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Part Details for TMS5703135DPGEQQ1 by Texas Instruments
Results Overview of TMS5703135DPGEQQ1 by Texas Instruments
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Industrial Automation
Transportation and Logistics
Renewable Energy
Automotive
Robotics and Drones
TMS5703135DPGEQQ1 Information
TMS5703135DPGEQQ1 by Texas Instruments is a Microcontroller.
Microcontrollers are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for TMS5703135DPGEQQ1
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
TMS5703135DPGEQQ1-ND
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DigiKey | IC MCU 16/32BIT 3MB FLSH 144LQFP Min Qty: 60 Lead time: 18 Weeks Container: Tray | Temporarily Out of Stock |
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$25.8688 | Buy Now |
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DISTI #
595-MS5703135DPGEQQ1
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Mouser Electronics | ARM Microcontrollers - MCU 16/32 Bit RISC Flash MCU Arm Cortex-R4F RoHS: Compliant | 69 |
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$22.4900 / $31.5900 | Buy Now |
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Vyrian | Peripheral ICs | 142 |
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RFQ | |
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Win Source Electronics | IC MCU 32BIT 3MB FLASH 144LQFP / MCU 16-bit/32-bit ARM Cortex R4F RISC 3MB Flash 1.2V/3.3V Automotive 144-Pin LQFP | 245 |
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$27.4614 / $41.1921 | Buy Now |
Part Details for TMS5703135DPGEQQ1
TMS5703135DPGEQQ1 CAD Models
TMS5703135DPGEQQ1 Part Data Attributes
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TMS5703135DPGEQQ1
Texas Instruments
Buy Now
Datasheet
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Compare Parts:
TMS5703135DPGEQQ1
Texas Instruments
16/32 Bit RISC Flash MCU, Arm Cortex-R4F, FlexRay 144-LQFP -40 to 125
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
| Package Description | LQFP-144 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Samacsys Manufacturer | Texas Instruments | |
| Has ADC | YES | |
| Address Bus Width | ||
| Bit Size | 32 | |
| Boundary Scan | YES | |
| CPU Family | CORTEX-R4F | |
| Clock Frequency-Max | 80 MHz | |
| DAC Channels | NO | |
| DMA Channels | YES | |
| External Data Bus Width | ||
| Format | FLOATING POINT | |
| Integrated Cache | NO | |
| JESD-30 Code | S-PQFP-G144 | |
| JESD-609 Code | e4 | |
| Length | 20 mm | |
| Low Power Mode | YES | |
| Moisture Sensitivity Level | 3 | |
| Number of DMA Channels | 16 | |
| Number of External Interrupts | 4 | |
| Number of I/O Lines | 144 | |
| Number of Serial I/Os | 7 | |
| Number of Terminals | 144 | |
| Number of Timers | 51 | |
| On Chip Data RAM Width | 8 | |
| On Chip Program ROM Width | 8 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| PWM Channels | YES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| RAM (bytes) | 262144 | |
| ROM (words) | 3145728 | |
| ROM Programmability | FLASH | |
| Screening Level | AEC-Q100 | |
| Seated Height-Max | 1.6 mm | |
| Speed | 160 MHz | |
| Supply Current-Max | 700 mA | |
| Supply Voltage-Max | 1.32 V | |
| Supply Voltage-Min | 1.14 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 20 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |
TMS5703135DPGEQQ1 Frequently Asked Questions (FAQ)
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The recommended oscillator crystal frequency for the TMS5703135DPGEQQ1 is 16 MHz or 20 MHz, depending on the specific application and clock speed requirements.
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To configure the flash memory for optimal performance and endurance, it is recommended to use the Flash API provided by Texas Instruments, which includes functions for programming, erasing, and verifying the flash memory. Additionally, it is important to follow the guidelines for flash memory usage and wear leveling to ensure optimal performance and endurance.
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The built-in self-test (BIST) feature of the TMS5703135DPGEQQ1 has limitations in terms of coverage and detection of faults. It is recommended to use the BIST feature in conjunction with other testing methods, such as boundary scan and functional testing, to ensure comprehensive testing of the device. Additionally, it is important to follow the guidelines provided by Texas Instruments for using the BIST feature effectively.
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To implement secure boot mechanisms, it is recommended to use the security features provided by the TMS5703135DPGEQQ1, such as the Secure Hash Algorithm (SHA) and the Advanced Encryption Standard (AES). Additionally, it is important to follow the guidelines provided by Texas Instruments for implementing secure boot mechanisms, including using secure boot keys, encrypting boot code, and verifying the authenticity of the boot code.
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The TMS5703135DPGEQQ1 has a maximum operating temperature of 125°C, and it is recommended to follow the thermal management guidelines provided by Texas Instruments to ensure reliable operation in high-temperature environments. This includes using thermal interfaces, such as heat sinks and thermal pads, and ensuring good airflow around the device. Additionally, it is important to monitor the device temperature and adjust the operating frequency and voltage accordingly to prevent overheating.