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2.5-V dual channel 460kbps RS-232 line driver/receiver with +/-8-kV IEC-ESD protection 20-TSSOP -40 to 85
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
TRS3318EIPW by Texas Instruments is a Line Driver or Receiver.
Line Driver or Receivers are under the broader part category of Drivers And Interfaces.
A driver controls the current or voltage delivered to components like LCDs or motors, while an interface component connects systems for data transfer and control. Read more about Drivers And Interfaces on our Drivers And Interfaces part category page.
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TRS3318EIPW
Texas Instruments
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Datasheet
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TRS3318EIPW
Texas Instruments
2.5-V dual channel 460kbps RS-232 line driver/receiver with +/-8-kV IEC-ESD protection 20-TSSOP -40 to 85
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
Part Package Code | TSSOP | |
Package Description | GREEN, PLASTIC, TSSOP-20 | |
Pin Count | 20 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.39.00.01 | |
Samacsys Manufacturer | Texas Instruments | |
Differential Output | NO | |
Driver Number of Bits | 2 | |
Input Characteristics | SCHMITT TRIGGER | |
Interface IC Type | LINE TRANSCEIVER | |
Interface Standard | EIA-232 | |
JESD-30 Code | R-PDSO-G20 | |
JESD-609 Code | e4 | |
Length | 6.5 mm | |
Moisture Sensitivity Level | 1 | |
Number of Functions | 2 | |
Number of Terminals | 20 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Out Swing-Min | 7.4 V | |
Output Low Current-Max | 0.0005 A | |
Output Polarity | TRUE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TSSOP | |
Package Equivalence Code | TSSOP20,.25 | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Receive Delay-Max | 175 ns | |
Receiver Number of Bits | 2 | |
Seated Height-Max | 1.2 mm | |
Supply Current-Max | 2 mA | |
Supply Voltage-Max | 3 V | |
Supply Voltage-Min | 2.25 V | |
Supply Voltage-Nom | 2.5 V | |
Supply Voltage1-Max | 3 V | |
Supply Voltage1-Min | 2.25 V | |
Supply Voltage1-Nom | 2.5 V | |
Surface Mount | YES | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | NICKEL PALLADIUM GOLD | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.65 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Transmit Delay-Max | 175 ns | |
Width | 4.4 mm |
This table gives cross-reference parts and alternative options found for TRS3318EIPW. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TRS3318EIPW, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Manufacturer | Composite Price | Description | Compare |
---|---|---|---|---|
TRS3318EIPWRG4 | Texas Instruments | Check for Price | 2.5-V dual channel 460kbps RS-232 line driver/receiver with +/-8-kV IEC-ESD protection 20-TSSOP -40 to 85 | TRS3318EIPW vs TRS3318EIPWRG4 |
Texas Instruments provides a recommended PCB layout in the TRS3318EIPW datasheet, which includes a thermal pad connected to a copper plane on the PCB. This helps to dissipate heat efficiently. Additionally, it's recommended to use a 4-layer PCB with a solid ground plane and to minimize the distance between the device and the thermal pad.
To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions and thermal design guidelines. This includes keeping the junction temperature (TJ) below 150°C, using a heat sink if necessary, and ensuring good airflow around the device. Additionally, consider using a thermistor or thermal sensor to monitor the temperature and implement thermal protection mechanisms.
To minimize EMI and RFI, it's recommended to use a shielded enclosure, keep the device away from noise sources, and use a low-pass filter on the input lines. Additionally, ensure that the PCB layout is designed to minimize radiation and that the device is properly grounded. Texas Instruments also provides EMI and RFI mitigation guidelines in the datasheet and application notes.
The selection of input and output capacitors depends on the specific application requirements, such as the input voltage, output voltage, and ripple current. Texas Instruments provides guidelines for capacitor selection in the datasheet and application notes. In general, it's recommended to use low-ESR capacitors with a high ripple current rating and to follow the recommended capacitor values and configurations.
Common pitfalls to avoid during design and layout include not following the recommended PCB layout, not providing adequate thermal dissipation, and not ensuring proper input and output filtering. Additionally, it's essential to avoid voltage and current overstress, and to ensure that the device is operated within the recommended operating conditions.