Part Details for XC1765EPDG8C by AMD Xilinx
Results Overview of XC1765EPDG8C by AMD Xilinx
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (1 replacement)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
XC1765EPDG8C Information
XC1765EPDG8C by AMD Xilinx is an EEPROM.
EEPROMs are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Price & Stock for XC1765EPDG8C
| Part # | Distributor | Description | Stock | Price | Buy | |
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Vyrian | Peripheral ICs | 386 |
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RFQ |
Part Details for XC1765EPDG8C
XC1765EPDG8C CAD Models
XC1765EPDG8C Part Data Attributes
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XC1765EPDG8C
AMD Xilinx
Buy Now
Datasheet
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XC1765EPDG8C
AMD Xilinx
Configuration Memory, 64KX1, Serial, CMOS, PDIP8, LEAD FREE, PLASTIC, DIP-8
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | DIP | |
| Package Description | LEAD FREE, PLASTIC, DIP-8 | |
| Pin Count | 8 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Additional Feature | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS | |
| Clock Frequency-Max (fCLK) | 10 MHz | |
| I/O Type | COMMON | |
| JESD-30 Code | R-PDIP-T8 | |
| JESD-609 Code | e3 | |
| Length | 9.3599 mm | |
| Memory Density | 65536 bit | |
| Memory IC Type | CONFIGURATION MEMORY | |
| Memory Width | 1 | |
| Moisture Sensitivity Level | 1 | |
| Number of Functions | 1 | |
| Number of Terminals | 8 | |
| Number of Words | 65536 words | |
| Number of Words Code | 64000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 64KX1 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | DIP | |
| Package Equivalence Code | DIP8,.3 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | SERIAL | |
| Peak Reflow Temperature (Cel) | 250 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 4.5974 mm | |
| Standby Current-Max | 0.00005 A | |
| Supply Current-Max | 0.01 mA | |
| Supply Voltage-Max (Vsup) | 5.25 V | |
| Supply Voltage-Min (Vsup) | 4.75 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 7.62 mm |
Alternate Parts for XC1765EPDG8C
This table gives cross-reference parts and alternative options found for XC1765EPDG8C. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XC1765EPDG8C, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| XC1765EDD8B | AMD Xilinx | Check for Price | Configuration Memory, 64KX1, Serial, CMOS, CDIP8, CERAMIC, DIP-8 | XC1765EPDG8C vs XC1765EDD8B |
XC1765EPDG8C Frequently Asked Questions (FAQ)
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The maximum operating temperature range for the XC1765EPDG8C is -40°C to 100°C (industrial grade) and -40°C to 125°C (extended industrial grade).
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A reliable POR circuit can be implemented using an external resistor-capacitor (RC) network connected to the POR pin. The recommended values are R = 1 kΩ and C = 10 μF.
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The recommended clocking scheme is to use a single clock source for all clock domains, and to use the internal clock management resources (e.g., MMCM, PLL) to generate the required clock frequencies.
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To optimize for low power consumption, use the Xilinx Power Estimator (XPE) tool to estimate power consumption, and then apply power-saving techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling (DVFS).
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The maximum current draw for the XC1765EPDG8C is approximately 1.5 A for the core voltage (VCCINT) and 0.5 A for the I/O voltage (VCCO).