Datasheets
TMS32C6415DGLZA6E3 by: Texas Instruments

Fixed-Point Digital Signal Processor 532-FCBGA

Part Details for TMS32C6415DGLZA6E3 by Texas Instruments

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TMS32C6415DGLZA6E3 Information

TMS32C6415DGLZA6E3 by Texas Instruments is a Digital Signal Processor.
Digital Signal Processors are under the broader part category of Microcontrollers and Processors.

Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.

Price & Stock for TMS32C6415DGLZA6E3

Part # Distributor Description Stock Price Buy
Vyrian Peripheral ICs 470
RFQ

Part Details for TMS32C6415DGLZA6E3

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TMS32C6415DGLZA6E3 Part Data Attributes

TMS32C6415DGLZA6E3 Texas Instruments
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TMS32C6415DGLZA6E3 Texas Instruments Fixed-Point Digital Signal Processor 532-FCBGA
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC
Part Package Code BGA
Package Description BGA-532
Pin Count 532
Reach Compliance Code not_compliant
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Additional Feature ALSO REQUIRES 3.3VI/O SUPPLY
Address Bus Width 32
Barrel Shifter NO
Bit Size 32
Boundary Scan YES
Clock Frequency-Max 75.18 MHz
External Data Bus Width 64
Format FIXED POINT
Internal Bus Architecture MULTIPLE
JESD-30 Code S-PBGA-B532
JESD-609 Code e0
Length 23 mm
Low Power Mode YES
Moisture Sensitivity Level 4
Number of Terminals 532
Operating Temperature-Max 105 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code HFBGA
Package Equivalence Code BGA532,26X26,32
Package Shape SQUARE
Package Style GRID ARRAY, HEAT SINK/SLUG, FINE PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
RAM (words) 16384
Seated Height-Max 3.3 mm
Supply Voltage-Max 1.44 V
Supply Voltage-Min 1.36 V
Supply Voltage-Nom 1.4 V
Surface Mount YES
Technology CMOS
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 23 mm
uPs/uCs/Peripheral ICs Type DIGITAL SIGNAL PROCESSOR, OTHER

TMS32C6415DGLZA6E3 Related Parts

TMS32C6415DGLZA6E3 Frequently Asked Questions (FAQ)

  • The recommended power-up sequence is to apply VDD (core voltage) first, followed by VDDA (analog voltage), and then the clock signal. This ensures proper initialization of the device.

  • To configure the EMIF for optimal performance, ensure that the memory timing parameters (e.g., clock frequency, latency, and burst length) are set according to the memory device specifications. Additionally, use the EMIF configuration registers to optimize the interface for the specific memory type and access pattern.

  • The maximum operating frequency of the TMS320C6415DGLZA6E3 is 1 GHz. However, the actual operating frequency may be limited by the specific application, board design, and thermal considerations.

  • The TMS320C6415DGLZA6E3 has a built-in watchdog timer module. To implement a watchdog timer, configure the watchdog timer registers to set the timeout period, enable the timer, and define the reset behavior. Additionally, ensure that the watchdog timer is periodically reset or reloaded to prevent a timeout.

  • The TCK pin is used for boundary scan testing and debugging. It is not required for normal device operation. If not used, the TCK pin should be tied to a static logic level (either high or low) to prevent unwanted device behavior.

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