Datasheets
TMS320VC5471ZHKA by: Texas Instruments

System-Level Digital Signal Processor 257-BGA MICROSTAR

Part Details for TMS320VC5471ZHKA by Texas Instruments

Results Overview of TMS320VC5471ZHKA by Texas Instruments

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TMS320VC5471ZHKA Information

TMS320VC5471ZHKA by Texas Instruments is a Digital Signal Processor.
Digital Signal Processors are under the broader part category of Microcontrollers and Processors.

Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.

Price & Stock for TMS320VC5471ZHKA

Part # Distributor Description Stock Price Buy
Vyrian Peripheral ICs 208
RFQ

Part Details for TMS320VC5471ZHKA

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TMS320VC5471ZHKA Part Data Attributes

TMS320VC5471ZHKA Texas Instruments
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TMS320VC5471ZHKA Texas Instruments System-Level Digital Signal Processor 257-BGA MICROSTAR
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC
Part Package Code BGA
Package Description LFBGA, BGA257,19X19,32
Pin Count 257
Reach Compliance Code compliant
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Additional Feature ALSO REQUIRES 3.3V SUPPLY FOR I/O SUPPLY
Address Bus Width 23
Barrel Shifter NO
Bit Size 16
Boundary Scan YES
Clock Frequency-Max 100 MHz
External Data Bus Width 32
Format FIXED POINT
Internal Bus Architecture MULTIPLE
JESD-30 Code S-PBGA-B257
JESD-609 Code e1
Length 16 mm
Low Power Mode YES
Moisture Sensitivity Level 3
Number of Terminals 257
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code LFBGA
Package Equivalence Code BGA257,19X19,32
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
RAM (words) 16384
Seated Height-Max 1.4 mm
Supply Voltage-Max 1.95 V
Supply Voltage-Min 1.71 V
Supply Voltage-Nom 1.8 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 16 mm
uPs/uCs/Peripheral ICs Type DIGITAL SIGNAL PROCESSOR, MIXED

Alternate Parts for TMS320VC5471ZHKA

This table gives cross-reference parts and alternative options found for TMS320VC5471ZHKA. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TMS320VC5471ZHKA, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
TMS320VC5471ZHK Texas Instruments Check for Price System-Level Digital Signal Processor 257-BGA MICROSTAR TMS320VC5471ZHKA vs TMS320VC5471ZHK

TMS320VC5471ZHKA Related Parts

TMS320VC5471ZHKA Frequently Asked Questions (FAQ)

  • The recommended power-up sequence is to apply VDD (1.2V to 1.4V) first, followed by VIO (1.8V to 3.3V) and then the clock signal. This ensures proper device operation and prevents latch-up.

  • To optimize the clock tree, use a clock buffer (such as the CDCM6201) to reduce clock skew and jitter. Additionally, ensure that the clock signal is routed close to the device and that the clock trace is short and impedance-controlled.

  • The maximum operating temperature range for the TMS320VC5471ZHKA is -40°C to 85°C. However, it's recommended to operate the device within the industrial temperature range of -40°C to 70°C for optimal performance and reliability.

  • A reliable reset circuit can be implemented using a voltage supervisor (such as the TLV7031) that monitors the VDD voltage and asserts a reset signal when VDD falls below a certain threshold. This ensures that the device is properly reset during power-up and power-down sequences.

  • Recommended PCB layout guidelines include using a solid ground plane, routing critical signals (such as clock and reset) on inner layers, and using decoupling capacitors (such as 0.1uF and 10uF) to filter power supply noise. Additionally, ensure that the device is placed in a thermally efficient location to prevent overheating.

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