Part Details for TSPC603RVGH10LC by Teledyne e2v
Results Overview of TSPC603RVGH10LC by Teledyne e2v
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (9 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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TSPC603RVGH10LC Information
TSPC603RVGH10LC by Teledyne e2v is a Microprocessor.
Microprocessors are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for TSPC603RVGH10LC
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
TSPC603RVGH10LC
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Avnet Silica | MPU PID7t603e RISC 64Bit 029um 233MHz 33V 255Pin HITCE CBGA (Alt: TSPC603RVGH10LC) RoHS: Not Compliant Min Qty: 60 Package Multiple: 60 Lead time: 143 Weeks, 0 Days | Silica - 0 |
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Part Details for TSPC603RVGH10LC
TSPC603RVGH10LC CAD Models
TSPC603RVGH10LC Part Data Attributes
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TSPC603RVGH10LC
Teledyne e2v
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Datasheet
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TSPC603RVGH10LC
Teledyne e2v
RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA255, 21 X 21 MM, 3.08 MM HEIGHT, 1.27 MM PITCH, CERAMIC, HITCEBGA-255
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Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | TELEDYNE E2V (UK) LTD | |
Part Package Code | BGA | |
Package Description | 21 X 21 MM, 3.08 MM HEIGHT, 1.27 MM PITCH, CERAMIC, HITCEBGA-255 | |
Pin Count | 255 | |
Reach Compliance Code | unknown | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Address Bus Width | 32 | |
Bit Size | 32 | |
Boundary Scan | YES | |
Clock Frequency-Max | 233 MHz | |
External Data Bus Width | 64 | |
Format | FLOATING POINT | |
Integrated Cache | YES | |
JESD-30 Code | S-CBGA-B255 | |
Length | 21 mm | |
Low Power Mode | YES | |
Number of Terminals | 255 | |
Operating Temperature-Max | 110 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | BGA | |
Package Equivalence Code | BGA255,16X16,50 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Qualification Status | Not Qualified | |
Seated Height-Max | 3.08 mm | |
Speed | 233 MHz | |
Supply Voltage-Max | 2.625 V | |
Supply Voltage-Min | 2.375 V | |
Supply Voltage-Nom | 2.5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 21 mm | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for TSPC603RVGH10LC
This table gives cross-reference parts and alternative options found for TSPC603RVGH10LC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TSPC603RVGH10LC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Manufacturer | Composite Price | Description | Compare |
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TSPC603RMGB/Q10LC | Atmel Corporation | Check for Price | RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 | TSPC603RVGH10LC vs TSPC603RMGB/Q10LC |
TSXPC603RVGH10LC | Atmel Corporation | Check for Price | RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA255, 21 X 21 MM, 3.08 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-255 | TSPC603RVGH10LC vs TSXPC603RVGH10LC |
TSPC603RVGB/Q10LC | Teledyne e2v | Check for Price | RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 | TSPC603RVGH10LC vs TSPC603RVGB/Q10LC |
TSXPC603RVGU/T10LC | Atmel Corporation | Check for Price | 32-BIT, 233MHz, RISC PROCESSOR, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 | TSPC603RVGH10LC vs TSXPC603RVGU/T10LC |
TSXPC603RMG10LC | Teledyne e2v | Check for Price | RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 | TSPC603RVGH10LC vs TSXPC603RMG10LC |
TSXPC603RMGH10LC | Teledyne e2v | Check for Price | RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA255, 21 X 21 MM, 3.08 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-255 | TSPC603RVGH10LC vs TSXPC603RMGH10LC |
TSPC603RVGU/T10LC | Atmel Corporation | Check for Price | RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 | TSPC603RVGH10LC vs TSPC603RVGU/T10LC |
TSXPC603RMGU10LC | Teledyne e2v | Check for Price | RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 | TSPC603RVGH10LC vs TSXPC603RMGU10LC |
TSXPC603RVGU10LC | Teledyne e2v | Check for Price | RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 | TSPC603RVGH10LC vs TSXPC603RVGU10LC |