Part Details for TPC817CC9G by Taiwan Semiconductor
Results Overview of TPC817CC9G by Taiwan Semiconductor
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Space Technology
Aerospace and Defense
Transportation and Logistics
Renewable Energy
Automotive
Robotics and Drones
TPC817CC9G Information
TPC817CC9G by Taiwan Semiconductor is an Optocoupler.
Optocoupler are under the broader part category of Optoelectronics.
Optoelectronic components work to detect, generate, and control light. They can essentially produce and/or react to light. Read more about Optoelectronics on our Optoelectronics part category page.
Price & Stock for TPC817CC9G
| Part # | Distributor | Description | Stock | Price | Buy | |
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Vyrian | Optoelectronics | 1375 |
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RFQ |
Part Details for TPC817CC9G
TPC817CC9G CAD Models
TPC817CC9G Part Data Attributes
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TPC817CC9G
Taiwan Semiconductor
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Datasheet
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TPC817CC9G
Taiwan Semiconductor
Transistor Output Optocoupler, 1-Element, 5000V Isolation, DIP-4
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | TAIWAN SEMICONDUCTOR CO LTD | |
| Package Description | DIP-4 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8541.40.80.00 | |
| Additional Feature | UL RECOGNIZED | |
| Coll-Emtr Bkdn Voltage-Min | 80 V | |
| Configuration | SINGLE | |
| Current Transfer Ratio-Nom | 200% | |
| Dark Current-Max | 100 nA | |
| Forward Current-Max | 0.05 A | |
| Isolation Voltage-Max | 5000 V | |
| JESD-609 Code | e3 | |
| Number of Elements | 1 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Optoelectronic Device Type | TRANSISTOR OUTPUT OPTOCOUPLER | |
| Terminal Finish | MATTE TIN |
TPC817CC9G Frequently Asked Questions (FAQ)
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The recommended PCB layout for optimal thermal performance involves placing thermal vias under the package, using a solid ground plane, and keeping the thermal traces as short and wide as possible. A 4-layer PCB with a dedicated thermal layer is also recommended.
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To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, use a suitable heat sink, and implement thermal management techniques such as thermal throttling or shutdown. Additionally, ensure that the device is properly soldered and the PCB is designed to minimize thermal resistance.
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The critical parameters to monitor during operation include the junction temperature (TJ), drain-source voltage (VDS), gate-source voltage (VGS), and drain current (ID). Monitoring these parameters helps prevent overheating, overvoltage, and overcurrent conditions that can damage the device.
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When selecting a gate driver for the TPC817CC9G, consider the driver's output current capability, rise and fall times, and voltage rating. Ensure the driver can provide a sufficient current to charge and discharge the gate capacitance quickly, and that it can handle the device's maximum gate-source voltage.
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To prevent electrostatic discharge (ESD) damage, use ESD-sensitive handling procedures, such as grounding wrist straps and using anti-static packaging. On the PCB, include ESD protection devices, such as TVS diodes or ESD arrays, and ensure that the device is properly connected to a ground plane.