Package Shape SQUARE
Package Style GRID ARRAY
Peak Reflow Temperature (Cel) 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified
Seated Height-Max 2.6 mm
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.425 V
Supply Voltage-Nom 1.5 V
Surface Mount YES
Technology CMOS
Terminal Finish Tin/Lead (Sn63Pb37)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 23 mm

Alternate Parts for XC2V1000-4FG456I

This table gives cross-reference parts and alternative options found for XC2V1000-4FG456I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XC2V1000-4FG456I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
XC2V1000-4FG456C AMD Xilinx $16.9932 Field Programmable Gate Array, 1280 CLBs, 1000000 Gates, 650MHz, 11520-Cell, CMOS, PBGA456, 23 X 23 MM, 1 MM PITCH, MO-034AAJ-1, FBGA-456 XC2V1000-4FG456I vs XC2V1000-4FG456C
XC2V1000-4FGG456I AMD Xilinx $19.4922 Field Programmable Gate Array, 1280 CLBs, 1000000 Gates, 650MHz, 11520-Cell, CMOS, PBGA456, 23 X 23 MM, 1 MM PITCH, LEAD FREE, MO-034AAJ-1, FBGA-456 XC2V1000-4FG456I vs XC2V1000-4FGG456I
XC2V1000-4FGG456C AMD Xilinx Check for Price Field Programmable Gate Array, 1280 CLBs, 1000000 Gates, 650MHz, 11520-Cell, CMOS, PBGA456, 23 X 23 MM, 1 MM PITCH, LEAD FREE, MO-034AAJ-1, FBGA-456 XC2V1000-4FG456I vs XC2V1000-4FGG456C
XC2V1000-5FG456C AMD Xilinx Check for Price Field Programmable Gate Array, 1280 CLBs, 1000000 Gates, 750MHz, 11520-Cell, CMOS, PBGA456, 23 X 23 MM, 1 MM PITCH, MO-034AAJ-1, FBGA-456 XC2V1000-4FG456I vs XC2V1000-5FG456C
XQR2V1000-4FGG456N AMD Xilinx Check for Price Field Programmable Gate Array, 1280 CLBs, 1000000 Gates, 650MHz, CMOS, PBGA456, 1 MM PITCH, PLASTIC, MO-151AAJ, FPBGA-456 XC2V1000-4FG456I vs XQR2V1000-4FGG456N
XQR2V1000-4FGG456R AMD Xilinx Check for Price Field Programmable Gate Array, 1280 CLBs, 1000000 Gates, 650MHz, CMOS, PBGA456, 1 MM PITCH, PLASTIC, MO-151AAJ, FPBGA-456 XC2V1000-4FG456I vs XQR2V1000-4FGG456R
XC2V1000-6FGG456C AMD Xilinx Check for Price Field Programmable Gate Array, 1280 CLBs, 1000000 Gates, 820MHz, 11520-Cell, CMOS, PBGA456, 23 X 23 MM, 1 MM PITCH, LEAD FREE, MO-034AAJ-1, FBGA-456 XC2V1000-4FG456I vs XC2V1000-6FGG456C
XQR2V1000-4FG456N AMD Xilinx Check for Price Field Programmable Gate Array, 1280 CLBs, 1000000 Gates, 650MHz, 11520-Cell, CMOS, PBGA456, 1 MM PITCH, PLASTIC, MO-151AAJ, FPBGA-456 XC2V1000-4FG456I vs XQR2V1000-4FG456N
XC2V1000-5FG456I AMD Xilinx Check for Price Field Programmable Gate Array, 1280 CLBs, 1000000 Gates, 750MHz, 11520-Cell, CMOS, PBGA456, 23 X 23 MM, 1 MM PITCH, MO-034AAJ-1, FBGA-456 XC2V1000-4FG456I vs XC2V1000-5FG456I
XC2V1000-5FGG456C AMD Xilinx Check for Price Field Programmable Gate Array, 1280 CLBs, 1000000 Gates, 750MHz, 11520-Cell, CMOS, PBGA456, 23 X 23 MM, 1 MM PITCH, LEAD FREE, MO-034AAJ-1, FBGA-456 XC2V1000-4FG456I vs XC2V1000-5FGG456C

XC2V1000-4FG456I Related Parts

XC2V1000-4FG456I Frequently Asked Questions (FAQ)

  • The maximum operating temperature range for XC2V1000-4FG456I is -40°C to 100°C.

  • To implement a reliable clocking scheme, use a clock management tile (CMT) to generate a stable clock signal, and consider using a clock domain crossing (CDC) to synchronize clock domains.

  • The recommended power-on sequence is to apply power to VCCINT, then VCCAUX, and finally VCCO. Ensure that VCCINT and VCCAUX are powered on before configuring the FPGA.

  • To optimize power consumption, use power-aware design techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling. Also, consider using the Xilinx Power Analyzer tool to estimate and optimize power consumption.

  • The internal block RAM (BRAM) in XC2V1000-4FG456I has a total capacity of 2.56 Mb, divided into 128 blocks of 18 Kb each. Each block can be configured as a single-port or dual-port RAM, and can be used for data storage or as a FIFO buffer.

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