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Part Details for XC2C512-10FGG324I by AMD
Results Overview of XC2C512-10FGG324I by AMD
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (8 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
XC2C512-10FGG324I Information
XC2C512-10FGG324I by AMD is a Programmable Logic Device.
Programmable Logic Devices are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Part Details for XC2C512-10FGG324I
XC2C512-10FGG324I CAD Models
XC2C512-10FGG324I Part Data Attributes
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XC2C512-10FGG324I
AMD
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Datasheet
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XC2C512-10FGG324I
AMD
Flash PLD, 10ns, 512-Cell, PLA-Type, CMOS, PBGA324, 23 X 23 MM, 1 MM PITCH, LEAD FREE, PLASTIC, FBGA-324
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Package Description | 23 X 23 MM, 1 MM PITCH, LEAD FREE, PLASTIC, FBGA-324 | |
| Reach Compliance Code | compliant | |
| Samacsys Manufacturer | AMD | |
| Additional Feature | YES | |
| Architecture | PLA-TYPE | |
| Clock Frequency-Max | 91 MHz | |
| In-System Programmable | YES | |
| JESD-30 Code | S-PBGA-B324 | |
| JESD-609 Code | e1 | |
| JTAG BST | YES | |
| Length | 23 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Dedicated Inputs | ||
| Number of I/O Lines | 270 | |
| Number of Inputs | 270 | |
| Number of Macro Cells | 512 | |
| Number of Outputs | 270 | |
| Number of Terminals | 324 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 0 DEDICATED INPUTS, 270 I/O | |
| Output Function | MACROCELL | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA324,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 250 | |
| Programmable Logic Type | FLASH PLD | |
| Propagation Delay | 10 ns | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.5 mm | |
| Supply Voltage-Max | 1.9 V | |
| Supply Voltage-Min | 1.7 V | |
| Supply Voltage-Nom | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 23 mm |
Alternate Parts for XC2C512-10FGG324I
This table gives cross-reference parts and alternative options found for XC2C512-10FGG324I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XC2C512-10FGG324I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| XC2C512-10FG324C | AMD Xilinx | $82.5900 | Flash PLD, 10ns, 512-Cell, CMOS, PBGA324, 23 X 23 MM, 1 MM PITCH, PLASTIC, FBGA-324 | XC2C512-10FGG324I vs XC2C512-10FG324C |
| XC2C512-10FGG324I | AMD Xilinx | $96.1900 | Flash PLD, 10ns, 512-Cell, CMOS, PBGA324, 23 X 23 MM, 1 MM PITCH, LEAD FREE, PLASTIC, FBGA-324 | XC2C512-10FGG324I vs XC2C512-10FGG324I |
| XC2C512-10FG324I | AMD | Check for Price | Flash PLD, 10ns, 512-Cell, PLA-Type, CMOS, PBGA324, 23 X 23 MM, 1 MM PITCH, PLASTIC, FBGA-324 | XC2C512-10FGG324I vs XC2C512-10FG324I |
| XC2C512-10FG324I | AMD Xilinx | Check for Price | Flash PLD, 10ns, 512-Cell, CMOS, PBGA324, 23 X 23 MM, 1 MM PITCH, PLASTIC, FBGA-324 | XC2C512-10FGG324I vs XC2C512-10FG324I |
| XC2C512-7FGG324C | AMD | Check for Price | Flash PLD, 7.5ns, 512-Cell, PLA-Type, CMOS, PBGA324, 23 X 23 MM, 1 MM PITCH, LEAD FREE, PLASTIC, FBGA-324 | XC2C512-10FGG324I vs XC2C512-7FGG324C |
| XC2C512-6FG324C | AMD Xilinx | Check for Price | Flash PLD, 6ns, 512-Cell, CMOS, PBGA324, 23 X 23 MM, 1.20 MM PITCH, FBGA-324 | XC2C512-10FGG324I vs XC2C512-6FG324C |
| XC2C512-10FG324C | AMD | Check for Price | Flash PLD, 10ns, 512-Cell, PLA-Type, CMOS, PBGA324, 23 X 23 MM, 1 MM PITCH, PLASTIC, FBGA-324 | XC2C512-10FGG324I vs XC2C512-10FG324C |
| XC2C512-7FG324C | AMD Xilinx | Check for Price | Flash PLD, 7.5ns, 512-Cell, CMOS, PBGA324, 23 X 23 MM, 1 MM PITCH, PLASTIC, FBGA-324 | XC2C512-10FGG324I vs XC2C512-7FG324C |
XC2C512-10FGG324I Frequently Asked Questions (FAQ)
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The maximum operating frequency of the XC2C512-10FGG324I is 250 MHz.
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To implement a CDC in the XC2C512-10FGG324I, use a synchronizer circuit or a FIFO-based CDC to ensure data integrity across clock domains.
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The power consumption of the XC2C512-10FGG324I depends on the operating frequency, voltage, and design complexity. Typically, it ranges from 0.5W to 2W.
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No, the XC2C512-10FGG324I is not a radiation-hardened device. It is not designed for use in high-radiation environments.
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To optimize the XC2C512-10FGG324I for low power consumption, use power-saving features like clock gating, voltage scaling, and dynamic voltage and frequency scaling.