Part Details for XA7A75T-1FGG484Q by AMD
Results Overview of XA7A75T-1FGG484Q by AMD
- Distributor Offerings: (5 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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XA7A75T-1FGG484Q Information
XA7A75T-1FGG484Q by AMD is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for XA7A75T-1FGG484Q
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
XA7A75T-1FGG484Q-ND
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DigiKey | IC FPGA 285 I/O 484FBGA Min Qty: 2 Lead time: 16 Weeks Container: Bulk | Temporarily Out of Stock |
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$183.3000 | Buy Now |
DISTI #
XA7A75T-1FGG484Q
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Avnet Americas | - Trays (Alt: XA7A75T-1FGG484Q) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 16 Weeks, 0 Days Container: Tray | 0 |
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$179.6144 | Buy Now |
DISTI #
217-XA7A75T-1FGG484Q
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Mouser Electronics | FPGA - Field Programmable Gate Array XA7A75T-1FGG484Q RoHS: Compliant | 0 |
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$183.2800 | Order Now |
DISTI #
XA7A75T-1FGG484Q
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Avnet Silica | (Alt: XA7A75T-1FGG484Q) RoHS: Compliant Min Qty: 1 Package Multiple: 60 Lead time: 17 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
DISTI #
XA7A75T-1FGG484Q
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EBV Elektronik | (Alt: XA7A75T-1FGG484Q) RoHS: Compliant Min Qty: 4 Package Multiple: 60 Lead time: 18 Weeks, 0 Days | EBV - 0 |
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Buy Now |
Part Details for XA7A75T-1FGG484Q
XA7A75T-1FGG484Q CAD Models
XA7A75T-1FGG484Q Part Data Attributes
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XA7A75T-1FGG484Q
AMD
Buy Now
Datasheet
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XA7A75T-1FGG484Q
AMD
Field Programmable Gate Array, 5900 CLBs, 1098MHz, 75520-Cell, PBGA484,
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
Package Description | BGA-484 | |
Reach Compliance Code | compliant | |
Factory Lead Time | 16 Weeks | |
Samacsys Manufacturer | AMD | |
Clock Frequency-Max | 1098 MHz | |
Combinatorial Delay of a CLB-Max | 1.27 ns | |
JESD-30 Code | S-PBGA-B484 | |
JESD-609 Code | e1 | |
Length | 23 mm | |
Moisture Sensitivity Level | 3 | |
Number of CLBs | 5900 | |
Number of Inputs | 285 | |
Number of Logic Cells | 75520 | |
Number of Outputs | 285 | |
Number of Terminals | 484 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 5900 CLBS | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA484,22X22,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | 250 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Qualification Status | Not Qualified | |
Screening Level | AEC-Q100; TS 16949 | |
Seated Height-Max | 2.6 mm | |
Supply Voltage-Max | 1.05 V | |
Supply Voltage-Min | 0.95 V | |
Supply Voltage-Nom | 1 V | |
Surface Mount | YES | |
Technology | HKMG | |
Temperature Grade | AUTOMOTIVE | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 23 mm |
XA7A75T-1FGG484Q Frequently Asked Questions (FAQ)
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The maximum operating temperature range for the XA7A75T-1FGG484Q is -40°C to 100°C.
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To optimize power consumption, use the power-saving features such as clock gating, dynamic voltage and frequency scaling, and shutdown modes. Additionally, optimize your design to minimize switching activity and use low-power modes when possible.
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The recommended PCB layout and stack-up for the XA7A75T-1FGG484Q involves using a 4-layer or 6-layer PCB with a stack-up of signal-ground-signal-ground-signal or signal-ground-power-ground-signal. This helps to minimize noise and ensure signal integrity.
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To ensure signal integrity and minimize noise, use differential signaling, add decoupling capacitors, and use a solid ground plane. Additionally, route critical signals away from noisy signals and use shielding when necessary.
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The recommended decoupling capacitor values are 0.1 μF and 10 μF, placed as close as possible to the device's power pins. Use a combination of ceramic and electrolytic capacitors to cover a wide frequency range.