Part Details for UL62H256AS2A35G1 by ZMDI
Results Overview of UL62H256AS2A35G1 by ZMDI
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (9 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Security and Surveillance
Internet of Things (IoT)
Financial Technology (Fintech)
Smart Cities
Healthcare
Telecommunications
Medical Imaging
UL62H256AS2A35G1 Information
UL62H256AS2A35G1 by ZMDI is an SRAM.
SRAMs are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Price & Stock for UL62H256AS2A35G1
| Part # | Distributor | Description | Stock | Price | Buy | |
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ComSIT USA | LOW VOLTAGE AUTOMOTIVE FAST 32K X 8 SRAM Standard SRAM, 32KX8, 35ns, CMOS, PDSO28 ECCN: EAR99 RoHS: Not Compliant |
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RFQ |
Part Details for UL62H256AS2A35G1
UL62H256AS2A35G1 CAD Models
UL62H256AS2A35G1 Part Data Attributes
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UL62H256AS2A35G1
ZMDI
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Datasheet
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UL62H256AS2A35G1
ZMDI
Standard SRAM, 32KX8, 35ns, CMOS, PDSO28, 0.330 INCH, LEAD FREE, SOP2-28
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | ZENTRUM MIKROELEKTRONIK DRESDEN AG | |
| Part Package Code | SOIC | |
| Package Description | 0.330 INCH, LEAD FREE, SOP2-28 | |
| Pin Count | 28 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 35 ns | |
| JESD-30 Code | R-PDSO-G28 | |
| JESD-609 Code | e3 | |
| Length | 18.1 mm | |
| Memory Density | 262144 bit | |
| Memory IC Type | STANDARD SRAM | |
| Memory Width | 8 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 28 | |
| Number of Words | 32768 words | |
| Number of Words Code | 32000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 32KX8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | SOP | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.54 mm | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.5 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 8.75 mm |
Alternate Parts for UL62H256AS2A35G1
This table gives cross-reference parts and alternative options found for UL62H256AS2A35G1. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of UL62H256AS2A35G1, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| UL62H256AS2A35 | Alliance Memory Inc | Check for Price | Standard SRAM, 32KX8, 35ns, CMOS, PDSO28, 0.330 INCH, SOP2-28 | UL62H256AS2A35G1 vs UL62H256AS2A35 |
| UL62H256AS2K35 | Cypress Semiconductor | Check for Price | 32KX8 STANDARD SRAM, 35ns, PDSO28, 0.330 INCH, SOP2-28 | UL62H256AS2A35G1 vs UL62H256AS2K35 |
| UL62H256AS2A35 | Simtek Corporation | Check for Price | Standard SRAM, 32KX8, 35ns, CMOS, PDSO28, 0.330 INCH, SOP2-28 | UL62H256AS2A35G1 vs UL62H256AS2A35 |
| UL62H256AS2K35G1 | Cypress Semiconductor | Check for Price | 32KX8 STANDARD SRAM, 35ns, PDSO28, 0.330 INCH, LEAD FREE, SOP2-28 | UL62H256AS2A35G1 vs UL62H256AS2K35G1 |
| UL62H256AS2K35G1 | Simtek Corporation | Check for Price | Standard SRAM, 32KX8, 35ns, CMOS, PDSO28, 0.330 INCH, LEAD FREE, SOP2-28 | UL62H256AS2A35G1 vs UL62H256AS2K35G1 |
| UL62H256AS2A35G1 | Cypress Semiconductor | Check for Price | 32KX8 STANDARD SRAM, 35ns, PDSO28, 0.330 INCH, LEAD FREE, SOP2-28 | UL62H256AS2A35G1 vs UL62H256AS2A35G1 |
| UL62H256AS2K35G1 | ZMDI | Check for Price | Standard SRAM, 32KX8, 35ns, CMOS, PDSO28, 0.330 INCH, LEAD FREE, SOP2-28 | UL62H256AS2A35G1 vs UL62H256AS2K35G1 |
| UL62H256AS2K35 | ZMDI | Check for Price | Standard SRAM, 32KX8, 35ns, CMOS, PDSO28, 0.330 INCH, SOP2-28 | UL62H256AS2A35G1 vs UL62H256AS2K35 |
| UL62H256AS2K35G1 | Alliance Memory Inc | Check for Price | Standard SRAM, 32KX8, 35ns, CMOS, PDSO28, 0.330 INCH, LEAD FREE, SOP2-28 | UL62H256AS2A35G1 vs UL62H256AS2K35G1 |
UL62H256AS2A35G1 Frequently Asked Questions (FAQ)
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The recommended PCB layout for the UL62H256AS2A35G1 can be found in the ZMDI application note AN-101, which provides guidelines for PCB design, component placement, and thermal management to ensure optimal performance and reliability.
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The UL62H256AS2A35G1 has a thermal pad on the bottom of the package, which should be connected to a thermal ground plane on the PCB to dissipate heat. Additionally, the device should be mounted on a heat sink or a metal core PCB to further improve thermal management.
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The UL62H256AS2A35G1 has an operating temperature range of -40°C to 125°C, making it suitable for automotive and industrial applications.
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The OTP memory of the UL62H256AS2A35G1 can be programmed using ZMDI's proprietary programming tool, which is available upon request. The tool provides a user-friendly interface for programming the device's configuration and calibration data.
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The recommended power-up sequence for the UL62H256AS2A35G1 is to first apply the analog power supply (VDDA) followed by the digital power supply (VDDD). This ensures that the device's internal analog circuits are powered up before the digital logic.