Part Details for UPD60610GA-GAM-AX by Renesas Electronics Corporation
Results Overview of UPD60610GA-GAM-AX by Renesas Electronics Corporation
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (8 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Industrial Automation
Renewable Energy
Robotics and Drones
UPD60610GA-GAM-AX Information
UPD60610GA-GAM-AX by Renesas Electronics Corporation is a Network Interface.
Network Interfaces are under the broader part category of Telecommunication Circuits.
A telecommunications circuit transmits and receives information between points. Key components include transmitters, receivers, amplifiers, and multiplexers. Read more about Telecommunication Circuits on our Telecommunication Circuits part category page.
Price & Stock for UPD60610GA-GAM-AX
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
UPD60610GA-GAM-AX
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Avnet Silica | RENUPD60610GAGAMAX (Alt: UPD60610GA-GAM-AX) RoHS: Compliant Min Qty: 250 Package Multiple: 250 | Silica - 0 |
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Part Details for UPD60610GA-GAM-AX
UPD60610GA-GAM-AX CAD Models
UPD60610GA-GAM-AX Part Data Attributes
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UPD60610GA-GAM-AX
Renesas Electronics Corporation
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Datasheet
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UPD60610GA-GAM-AX
Renesas Electronics Corporation
DATACOM, NETWORK INTERFACE SUPPORT CIRCUIT, PQFP48
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
| Package Description | 7 X 7 MM, 0.50 MM PITCH, PLASTIC, LQFP-48 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| JESD-30 Code | S-PQFP-G48 | |
| Number of Functions | 1 | |
| Number of Terminals | 48 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QFP | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Telecom IC Type | SUPPORT CIRCUIT | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | GULL WING | |
| Terminal Position | QUAD |
Alternate Parts for UPD60610GA-GAM-AX
This table gives cross-reference parts and alternative options found for UPD60610GA-GAM-AX. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of UPD60610GA-GAM-AX, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| NB4N7132DTG | onsemi | $4.0051 | Link Replicator for Fibre Channel, Gigabit Ethernet, HDTV and SATA (1.5 Gbps), 28 Lead TSSOP, 50-TUBE | UPD60610GA-GAM-AX vs NB4N7132DTG |
| NB4N1158DTR2G | onsemi | Check for Price | DATACOM, NETWORK INTERFACE SUPPORT CIRCUIT, PDSO28, 4.70 X 9.70 MM, LEAD FREE, TSSOP-28 | UPD60610GA-GAM-AX vs NB4N1158DTR2G |
| ML6651CH | RF Micro Devices Inc | Check for Price | Support Circuit, PQFP44, 10 X 10 MM, 1 MM HEIGHT, TQFP-44 | UPD60610GA-GAM-AX vs ML6651CH |
| T7031M-PEP | Atmel Corporation | Check for Price | Support Circuit, 4 X 4 MM, MO-220, QFN-16 | UPD60610GA-GAM-AX vs T7031M-PEP |
| HDMP-1687 | Agilent Technologies Inc | Check for Price | Support Circuit, Bipolar, PBGA208, 23 MM, TBGA-208 | UPD60610GA-GAM-AX vs HDMP-1687 |
| UPD60610GA-GAM-M1-AX | Renesas Electronics Corporation | Check for Price | DATACOM, NETWORK INTERFACE SUPPORT CIRCUIT, PQFP48 | UPD60610GA-GAM-AX vs UPD60610GA-GAM-M1-AX |
| ATR3515-PES | Atmel Corporation | Check for Price | Support Circuit, 4 X 4 MM, MO-220, QFN-16 | UPD60610GA-GAM-AX vs ATR3515-PES |
| PN5331B3HN/C270,51 | NXP Semiconductors | Check for Price | PN5331B3HN - USB NFC integrated solution QFN 40-Pin | UPD60610GA-GAM-AX vs PN5331B3HN/C270,51 |
UPD60610GA-GAM-AX Frequently Asked Questions (FAQ)
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A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
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Ensure that the device is operated within the recommended voltage and current ranges, and that the PCB is designed to minimize thermal resistance. Also, consider using thermal protection circuits and over-temperature protection.
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Use 0.1uF to 1uF ceramic capacitors placed as close as possible to the device's power pins. Additional bulk capacitors (10uF to 100uF) can be placed near the power source.
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Check the oscillator circuit for proper component values and layout. Verify that the oscillator pins are not loaded or shorted. Use an oscilloscope to measure the oscillator output and verify its frequency and amplitude.
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Not using the internal voltage regulator may require an external voltage regulator, which can increase the overall system cost and complexity. However, it can also provide more flexibility in terms of voltage regulation and noise reduction.