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Part Details for US1MHM2G by Taiwan Semiconductor
Results Overview of US1MHM2G by Taiwan Semiconductor
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
US1MHM2G Information
US1MHM2G by Taiwan Semiconductor is a Rectifier Diode.
Rectifier Diodes are under the broader part category of Diodes.
A diode is a electrical part that can control the direction in which the current flows in a device. Consider factors like voltage drop, current capacity, reverse voltage, and operating frequency when selecting a diode. Read more about Diodes on our Diodes part category page.
Price & Stock for US1MHM2G
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
US1MHM2G
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EBV Elektronik | Diode High Efficient Recovery Rectifier 1000V 1A 2Pin DO214AC TR (Alt: US1MHM2G) RoHS: Compliant Min Qty: 15000 Package Multiple: 7500 | EBV - 120000 |
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Part Details for US1MHM2G
US1MHM2G CAD Models
US1MHM2G Part Data Attributes
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US1MHM2G
Taiwan Semiconductor
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Datasheet
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US1MHM2G
Taiwan Semiconductor
Rectifier Diode, 1 Element, 1A, 1000V V(RRM), Silicon, DO-214AC, SMA, 2 PIN
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | TAIWAN SEMICONDUCTOR CO LTD | |
| Package Description | SMA, 2 PIN | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8541.10.00.80 | |
| Samacsys Manufacturer | Taiwan Semiconductor | |
| Application | GENERAL PURPOSE | |
| Configuration | SINGLE | |
| Diode Element Material | SILICON | |
| Diode Type | RECTIFIER DIODE | |
| JEDEC-95 Code | DO-214AC | |
| JESD-30 Code | R-PDSO-C2 | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 1 | |
| Non-rep Pk Forward Current-Max | 30 A | |
| Number of Elements | 1 | |
| Number of Phases | 1 | |
| Number of Terminals | 2 | |
| Operating Temperature-Max | 150 °C | |
| Operating Temperature-Min | -55 °C | |
| Output Current-Max | 1 A | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| Peak Reflow Temperature (Cel) | 250 | |
| Reference Standard | AEC-Q101 | |
| Rep Pk Reverse Voltage-Max | 1000 V | |
| Reverse Recovery Time-Max | 0.075 µs | |
| Surface Mount | YES | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | C BEND | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 30 |
US1MHM2G Frequently Asked Questions (FAQ)
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A thermal pad is recommended under the package to improve heat dissipation. A minimum of 2oz copper thickness and a thermal relief pattern around the thermal pad is suggested. Additionally, a solid ground plane on the bottom layer can help to reduce thermal resistance.
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To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, including voltage and current ratings. Additionally, consider using a heat sink or thermal management system to keep the junction temperature below 150°C. Regular cleaning and maintenance can also help to prevent thermal issues.
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The US1MHM2G has built-in ESD protection, but it's still important to follow proper handling and assembly procedures to prevent damage. Use an ESD wrist strap or mat, and ensure that all equipment and tools are properly grounded. Avoid touching the device's pins or exposed internal components.
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While the US1MHM2G is designed to operate in a variety of environments, high humidity can still affect its performance and reliability. Consider using a conformal coating or potting compound to protect the device from moisture. Ensure that the device is properly sealed and that any connectors or interfaces are designed to prevent moisture ingress.
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The recommended soldering conditions for the US1MHM2G are: peak temperature of 260°C, soldering time of 10 seconds, and a soldering iron temperature of 350°C. Ensure that the device is properly cleaned and prepared before soldering, and avoid applying excessive force or pressure during the soldering process.