Part Details for VKM60-01P1 by IXYS Corporation
Results Overview of VKM60-01P1 by IXYS Corporation
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Automotive
VKM60-01P1 Information
VKM60-01P1 by IXYS Corporation is a Power Field-Effect Transistor.
Power Field-Effect Transistors are under the broader part category of Transistors.
A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| RJE73188001P1 | Amphenol Communications Solutions | Modular Jack - Right Angle, Input Output Connectors 8P8C, Shield, With LEDs. | |
| RJE4518801P1 | Amphenol Communications Solutions | Modular Jack - 8P8C, Vertical, Cat6, THT, No Panel Stops, Single Port, No Shield, With LEDs | |
| 10145226-0201P11LF | Amphenol Communications Solutions | DDR4 DIMM, Storage and Server Connector, Vertical , Through Hole, 288 Position , 0.85mm (0.033in) Pitch |
Price & Stock for VKM60-01P1
| Part # | Distributor | Description | Stock | Price | Buy | |
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Vyrian | Transistors | 1249 |
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RFQ |
Part Details for VKM60-01P1
VKM60-01P1 CAD Models
VKM60-01P1 Part Data Attributes
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VKM60-01P1
IXYS Corporation
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Datasheet
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VKM60-01P1
IXYS Corporation
Power Field-Effect Transistor, 75A I(D), 100V, 0.025ohm, 4-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, ECOPAC-15
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | IXYS CORP | |
| Package Description | ECOPAC-15 | |
| Pin Count | 15 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| Additional Feature | HIGH RELIABILITY | |
| Case Connection | ISOLATED | |
| Configuration | BRIDGE, 4 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR | |
| DS Breakdown Voltage-Min | 100 V | |
| Drain Current-Max (ID) | 75 A | |
| Drain-source On Resistance-Max | 0.025 Ω | |
| FET Technology | METAL-OXIDE SEMICONDUCTOR | |
| JESD-30 Code | R-XUFM-X15 | |
| Number of Elements | 4 | |
| Number of Terminals | 15 | |
| Operating Mode | ENHANCEMENT MODE | |
| Operating Temperature-Max | 150 °C | |
| Package Body Material | UNSPECIFIED | |
| Package Shape | RECTANGULAR | |
| Package Style | FLANGE MOUNT | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Polarity/Channel Type | N-CHANNEL | |
| Pulsed Drain Current-Max (IDM) | 300 A | |
| Qualification Status | Not Qualified | |
| Surface Mount | NO | |
| Terminal Form | UNSPECIFIED | |
| Terminal Position | UPPER | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Transistor Application | SWITCHING | |
| Transistor Element Material | SILICON |
VKM60-01P1 Frequently Asked Questions (FAQ)
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A recommended PCB layout for optimal thermal performance would be to use a large copper area for the drain pad, and to connect it to a heat sink or a thermal pad. Additionally, using thermal vias under the drain pad can help to dissipate heat more efficiently.
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To ensure reliable operation in high-temperature environments, it's essential to follow the recommended derating curves for the device. Additionally, consider using a heat sink or thermal management system to keep the junction temperature below the maximum rated value. It's also crucial to ensure good airflow and to avoid thermal hotspots.
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Exceeding the maximum rated junction temperature can lead to a reduction in the device's lifespan, increased thermal resistance, and potentially even catastrophic failure. It's essential to ensure that the device operates within the recommended temperature range to maintain reliability and performance.
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To protect the device from EOS and ESD, it's recommended to use proper handling and storage procedures, such as using anti-static bags and wrist straps. Additionally, consider using EOS and ESD protection devices, such as TVS diodes or ESD protection arrays, in the circuit design.
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The recommended soldering and assembly techniques for the VKM60-01P1 include using a soldering iron with a temperature range of 250°C to 260°C, and a soldering time of 3-5 seconds. It's also essential to follow the recommended land pattern and soldering layout to ensure reliable connections.