Datasheets
TMS320C6201GJC200 by: Texas Instruments

Fixed-Point Digital Signal Processor 352-FCBGA 0 to 90

Part Details for TMS320C6201GJC200 by Texas Instruments

Results Overview of TMS320C6201GJC200 by Texas Instruments

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TMS320C6201GJC200 Information

TMS320C6201GJC200 by Texas Instruments is a Digital Signal Processor.
Digital Signal Processors are under the broader part category of Microcontrollers and Processors.

Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.

Price & Stock for TMS320C6201GJC200

Part # Distributor Description Stock Price Buy
Bristol Electronics   402
RFQ
Bristol Electronics   1
RFQ
Quest Components IC,DSP,32-BIT,CMOS,BGA,352PIN,PLASTIC 4
  • 1 $197.4450
  • 2 $187.5728
  • 4 $177.7005
$177.7005 / $197.4450 Buy Now
Quest Components IC,DSP,32-BIT,CMOS,BGA,352PIN,PLASTIC 2
  • 1 $120.3000
  • 3 $114.2850
$114.2850 / $120.3000 Buy Now
Quest Components IC,DSP,32-BIT,CMOS,BGA,352PIN,PLASTIC 1
  • 1 $129.9200
$129.9200 Buy Now
ComSIT USA FIXED-POINT DIGITAL SIGNAL PROCESSOR Digital Signal Processor, 32-Bit Size, 32-Ext Bit, 200MHz, CMOS, PBGA352 ECCN: 3A991.A.2 RoHS: Not Compliant Stock DE - 2
Stock ES - 22
Stock US - 0
Stock MX - 0
Stock CN - 0
Stock HK - 0
RFQ
Velocity Electronics Our Stock 168
RFQ
Chip 1 Exchange INSTOCK 145
RFQ
Vyrian Peripheral ICs 1555
RFQ

Part Details for TMS320C6201GJC200

TMS320C6201GJC200 CAD Models

TMS320C6201GJC200 Part Data Attributes

TMS320C6201GJC200 Texas Instruments
Buy Now Datasheet
Compare Parts:
TMS320C6201GJC200 Texas Instruments Fixed-Point Digital Signal Processor 352-FCBGA 0 to 90
Pbfree Code Yes
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC
Part Package Code BGA
Package Description BGA-352
Pin Count 352
Reach Compliance Code not_compliant
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Samacsys Manufacturer Texas Instruments
Additional Feature ALSO REQUIRES 3.3V SUPPLY
Address Bus Width 22
Barrel Shifter NO
Bit Size 32
Boundary Scan YES
Clock Frequency-Max 200 MHz
External Data Bus Width 32
Format FIXED POINT
Integrated Cache YES
Internal Bus Architecture MULTIPLE
JESD-30 Code S-PBGA-B352
JESD-609 Code e0
Length 35 mm
Low Power Mode YES
Moisture Sensitivity Level 4
Number of DMA Channels 4
Number of External Interrupts 4
Number of Terminals 352
Number of Timers 2
Operating Temperature-Max 90 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA352,26X26,50
Package Shape SQUARE
Package Style GRID ARRAY
Peak Reflow Temperature (Cel) 220
Qualification Status Not Qualified
RAM (words) 16384
Seated Height-Max 3.5 mm
Supply Voltage-Max 1.89 V
Supply Voltage-Min 1.71 V
Supply Voltage-Nom 1.8 V
Surface Mount YES
Technology CMOS
Temperature Grade OTHER
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 20
Width 35 mm
uPs/uCs/Peripheral ICs Type DIGITAL SIGNAL PROCESSOR, OTHER

Alternate Parts for TMS320C6201GJC200

This table gives cross-reference parts and alternative options found for TMS320C6201GJC200. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TMS320C6201GJC200, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
TMS320C6201GJCA200 Texas Instruments $184.1989 Fixed-Point Digital Signal Processor 352-FCBGA -40 to 105 TMS320C6201GJC200 vs TMS320C6201GJCA200

TMS320C6201GJC200 Related Parts

TMS320C6201GJC200 Frequently Asked Questions (FAQ)

  • The recommended power-on sequence is to apply VDD (1.8V) first, followed by VIO (3.3V) and then the clock signal. This ensures proper device initialization and prevents latch-up.

  • To optimize performance, consider using the device's cache, optimizing code for the VLIW (Very Long Instruction Word) architecture, and using the EDMA (Enhanced Direct Memory Access) controller to offload data transfers. Additionally, use the device's built-in profiling tools to identify performance bottlenecks.

  • The device has a maximum junction temperature of 125°C. Ensure proper heat sinking and thermal management to prevent overheating. Use thermal interface materials, heat sinks, and fans as needed to maintain a safe operating temperature.

  • Follow proper PCB design and layout guidelines to minimize electromagnetic interference (EMI). Use shielding, filtering, and grounding techniques to reduce emissions and improve immunity. Ensure compliance with relevant EMC standards and regulations.

  • The device is rated for industrial temperature range (-40°C to 85°C). For harsh environments, consider using conformal coating, potting, or hermetic sealing to protect the device from moisture, vibration, and other environmental stresses.

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