Part Details for XC1765EPDG8C by Rochester Electronics LLC
Results Overview of XC1765EPDG8C by Rochester Electronics LLC
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
XC1765EPDG8C Information
XC1765EPDG8C by Rochester Electronics LLC is an EEPROM.
EEPROMs are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Part Details for XC1765EPDG8C
XC1765EPDG8C CAD Models
XC1765EPDG8C Part Data Attributes
|
XC1765EPDG8C
Rochester Electronics LLC
Buy Now
Datasheet
|
Compare Parts:
XC1765EPDG8C
Rochester Electronics LLC
64KX1 CONFIGURATION MEMORY, PDIP8, LEAD FREE, PLASTIC, DIP-8
|
Pbfree Code | No | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | ROCHESTER ELECTRONICS LLC | |
Part Package Code | DIP | |
Package Description | DIP, | |
Pin Count | 8 | |
Reach Compliance Code | unknown | |
Additional Feature | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS | |
JESD-30 Code | R-PDIP-T8 | |
JESD-609 Code | e3 | |
Length | 9.3599 mm | |
Memory Density | 65536 bit | |
Memory IC Type | CONFIGURATION MEMORY | |
Memory Width | 1 | |
Moisture Sensitivity Level | 1 | |
Number of Functions | 1 | |
Number of Terminals | 8 | |
Number of Words | 65536 words | |
Number of Words Code | 64000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 64KX1 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | DIP | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Parallel/Serial | SERIAL | |
Peak Reflow Temperature (Cel) | 250 | |
Qualification Status | COMMERCIAL | |
Seated Height-Max | 4.5974 mm | |
Supply Voltage-Max (Vsup) | 5.25 V | |
Supply Voltage-Min (Vsup) | 4.75 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | MATTE TIN | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 7.62 mm |