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Part Details for WM9714CLGEFL/V by Cirrus Logic
Results Overview of WM9714CLGEFL/V by Cirrus Logic
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (1 replacement)
- CAD Models: (Available)
- Number of Functional Equivalents: (5 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
WM9714CLGEFL/V Information
WM9714CLGEFL/V by Cirrus Logic is a Codec.
Codecs are under the broader part category of Telecommunication Circuits.
A telecommunications circuit transmits and receives information between points. Key components include transmitters, receivers, amplifiers, and multiplexers. Read more about Telecommunication Circuits on our Telecommunication Circuits part category page.
Part Details for WM9714CLGEFL/V
WM9714CLGEFL/V CAD Models
WM9714CLGEFL/V Part Data Attributes
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WM9714CLGEFL/V
Cirrus Logic
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Datasheet
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WM9714CLGEFL/V
Cirrus Logic
PCM Codec, 1-Func, CMOS, PQCC48, 7 X 7 MM, 0.90 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, PLASTIC, MO-220VKKD-4, QFN-48
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | CIRRUS LOGIC INC | |
| Package Description | HVQCCN, | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Cirrus Logic | |
| Additional Feature | IT ALSO OPERATES WITH 3.3 VOLTS ANALOG SUPPLY | |
| Filter | YES | |
| JESD-30 Code | S-PQCC-N48 | |
| Length | 7 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 48 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -25 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HVQCCN | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
| Seated Height-Max | 1 mm | |
| Supply Voltage-Nom | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Telecom IC Type | PCM CODEC | |
| Temperature Grade | OTHER | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD | |
| Width | 7 mm |
Alternate Parts for WM9714CLGEFL/V
This table gives cross-reference parts and alternative options found for WM9714CLGEFL/V. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of WM9714CLGEFL/V, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
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| WM9714CLGEFL/RV | Cirrus Logic | Check for Price | PCM Codec, 1-Func, CMOS, PQCC48, 7 X 7 MM, 0.90 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, PLASTIC, MO-220VKKD-4, QFN-48 | WM9714CLGEFL/V vs WM9714CLGEFL/RV |
WM9714CLGEFL/V Frequently Asked Questions (FAQ)
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The recommended layout and placement for the WM9714CLGEFL/V can be found in the Cirrus Logic application note AN215, which provides guidelines for PCB layout, component placement, and thermal management.
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The WM9714CLGEFL/V can be configured using the Cirrus Logic Clock Domain (CLD) tool, which allows users to customize the device's settings, such as clock frequencies, PLL settings, and audio interface configurations.
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The WM9714CLGEFL/V requires a specific power sequencing order to ensure proper operation. The recommended power-up sequence is: AVDD, DVDD, and then CLKIN. The power-down sequence should be reversed.
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Cirrus Logic provides a troubleshooting guide in the WM9714CLGEFL/V datasheet, which covers common issues and their solutions. Additionally, engineers can use the Cirrus Logic support website and forums to find answers to common problems.
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The WM9714CLGEFL/V has a maximum junction temperature of 125°C. To ensure reliable operation, engineers should follow the thermal management guidelines in the datasheet, including using thermal vias, heat sinks, and thermal interface materials as needed.