Part Details for XC2C256-7FT256I by AMD
Results Overview of XC2C256-7FT256I by AMD
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (1 option)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
XC2C256-7FT256I Information
XC2C256-7FT256I by AMD is a Programmable Logic Device.
Programmable Logic Devices are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for XC2C256-7FT256I
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
|
DISTI #
XC2C256-7FT256I
|
Avnet Silica | (Alt: XC2C256-7FT256I) RoHS: Not Compliant Min Qty: 10 Package Multiple: 90 Lead time: 143 Weeks, 0 Days | Silica - 0 |
|
Buy Now | |
|
DISTI #
XC2C256-7FT256I
|
EBV Elektronik | (Alt: XC2C256-7FT256I) RoHS: Not Compliant Min Qty: 10 Package Multiple: 90 Lead time: 143 Weeks, 0 Days | EBV - 0 |
|
Buy Now |
Part Details for XC2C256-7FT256I
XC2C256-7FT256I CAD Models
XC2C256-7FT256I Part Data Attributes
|
|
XC2C256-7FT256I
AMD
Buy Now
Datasheet
|
Compare Parts:
XC2C256-7FT256I
AMD
Flash PLD, 7.5ns, 256-Cell, PLA-Type, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, FTBGA-256
|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
| Package Description | 17 X 17 MM, 1 MM PITCH, FTBGA-256 | |
| Reach Compliance Code | not_compliant | |
| Samacsys Manufacturer | AMD | |
| Additional Feature | REAL DIGITAL DESIGN TECHNOLOGY | |
| Architecture | PLA-TYPE | |
| Clock Frequency-Max | 108 MHz | |
| In-System Programmable | YES | |
| JESD-30 Code | S-PBGA-B256 | |
| JESD-609 Code | e0 | |
| JTAG BST | YES | |
| Length | 17 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Dedicated Inputs | ||
| Number of I/O Lines | 184 | |
| Number of Inputs | 184 | |
| Number of Macro Cells | 256 | |
| Number of Outputs | 184 | |
| Number of Terminals | 256 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 0 DEDICATED INPUTS, 184 I/O | |
| Output Function | MACROCELL | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Peak Reflow Temperature (Cel) | 225 | |
| Programmable Logic Type | FLASH PLD | |
| Propagation Delay | 7.5 ns | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.55 mm | |
| Supply Voltage-Max | 1.9 V | |
| Supply Voltage-Min | 1.7 V | |
| Supply Voltage-Nom | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 17 mm |
Alternate Parts for XC2C256-7FT256I
This table gives cross-reference parts and alternative options found for XC2C256-7FT256I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XC2C256-7FT256I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| XC2C256-6FTG256C | AMD | Check for Price | Flash PLD, 6ns, 256-Cell, PLA-Type, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, LEAD FREE, FTBGA-256 | XC2C256-7FT256I vs XC2C256-6FTG256C |
XC2C256-7FT256I Frequently Asked Questions (FAQ)
-
The maximum operating frequency of XC2C256-7FT256I is 160 MHz.
-
To implement a CDC in XC2C256-7FT256I, use a synchronizer circuit or a FIFO-based CDC. The Xilinx ISE design suite provides tools and IP cores to help with CDC implementation.
-
The power consumption of XC2C256-7FT256I depends on the operating frequency, voltage, and design complexity. Typically, it ranges from 0.5W to 2W. Refer to the Xilinx Power Estimator (XPE) tool for a more accurate estimate.
-
No, XC2C256-7FT256I is not a radiation-hardened device. It is not designed to withstand high levels of radiation and is not suitable for space or high-reliability applications.
-
Use the Xilinx ChipScope Pro tool, which provides a debug and test environment for XC2C256-7FT256I. It allows you to analyze and debug your design, as well as perform functional testing and verification.