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Part Details for TPA3251D2DDV by Texas Instruments
Results Overview of TPA3251D2DDV by Texas Instruments
- Distributor Offerings: (6 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Audio and Video Systems
Entertainment and Gaming
Price & Stock for TPA3251D2DDV
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
296-42310-5-ND
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DigiKey | IC AMP CLSS D STER 220W 44HTSSOP Min Qty: 1 Lead time: 18 Weeks Container: Tube |
77 In Stock |
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$5.5261 / $9.2100 | Buy Now |
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DISTI #
595-TPA3251D2DDV
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Mouser Electronics | Audio Amplifiers 175-W stereo 350-W mono 12- to 38-V su A 595-TPA3251D2DDVR RoHS: Compliant | 180 |
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$5.4800 / $11.2300 | Buy Now |
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Bristol Electronics | 69 |
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RFQ | ||
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Bristol Electronics | Min Qty: 1 | 20 |
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$3.6960 / $7.3920 | Buy Now |
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Quest Components | 55 |
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$8.1104 / $13.1520 | Buy Now | |
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Quest Components | 16 |
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$4.9500 / $9.9000 | Buy Now |
Part Details for TPA3251D2DDV
TPA3251D2DDV CAD Models
TPA3251D2DDV Part Data Attributes
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TPA3251D2DDV
Texas Instruments
Buy Now
Datasheet
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Compare Parts:
TPA3251D2DDV
Texas Instruments
175-W stereo, 350-W mono, 12- to 38-V supply, analog input Class-D Smart Audio Amplifier 44-HTSSOP 0 to 70
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
| Part Package Code | TSSOP | |
| Package Description | HTSSOP-44 | |
| Pin Count | 44 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.33.00.01 | |
| Samacsys Manufacturer | Texas Instruments | |
| Additional Feature | IT ALSO REQUIRES PVDD=36 | |
| Consumer IC Type | CLASS D AUDIO AMPLIFIER | |
| JESD-30 Code | R-PDSO-G44 | |
| JESD-609 Code | e4 | |
| Length | 14 mm | |
| Moisture Sensitivity Level | 3 | |
| Noise Figure-Nom | 111 dB | |
| Number of Channels | 4 | |
| Number of Functions | 1 | |
| Number of Terminals | 44 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Output Power-Nom | 175 W | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HTSSOP | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Seated Height-Max | 1.2 mm | |
| Supply Current-Max | 40 mA | |
| Supply Voltage-Max (Vsup) | 13.2 V | |
| Supply Voltage-Min (Vsup) | 10.8 V | |
| Surface Mount | YES | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.635 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 6.1 mm |
TPA3251D2DDV Frequently Asked Questions (FAQ)
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TI recommends using a 10uF ceramic capacitor in parallel with a 100nF ceramic capacitor, placed as close as possible to the power pins (VIN and PVDD) to ensure stable operation.
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The gain setting depends on the specific application and desired output power. TI provides a gain setting calculator tool to help determine the optimal gain setting. Additionally, the datasheet provides a gain vs. frequency graph to help with gain selection.
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The maximum output power of the TPA3251D2DDV depends on the supply voltage and load impedance. With a 24V supply and 4Ω load, the maximum output power is approximately 100W per channel. Refer to the datasheet for more information on output power vs. supply voltage and load impedance.
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To prevent overheating, ensure good airflow around the device, use a heat sink if necessary, and monitor the device temperature using the thermal shutdown feature. The TPA3251D2DDV has a built-in thermal shutdown feature that turns off the device when the junction temperature exceeds 150°C.
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TI provides a recommended PCB layout in the datasheet, which includes guidelines for component placement, trace routing, and thermal management. Following these guidelines helps ensure optimal performance and reliability.