Datasheets
XC17S50AVOG8C by:

Configuration Memory, 559200X1, Serial, CMOS, PDSO8, PLASTIC, TSOP-8

Part Details for XC17S50AVOG8C by AMD Xilinx

Results Overview of XC17S50AVOG8C by AMD Xilinx

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Applications Computing and Data Storage Telecommunications

XC17S50AVOG8C Information

XC17S50AVOG8C by AMD Xilinx is an EEPROM.
EEPROMs are under the broader part category of Memory Components.

Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.

Price & Stock for XC17S50AVOG8C

Part # Distributor Description Stock Price Buy
Quest Components 559200X1 CONFIGURATION MEMORY, PDSO8 8
  • 1 $4.8600
  • 3 $3.2400
  • 9 $2.4300
$2.4300 / $4.8600 Buy Now
Vyrian Peripheral ICs 685
RFQ

Part Details for XC17S50AVOG8C

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XC17S50AVOG8C Part Data Attributes

XC17S50AVOG8C AMD Xilinx
Buy Now Datasheet
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XC17S50AVOG8C AMD Xilinx Configuration Memory, 559200X1, Serial, CMOS, PDSO8, PLASTIC, TSOP-8
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer XILINX INC
Part Package Code TSOP
Package Description TSOP-8
Pin Count 8
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.32.00.51
I/O Type COMMON
JESD-30 Code R-PDSO-G8
JESD-609 Code e3
Length 4.9 mm
Memory Density 559200 bit
Memory IC Type CONFIGURATION MEMORY
Memory Width 1
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 8
Number of Words 559200 words
Number of Words Code 559200
Operating Mode SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 559200X1
Package Body Material PLASTIC/EPOXY
Package Code TSOP2
Package Equivalence Code TSSOP8,.25,20
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE
Parallel/Serial SERIAL
Peak Reflow Temperature (Cel) 260
Programming Voltage 5 V
Qualification Status Not Qualified
Seated Height-Max 1.2 mm
Standby Current-Max 0.00005 A
Supply Current-Max 0.01 mA
Supply Voltage-Max (Vsup) 5.25 V
Supply Voltage-Min (Vsup) 4.75 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish Matte Tin (Sn)
Terminal Form GULL WING
Terminal Pitch 1.27 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 3.9 mm

Alternate Parts for XC17S50AVOG8C

This table gives cross-reference parts and alternative options found for XC17S50AVOG8C. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XC17S50AVOG8C, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
XC17S50AVO8C AMD Xilinx Check for Price Configuration Memory, 559200X1, Serial, CMOS, PDSO8, PLASTIC, TSOP-8 XC17S50AVOG8C vs XC17S50AVO8C
XC17S50AVOG8I AMD Xilinx Check for Price Configuration Memory, 559200X1, Serial, CMOS, PDSO8, PLASTIC, TSOP-8 XC17S50AVOG8C vs XC17S50AVOG8I
XC17S50AVO8I AMD Xilinx Check for Price Configuration Memory, 559200X1, Serial, CMOS, PDSO8, PLASTIC, TSOP-8 XC17S50AVOG8C vs XC17S50AVO8I

XC17S50AVOG8C Related Parts

XC17S50AVOG8C Frequently Asked Questions (FAQ)

  • The maximum operating temperature range for the XC17S50AVOG8C is -40°C to 100°C (industrial grade) and -40°C to 125°C (extended industrial grade).

  • A reliable POR circuit can be implemented using an external resistor-capacitor (RC) network connected to the POR pin, ensuring a minimum pulse width of 10 ms and a maximum voltage of 1.5 V.

  • The recommended clocking scheme is to use a single, low-skew clock source connected to the GCLK pin, and then use the internal clock management resources to generate the required clock frequencies.

  • To ensure signal integrity, use controlled impedance traces, add termination resistors as needed, and follow the recommended PCB layout guidelines provided in the Xilinx documentation.

  • The maximum current draw of the XC17S50AVOG8C is approximately 1.5 A for the core voltage (VCCINT) and 0.5 A for the I/O voltage (VCCO), depending on the device configuration and operating frequency.

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