-
Part Symbol
-
Footprint
-
3D Model
Available Download Formats
By downloading CAD models, you agree to our Terms & Conditions and Privacy Policy
Part Details for W9864G6JT-6 by Winbond Electronics Corp
Results Overview of W9864G6JT-6 by Winbond Electronics Corp
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (2 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
W9864G6JT-6 Information
W9864G6JT-6 by Winbond Electronics Corp is a DRAM.
DRAMs are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Price & Stock for W9864G6JT-6
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
|
DISTI #
454-W9864G6JT-6
|
Mouser Electronics | DRAM 64Mb SDR SDRAM x16, 166MHz RoHS: Compliant | 0 |
|
$2.6900 / $4.8700 | Order Now |
Part Details for W9864G6JT-6
W9864G6JT-6 CAD Models
W9864G6JT-6 Part Data Attributes
|
|
W9864G6JT-6
Winbond Electronics Corp
Buy Now
Datasheet
|
Compare Parts:
W9864G6JT-6
Winbond Electronics Corp
Synchronous DRAM, 4MX16, 5ns, CMOS, PBGA54, TFBGA-54
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Not Recommended | |
| Ihs Manufacturer | WINBOND ELECTRONICS CORP | |
| Part Package Code | BGA | |
| Package Description | TFBGA, BGA54,9X9,32 | |
| Pin Count | 54 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.02 | |
| Samacsys Manufacturer | Winbond | |
| Access Mode | FOUR BANK PAGE BURST | |
| Access Time-Max | 5 ns | |
| Additional Feature | AUTO/SELF REFRESH | |
| Clock Frequency-Max (fCLK) | 166 MHz | |
| I/O Type | COMMON | |
| Interleaved Burst Length | 1,2,4,8 | |
| JESD-30 Code | S-PBGA-B54 | |
| Length | 8 mm | |
| Memory Density | 67108864 bit | |
| Memory IC Type | SYNCHRONOUS DRAM | |
| Memory Width | 16 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 54 | |
| Number of Words | 4194304 words | |
| Number of Words Code | 4000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 4MX16 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA54,9X9,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Qualification Status | Not Qualified | |
| Refresh Cycles | 4096 | |
| Seated Height-Max | 1.2 mm | |
| Self Refresh | YES | |
| Sequential Burst Length | 1,2,4,8,FP | |
| Standby Current-Max | 0.002 A | |
| Supply Current-Max | 0.075 mA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 3 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 8 mm |
Alternate Parts for W9864G6JT-6
This table gives cross-reference parts and alternative options found for W9864G6JT-6. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of W9864G6JT-6, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| W9864G6JT-6I | Winbond Electronics Corp | Check for Price | Synchronous DRAM, 4MX16, 5ns, CMOS, PBGA54, TFBGA-54 | W9864G6JT-6 vs W9864G6JT-6I |
| W9864G6JT-6K | Winbond Electronics Corp | Check for Price | Synchronous DRAM, 4MX16, 5ns, CMOS, PBGA54, 8 X 8 MM, 0.80 MM PITCH, ROHS COMPLIANT, TFBGA-54 | W9864G6JT-6 vs W9864G6JT-6K |
W9864G6JT-6 Frequently Asked Questions (FAQ)
-
The recommended PCB layout for optimal performance involves keeping the signal traces short and away from noise sources, using a solid ground plane, and placing decoupling capacitors close to the chip. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
-
Thermal management is crucial for the W9864G6JT-6. Ensure good airflow around the chip, and consider using a heat sink or thermal pad to dissipate heat. The maximum junction temperature is 150°C, and the thermal resistance (θJA) is 30°C/W.
-
The maximum operating frequency for the W9864G6JT-6 is 166 MHz, but it can be overclocked to 200 MHz with careful consideration of power consumption and thermal management.
-
Power sequencing is critical for the W9864G6JT-6. Ensure that the power supplies are turned on in the correct sequence: VCC, then VCCQ, and finally VREF. The power-on reset (POR) circuitry will handle the internal voltage rails.
-
To minimize EMI and ensure EMC, use a shielded enclosure, keep signal traces short, and use EMI filters or common-mode chokes on the I/O lines. Ensure that the PCB layout and component placement comply with relevant EMI and EMC standards.