Part Details for W25Q128FVCIF by Winbond Electronics Corp
Results Overview of W25Q128FVCIF by Winbond Electronics Corp
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
W25Q128FVCIF Information
W25Q128FVCIF by Winbond Electronics Corp is a Flash Memory.
Flash Memories are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Price & Stock for W25Q128FVCIF
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
W25Q128FVCIF-ND
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DigiKey | IC FLASH 128MBIT SPI 24TFBGA Lead time: 28 Weeks Container: Tube | Limited Supply - Call |
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Part Details for W25Q128FVCIF
W25Q128FVCIF CAD Models
W25Q128FVCIF Part Data Attributes
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W25Q128FVCIF
Winbond Electronics Corp
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Datasheet
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W25Q128FVCIF
Winbond Electronics Corp
16M X 8 FLASH 3V PROM, PBGA24, TFBGA-24
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | WINBOND ELECTRONICS CORP | |
| Package Description | TFBGA-24 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Samacsys Manufacturer | Winbond | |
| Clock Frequency-Max (fCLK) | 104 MHz | |
| JESD-30 Code | R-PBGA-B24 | |
| Length | 8 mm | |
| Memory Density | 134217728 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 24 | |
| Number of Words | 16777216 words | |
| Number of Words Code | 16000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 16MX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE | |
| Parallel/Serial | SERIAL | |
| Programming Voltage | 3 V | |
| Seated Height-Max | 1.2 mm | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Type | NOR TYPE | |
| Width | 6 mm |