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Single channel smart power low-side switch
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
VNL5160S5-E by STMicroelectronics is a Peripheral Driver.
Peripheral Drivers are under the broader part category of Drivers And Interfaces.
A driver controls the current or voltage delivered to components like LCDs or motors, while an interface component connects systems for data transfer and control. Read more about Drivers And Interfaces on our Drivers And Interfaces part category page.
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
VNL5160S5-E
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Avnet Silica | Power Switch Lo Side 35A 8Pin SO N Tube (Alt: VNL5160S5-E) RoHS: Compliant Min Qty: 100 Package Multiple: 100 Lead time: 143 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
DISTI #
VNL5160S5-E
|
EBV Elektronik | Power Switch Lo Side 35A 8Pin SO N Tube (Alt: VNL5160S5-E) RoHS: Compliant Min Qty: 100 Package Multiple: 100 Lead time: 143 Weeks, 0 Days | EBV - 0 |
|
Buy Now |
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VNL5160S5-E
STMicroelectronics
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Datasheet
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VNL5160S5-E
STMicroelectronics
Single channel smart power low-side switch
|
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | STMICROELECTRONICS | |
Part Package Code | SOIC | |
Package Description | ROHS COMPLIANT, SOP-8 | |
Pin Count | 8 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.39.00.01 | |
Samacsys Manufacturer | STMicroelectronics | |
Built-in Protections | TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE | |
Driver Number of Bits | 1 | |
Interface IC Type | BUFFER OR INVERTER BASED PERIPHERAL DRIVER | |
JESD-30 Code | R-PDSO-G8 | |
JESD-609 Code | e3 | |
Length | 4.9 mm | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 8 | |
Output Current Flow Direction | SOURCE | |
Output Current-Max | 1 A | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | SOP | |
Package Equivalence Code | SOP8,.25 | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE | |
Peak Reflow Temperature (Cel) | 245 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.75 mm | |
Supply Voltage-Max | 5.5 V | |
Supply Voltage-Min | 3.5 V | |
Supply Voltage-Nom | 5 V | |
Surface Mount | YES | |
Terminal Finish | Matte Tin (Sn) | |
Terminal Form | GULL WING | |
Terminal Pitch | 1.27 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Width | 3.9 mm |
This table gives cross-reference parts and alternative options found for VNL5160S5-E. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of VNL5160S5-E, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Manufacturer | Composite Price | Description | Compare |
---|---|---|---|---|
VNL5160S5TR-E | STMicroelectronics | Check for Price | Single channel smart power low-side switch | VNL5160S5-E vs VNL5160S5TR-E |
STMicroelectronics provides a recommended PCB layout in the application note AN4979, which includes guidelines for component placement, routing, and thermal management.
The VNL5160S5-E requires a 5V power supply, and it's recommended to use a low-dropout linear regulator (LDO) to ensure a stable voltage supply. Additionally, decoupling capacitors should be placed close to the device to filter out noise and ensure stable operation.
The maximum current rating for the VNL5160S5-E is 1.5A, but it's recommended to limit the current to 1A for reliable operation and to prevent overheating.
The VNL5160S5-E can be configured for different operating modes using the EN (enable) and MODE pins. The datasheet provides a truth table for configuring the device for different modes, including normal operation, shutdown, and low-power modes.
The VNL5160S5-E has a thermal pad on the bottom of the package, which should be connected to a thermal ground plane on the PCB to dissipate heat. Additionally, the device should be placed in a well-ventilated area to prevent overheating.