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Part Details for TPC6110(TE85L,F,M) by Toshiba America Electronic Components
Results Overview of TPC6110(TE85L,F,M) by Toshiba America Electronic Components
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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TPC6110(TE85L,F,M) Information
TPC6110(TE85L,F,M) by Toshiba America Electronic Components is a Small Signal Field-Effect Transistor.
Small Signal Field-Effect Transistors are under the broader part category of Transistors.
A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.
Price & Stock for TPC6110(TE85L,F,M)
| Part # | Distributor | Description | Stock | Price | Buy | |
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NexGen Digital | 4 |
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RFQ |
Part Details for TPC6110(TE85L,F,M)
TPC6110(TE85L,F,M) CAD Models
TPC6110(TE85L,F,M) Part Data Attributes
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TPC6110(TE85L,F,M)
Toshiba America Electronic Components
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Datasheet
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TPC6110(TE85L,F,M)
Toshiba America Electronic Components
Trans MOSFET P-CH 30V 4.5A 6-Pin VS T/R
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | TOSHIBA CORP | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| Factory Lead Time | 32 Weeks | |
| Samacsys Manufacturer | Toshiba |
TPC6110(TE85L,F,M) Frequently Asked Questions (FAQ)
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A good PCB layout for the TPC6110 should include a solid ground plane, wide power traces, and a thermal relief pattern under the device to facilitate heat dissipation. A minimum of 2oz copper thickness is recommended.
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To ensure reliable operation in high-temperature environments, it is essential to provide adequate heat sinking, ensure good airflow, and consider derating the device's power handling capabilities. Additionally, using a thermally conductive interface material between the device and heat sink can improve thermal performance.
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Exceeding the maximum junction temperature (Tj) rating can lead to reduced device lifespan, increased thermal resistance, and potentially catastrophic failure. It is crucial to ensure that the device operates within the specified temperature range to maintain reliability and performance.
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While the TPC6110 is primarily designed for linear applications, it can be used in high-frequency switching applications with proper design considerations. However, the device's switching performance may not be optimal, and additional components may be required to ensure stable operation.
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To protect the TPC6110 from EOS and ESD, it is essential to follow proper handling and storage procedures, use ESD-safe materials, and implement protective circuitry such as TVS diodes or zener diodes in the design.