Part Details for TSPC603RVGS10LC by Teledyne e2v
Results Overview of TSPC603RVGS10LC by Teledyne e2v
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (2 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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TSPC603RVGS10LC Information
TSPC603RVGS10LC by Teledyne e2v is a Microprocessor.
Microprocessors are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Part Details for TSPC603RVGS10LC
TSPC603RVGS10LC CAD Models
TSPC603RVGS10LC Part Data Attributes
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TSPC603RVGS10LC
Teledyne e2v
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Datasheet
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TSPC603RVGS10LC
Teledyne e2v
TSPC603RVGS10LC, BGA-255
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | TELEDYNE E2V (UK) LTD | |
| Part Package Code | BGA | |
| Package Description | 21 X 21 MM, 3.84 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 | |
| Pin Count | 255 | |
| Reach Compliance Code | unknown | |
| Address Bus Width | 32 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 233 MHz | |
| External Data Bus Width | 64 | |
| Format | FLOATING POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-CBGA-B255 | |
| Length | 21 mm | |
| Low Power Mode | YES | |
| Number of Terminals | 255 | |
| Operating Temperature-Max | 110 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | BGA | |
| Package Equivalence Code | BGA255,16X16,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 3.84 mm | |
| Speed | 233 MHz | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| Supply Voltage-Nom | 2.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 21 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for TSPC603RVGS10LC
This table gives cross-reference parts and alternative options found for TSPC603RVGS10LC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TSPC603RVGS10LC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| TSPC603RVGS10LC | Thales Components Corp | Check for Price | TSPC603RVGS10LC | TSPC603RVGS10LC vs TSPC603RVGS10LC |
| TSPC603RMGS10LC | Thales Components Corp | Check for Price | TSPC603RMGS10LC | TSPC603RVGS10LC vs TSPC603RMGS10LC |