Datasheets
XC1765EPDG8C by:

64KX1 CONFIGURATION MEMORY, PDIP8, LEAD FREE, PLASTIC, DIP-8

Part Details for XC1765EPDG8C by Rochester Electronics LLC

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XC1765EPDG8C Information

XC1765EPDG8C by Rochester Electronics LLC is an EEPROM.
EEPROMs are under the broader part category of Memory Components.

Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.

Part Details for XC1765EPDG8C

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XC1765EPDG8C Part Data Attributes

XC1765EPDG8C Rochester Electronics LLC
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XC1765EPDG8C Rochester Electronics LLC 64KX1 CONFIGURATION MEMORY, PDIP8, LEAD FREE, PLASTIC, DIP-8
Pbfree Code No
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer ROCHESTER ELECTRONICS LLC
Part Package Code DIP
Package Description DIP,
Pin Count 8
Reach Compliance Code unknown
Additional Feature USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
JESD-30 Code R-PDIP-T8
JESD-609 Code e3
Length 9.3599 mm
Memory Density 65536 bit
Memory IC Type CONFIGURATION MEMORY
Memory Width 1
Moisture Sensitivity Level 1
Number of Functions 1
Number of Terminals 8
Number of Words 65536 words
Number of Words Code 64000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 64KX1
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial SERIAL
Peak Reflow Temperature (Cel) 250
Qualification Status COMMERCIAL
Seated Height-Max 4.5974 mm
Supply Voltage-Max (Vsup) 5.25 V
Supply Voltage-Min (Vsup) 4.75 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish MATTE TIN
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 7.62 mm

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