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Part Details for VND830SP-E by STMicroelectronics
Results Overview of VND830SP-E by STMicroelectronics
- Distributor Offerings: (5 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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VND830SP-E Information
VND830SP-E by STMicroelectronics is a Peripheral Driver.
Peripheral Drivers are under the broader part category of Drivers And Interfaces.
A driver controls the current or voltage delivered to components like LCDs or motors, while an interface component connects systems for data transfer and control. Read more about Drivers And Interfaces on our Drivers And Interfaces part category page.
Price & Stock for VND830SP-E
| Part # | Distributor | Description | Stock | Price | Buy | |
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STMicroelectronics | DOUBLE CHANNEL HIGH SIDE DRIVER RoHS: Compliant Min Qty: 1 | 0 |
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$3.2300 / $5.1600 | Buy Now |
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DISTI #
VND830SP-E
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Avnet Silica | Power Switch Hi Side 9A 10Pin102Tab PowerSO Tube (Alt: VND830SP-E) RoHS: Compliant Min Qty: 50 Package Multiple: 50 Lead time: 143 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
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DISTI #
VND830SP-E
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EBV Elektronik | Power Switch Hi Side 9A 10Pin102Tab PowerSO Tube (Alt: VND830SP-E) RoHS: Compliant Min Qty: 50 Package Multiple: 50 Lead time: 143 Weeks, 0 Days | EBV - 0 |
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Buy Now | |
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Vyrian | Interface ICs | 1111 |
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RFQ | |
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Win Source Electronics | IC DRIVER HIGH SIDE 2CH PWRSO10 | 18790 |
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$5.7778 / $8.6666 | Buy Now |
Part Details for VND830SP-E
VND830SP-E CAD Models
VND830SP-E Part Data Attributes
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VND830SP-E
STMicroelectronics
Buy Now
Datasheet
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Compare Parts:
VND830SP-E
STMicroelectronics
DOUBLE CHANNEL HIGH SIDE DRIVER
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | STMICROELECTRONICS | |
| Part Package Code | SOIC | |
| Package Description | SOP-10 | |
| Pin Count | 10 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | STMicroelectronics | |
| Built-in Protections | TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE | |
| Driver Number of Bits | 2 | |
| Interface IC Type | BUFFER OR INVERTER BASED PERIPHERAL DRIVER | |
| JESD-30 Code | R-PDSO-G10 | |
| JESD-609 Code | e3 | |
| Length | 9.4 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 10 | |
| Operating Temperature-Max | 150 °C | |
| Operating Temperature-Min | -40 °C | |
| Output Current Flow Direction | SINK | |
| Output Peak Current Limit-Nom | 9 A | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HSOP | |
| Package Equivalence Code | SOP10,.55 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, HEAT SINK/SLUG | |
| Peak Reflow Temperature (Cel) | 250 | |
| Qualification Status | Not Qualified | |
| Screening Level | AEC-Q100 | |
| Seated Height-Max | 3.75 mm | |
| Supply Current-Max | 14 mA | |
| Supply Voltage-Max | 36 V | |
| Supply Voltage-Min | 5.5 V | |
| Supply Voltage-Nom | 13 V | |
| Surface Mount | YES | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 7.5 mm |
VND830SP-E Frequently Asked Questions (FAQ)
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STMicroelectronics provides a recommended PCB layout in the application note AN5323, which includes guidelines for component placement, routing, and thermal management.
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The VND830SP-E requires a 3.3V power supply, and it's recommended to use a low-dropout linear regulator (LDO) to ensure a stable voltage supply. Additionally, decoupling capacitors should be placed close to the device to filter out noise and ensure stable operation.
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The maximum current rating for the VND830SP-E is 1.5A, but it's recommended to limit the current to 1A for reliable operation and to prevent overheating.
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The VND830SP-E can be configured for half-bridge or full-bridge operation by connecting the appropriate pins and setting the enable pins (EN1 and EN2) accordingly. Refer to the datasheet and application notes for specific configuration details.
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The VND830SP-E has a thermal pad that should be connected to a heat sink or a thermal interface material to dissipate heat. A thermal management strategy should be implemented to keep the junction temperature below 150°C to ensure reliable operation.