Part Details for VSC7427XJG-02 by Microchip Technology Inc
Results Overview of VSC7427XJG-02 by Microchip Technology Inc
- Distributor Offerings: (10 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Computing and Data Storage
Financial Technology (Fintech)
Electronic Manufacturing
Automotive
VSC7427XJG-02 Information
VSC7427XJG-02 by Microchip Technology Inc is a Telecom Switching Circuit.
Telecom Switching Circuits are under the broader part category of Telecommunication Circuits.
A telecommunications circuit transmits and receives information between points. Key components include transmitters, receivers, amplifiers, and multiplexers. Read more about Telecommunication Circuits on our Telecommunication Circuits part category page.
Price & Stock for VSC7427XJG-02
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
66AH1070
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Newark | Ethernet Sw, 1Gbps, 0 To 125Deg C Rohs Compliant: Yes |Microchip VSC7427XJG-02 RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 1 Container: Bulk | 36 |
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$74.0800 / $88.9200 | Buy Now |
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DISTI #
VSC7427XJG-02-ND
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DigiKey | IC TELECOM INTERFACE 672BGA Min Qty: 1 Lead time: 7 Weeks Container: Tray |
40 In Stock |
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$71.5875 / $88.9200 | Buy Now |
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DISTI #
VSC7427XJG-02
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Avnet Americas | Ethernet Controller, Gigabit Ethernet Switch, IEEE 802.3ab, IEEE 802.3af, IEEE 802.3az, 950 mV - Trays (Alt: VSC7427XJG-02) RoHS: Not Compliant Min Qty: 40 Package Multiple: 40 Lead time: 7 Weeks, 0 Days Container: Tray | 0 |
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$67.0060 / $71.5875 | Buy Now |
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DISTI #
494-VSC7427XJG-02
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Mouser Electronics | Ethernet ICs Managed Layer 2-switch, 26 port RoHS: Compliant | 0 |
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$74.0800 / $88.9200 | Order Now |
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DISTI #
VSC7427XJG-02
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Microchip Technology Inc | 26 Port Managed L2 Switch with 12 Integrated Cu PHYs, HSBGA, Projected EOL: 2044-10-19 COO: Taiwan ECCN: 5A991.c RoHS: Compliant Lead time: 7 Weeks, 0 Days Container: Tray |
40 Alternates Available |
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$59.0500 / $88.9200 | Buy Now |
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Onlinecomponents.com | RoHS: Compliant | 0 |
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$71.0900 / $148.9000 | Buy Now |
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NAC | RoHS: Compliant Min Qty: 40 Package Multiple: 40 | 0 |
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$69.8400 / $81.8100 | Buy Now |
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DISTI #
VSC7427XJG-02
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Avnet Silica | Ethernet Controller Gigabit Ethernet Switch IEEE 8023ab IEEE 8023af IEEE 8023az 950 mV (Alt: VSC7427XJG-02) RoHS: Compliant Min Qty: 40 Package Multiple: 40 Lead time: 9 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
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DISTI #
VSC7427XJG-02
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EBV Elektronik | Ethernet Controller Gigabit Ethernet Switch IEEE 8023ab IEEE 8023af IEEE 8023az 950 mV (Alt: VSC7427XJG-02) RoHS: Compliant Min Qty: 40 Package Multiple: 40 Lead time: 8 Weeks, 0 Days | EBV - 0 |
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Buy Now | |
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Master Electronics | RoHS: Compliant | 0 |
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$71.0900 / $148.9000 | Buy Now |
Part Details for VSC7427XJG-02
VSC7427XJG-02 CAD Models
VSC7427XJG-02 Part Data Attributes
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VSC7427XJG-02
Microchip Technology Inc
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Datasheet
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Compare Parts:
VSC7427XJG-02
Microchip Technology Inc
Telecom Circuit
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| Part Life Cycle Code | Active | |
| Ihs Manufacturer | MICROCHIP TECHNOLOGY INC | |
| Package Description | BGA-672 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A991.C | |
| HTS Code | 8542.39.00.01 | |
| Factory Lead Time | 7 Weeks | |
| Samacsys Manufacturer | Microchip | |
| JESD-30 Code | S-PBGA-B672 | |
| JESD-609 Code | e1 | |
| Length | 27 mm | |
| Moisture Sensitivity Level | 4 | |
| Number of Functions | 1 | |
| Number of Terminals | 672 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HBGA | |
| Package Equivalence Code | BGA672,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Seated Height-Max | 2.44 mm | |
| Supply Current-Max | 2700 mA | |
| Supply Voltage-Nom | 1 V | |
| Surface Mount | YES | |
| Telecom IC Type | ETHERNET SWITCH | |
| Temperature Grade | OTHER | |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm |
VSC7427XJG-02 Frequently Asked Questions (FAQ)
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A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from the power planes. Use a decoupling capacitor (e.g., 0.1uF) close to the device's power pins.
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Ensure good thermal conductivity by using a heat sink or a thermal pad on the device. Keep the junction temperature (TJ) below 125°C. Use a thermal interface material (e.g., thermal tape or thermal grease) to improve heat transfer.
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Power up the device in the following sequence: 1) Apply power to the core voltage (VCC), 2) Apply power to the I/O voltage (VCCIO), and 3) Apply the clock signal. This sequence helps prevent latch-up and ensures reliable operation.
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Check the JTAG clock frequency (TCK) and ensure it is within the recommended range (10-33 MHz). Verify the JTAG signal integrity and ensure the signal lines are not overloaded. Use a JTAG debugger or a logic analyzer to debug the issue.
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The VSC7427XJG-02 is not inherently radiation-hardened. For radiation-hardened applications, consider using a radiation-hardened version of the device or implementing radiation mitigation techniques, such as error correction codes and redundancy.