Part Details for TMS320C6727ZDH250 by Rochester Electronics LLC
Results Overview of TMS320C6727ZDH250 by Rochester Electronics LLC
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
TMS320C6727ZDH250 Information
TMS320C6727ZDH250 by Rochester Electronics LLC is a Digital Signal Processor.
Digital Signal Processors are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Part Details for TMS320C6727ZDH250
TMS320C6727ZDH250 CAD Models
TMS320C6727ZDH250 Part Data Attributes
|
TMS320C6727ZDH250
Rochester Electronics LLC
Buy Now
Datasheet
|
Compare Parts:
TMS320C6727ZDH250
Rochester Electronics LLC
32-BIT, 25MHz, OTHER DSP, PBGA256, 17 X 17 MM, 1 MM PITCH, GREEN, PLASTIC, BGA-256
|
Pbfree Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | ROCHESTER ELECTRONICS LLC | |
Part Package Code | BGA | |
Package Description | 17 X 17 MM, 1 MM PITCH, GREEN, PLASTIC, BGA-256 | |
Pin Count | 256 | |
Reach Compliance Code | unknown | |
Additional Feature | 32 BIT FLOATING POINT; ALSO REQUIRES 3.3V SUPPLY | |
Address Bus Width | 32 | |
Barrel Shifter | NO | |
Boundary Scan | YES | |
Clock Frequency-Max | 25 MHz | |
External Data Bus Width | 32 | |
Format | FLOATING POINT | |
Internal Bus Architecture | MULTIPLE | |
JESD-30 Code | S-PBGA-B256 | |
JESD-609 Code | e1 | |
Length | 17 mm | |
Low Power Mode | NO | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 256 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | COMMERCIAL | |
Seated Height-Max | 2.02 mm | |
Supply Voltage-Max | 1.32 V | |
Supply Voltage-Min | 1.14 V | |
Supply Voltage-Nom | 1.2 V | |
Surface Mount | YES | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 17 mm | |
uPs/uCs/Peripheral ICs Type | DIGITAL SIGNAL PROCESSOR, OTHER |